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    • 1. 发明授权
    • Manufacturing method of semiconductor integrated circuit devices and mask manufacturing methods
    • 半导体集成电路器件的制造方法和掩模制造方法
    • US06548312B1
    • 2003-04-15
    • US09640721
    • 2000-08-18
    • Katsuya HayanoNorio HasegawaAkira ImaiNaoko AsaiEiji TsujimotoTakahiro Watanabe
    • Katsuya HayanoNorio HasegawaAkira ImaiNaoko AsaiEiji TsujimotoTakahiro Watanabe
    • H01L2100
    • G03F7/70433
    • In order to inhibit or prevent a pattern abnormality such as the deformation or misalignment of a pattern of a semiconductor integrated circuit device, a light intensity is calculated based on the pattern data DBP of a mask and the aberration data DBL of a lens of a pattern exposure device (step 101) and then the results of the light intensity calculation is compared with the results of the light intensity calculated on condition that the lens of the pattern exposure device has no aberration (step 102), and then a pattern data exceeding an allowable level, of the pattern data of the mask, is corrected according to the amount of correction calculated on the basis of the results of the comparison such that the pattern data does not exceed the allowable level (step 104). The mask is manufactured by using the mask making data DBM after the correction and then is mounted on the pattern exposure device to transfer a predetermined pattern to a semiconductor wafer.
    • 为了抑制或防止诸如半导体集成电路器件的图案的变形或未对准的图案异常,基于掩模的图案数据DBP和图案的透镜的像差数据DBL计算光强度 曝光装置(步骤101),然后将光强度计算的结果与在图案曝光装置的透镜没有像差的条件下计算的光强度的结果进行比较(步骤102),然后模式数据超过 根据比较结果计算出的校正量,使图案数据不超过允许值(步骤104),对掩模的图案数据的允许电平进行校正。 通过在校正后使用掩模制作数据DBM来制造掩模,然后安装在图案曝光装置上以将预定图案转印到半导体晶片。