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    • 4. 发明申请
    • SEMICONDUCTOR INSPECTION SYSTEM
    • 半导体检测系统
    • US20140219545A1
    • 2014-08-07
    • US14234977
    • 2012-07-20
    • Akiyuki SugiyamaYuichi Abe
    • Akiyuki SugiyamaYuichi Abe
    • G06T7/00
    • G06T7/001G01B15/08H01L22/12H01L2924/0002H01L2924/00
    • When the lengths of FEM wafers are automatically measured, not only the sizes of targets, the lengths of which are to be measured, are often varied from those in registration, but also the patterns of the targets are often deformed. Therefore, it is difficult to automatically determine whether the length measurement is possible or not. Therefore, the following are executed with a semiconductor inspection system: (1) a process of identifying the position of the contour line of an inspected image using a distance image calculated from a reference image, (2) a process of calculating a defect size image based on the position of the contour line with respect to the identified distance image, and detecting a defect candidate from the defect size image, and (3-1) a process of, upon detection of the defect candidate, calculating the size of the detected defect candidate, or (3-2) a process of detecting a portion different between the first and second contour lines as the defect candidate.
    • 当自动测量有限元晶片的长度时,不仅要测量其长度的目标的尺寸通常与注册的尺寸不同,而且目标的图案也经常变形。 因此,难以自动确定长度测量是否可行。 因此,使用半导体检查系统执行以下操作:(1)使用从参考图像计算的距离图像来识别被检查图像的轮廓线的位置的处理,(2)计算缺陷尺寸图像的处理 基于所述轮廓线相对于所识别的距离图像的位置,以及从所述缺陷尺寸图像检测缺陷候选,以及(3-1)在检测到所述缺陷候选时,计算所检测到的所述缺陷候选的大小的处理 缺陷候选者,或(3-2)检测第一和第二轮廓线之间的部分的缺陷候选的处理。
    • 5. 发明申请
    • PATTERN MATCHING APPARATUS AND COMPUTER PROGRAM
    • 图案匹配装置和计算机程序
    • US20140023265A1
    • 2014-01-23
    • US13981963
    • 2011-12-07
    • Masahiro KitazawaMitsuji IkedaYuichi AbeJunichi TaguchiWataru Nagatomo
    • Masahiro KitazawaMitsuji IkedaYuichi AbeJunichi TaguchiWataru Nagatomo
    • G06T7/00
    • G06T7/0004G06T7/001G06T2207/10061G06T2207/30148H01L22/12
    • It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.The semiconductor inspection apparatus includes means for imaging a shape on a wafer or on an exposure mask; means for storing an image inspected by the imaging means; means for storing design data of the semiconductor circuit corresponding to a position on the wafer or on the exposure mask which are to be imaged by the imaging means; means for storing a design-data image obtained as a result of converting the design data into an image; means for generating a design-data ROI image by converting an interest drawing region found from a relative crude-density relation of a shape included in the design-data image into an image; and a position alignment section configured to carry out position alignment on the inspected image and the design-data image. The semiconductor inspection apparatus makes use of the design-data ROI image in order to identify a position at which the inspected image and the design-data image match each other or compute the degree of coincidence.
    • 本发明的目的是提供一种半导体检查装置,即使被检查的图像是图像,也能够良好地执行位置对准并且正确地确定位置对准是否已经成功地执行或者在没有操作者干预的情况下已经结束 具有与重复图案的情况相同的特性,或被检查图像是具有复杂形状的图像。 半导体检查装置包括用于对晶片或曝光掩模上的形状进行成像的装置; 用于存储由成像装置检查的图像的装置; 用于存储对应于要由成像装置成像的晶片或曝光掩模上的位置的半导体电路的设计数据的装置; 用于存储作为将设计数据转换为图像而获得的设计数据图像的装置; 用于通过将从所述设计数据图像中包含的形状的相对粗密度关系中找到的兴趣绘制区域转换为图像来生成设计数据ROI图像的装置; 以及位置对准部,被配置为在被检查图像和设计数据图像上执行位置对准。 半导体检查装置利用设计数据ROI图像来识别被检查图像和设计数据图像彼此匹配的位置或计算符合度。
    • 6. 发明申请
    • DEVICE AND METHOD FOR DETECTING ANGLE OF ROTATION FROM NORMAL POSITION OF IMAGE
    • 用于检测图像正常位置的旋转角的装置和方法
    • US20140016824A1
    • 2014-01-16
    • US14005913
    • 2011-11-09
    • Jun'ichi TaguchiMitsuji IkedaYuichi AbeMasahiro Kitazawa
    • Jun'ichi TaguchiMitsuji IkedaYuichi AbeMasahiro Kitazawa
    • G06T7/00
    • G06T7/0004G06K9/3275
    • An evaluation value indicative of the extent of lines in each direction is calculated for a pre-processed image in which 0s are filled in and extended in the lateral direction of the inputted image and which has been reduced ⅛th in the longitudinal direction. To obtain the angle of rotation of an image from the change in the evaluation value obtained while the angle relative to the lateral direction of the pre-processed image is modified in small steps, a parallel line is drawn for each direction, a projection is taken, and the sum of squares serves as the evaluation value of the direction. The direction having the highest evaluation value serves as the obtained direction of rotation from the normal position. The projection of each direction references the point of intersection between the parallel line drawn for each direction and the coordinate line of the horizontal axis.
    • 对于其中0被填充并在输入图像的横向方向上延伸并且在纵向方向上减少1/8的预处理图像来计算指示每个方向的行程度的评估值。 为了在以小步骤修改相对于预处理图像的横向方向的角度获得的评估值的变化中获得图像的旋转角度,对于每个方向绘制平行线,进行投影 ,并且平方和作为方向的评价值。 具有最高评估值的方向用作从正常位置获得的旋转方向。 每个方向的投影参考在每个方向绘制的平行线与水平轴的坐标线之间的交点。