会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • COATING SOLUTION SUPPLY APPARATUS
    • 涂料溶液供应装置
    • US20090183676A1
    • 2009-07-23
    • US12349722
    • 2009-01-07
    • Hiroyuki FUJIIKazuhiro Nishijima
    • Hiroyuki FUJIIKazuhiro Nishijima
    • B05C5/02
    • H01L21/6715
    • A coating solution supply apparatus of the present invention has a closed-type coating solution supply source which stores the coating solution therein; a supply pipe for supplying the coating solution from the coating solution supply source to the coating nozzle; and a pump which is provided along the supply pipe and pressure-feeds the coating solution to the coating nozzle, wherein an inside of the coating solution supply source is pressurized to a predetermined pressure by supply of an inert gas to prevent the inside of the coating solution supply source from being brought to a negative pressure even when the pump is operated to pressure-feed the coating solution to the coating nozzle.
    • 本发明的涂布液供给装置具有封闭型涂布液供给源,其在其中储存涂布溶液; 供给管,用于将涂布溶液从涂布液供给源供给到喷嘴; 以及泵,其沿着供给管设置并将涂布溶液加压到涂布喷嘴,其中通过供给惰性气体将涂布液供给源的内部加压至预定压力,以防止涂层内部 即使当泵被操作以将涂布溶液加压到涂布喷嘴时,溶液供应源也被带到负压。
    • 5. 发明授权
    • Substrate processing method
    • 基板加工方法
    • US06878401B2
    • 2005-04-12
    • US10255581
    • 2002-09-27
    • Kazuhiro NishijimaTsuyoshi Mizuno
    • Kazuhiro NishijimaTsuyoshi Mizuno
    • H01L21/00B05D1/02
    • H01L21/6715
    • A specific amount of a processing solution is supplied on a wafer by spraying the processing solution from a first end (tip) of a nozzle. The solution surface of the processing solution remaining in the nozzle is sucked back to a second end side of the nozzle by aspirating the remaining processing solution to the second end side. The first end of the nozzle is then soaked into a fluid. The processing solution remaining in the nozzle is aspirated to the second end side to aspirate a specific amount of the fluid into the first end of the nozzle for further sucking back the solution surface of the processing solution to the second end side, thus the solution surface of the processing solution being not touching the fluid.
    • 通过从喷嘴的第一端(尖端)喷射处理溶液,在晶片上提供特定量的处理溶液。 残留在喷嘴中的处理溶液的溶液表面通过将剩余的处理溶液吸入第二端侧被吸回到喷嘴的第二端侧。 然后将喷嘴的第一端浸入流体中。 将残留在喷嘴中的处理液吸入第二端侧,将特定量的流体吸入喷嘴的第一端,以进一步将处理溶液的溶液表面吸回到第二端侧,从而溶液表面 的处理溶液不接触流体。
    • 9. 发明申请
    • Process For Producing Aramid Silicone Polymer
    • 制备芳纶硅酮聚合物的方法
    • US20120271024A1
    • 2012-10-25
    • US13500269
    • 2010-09-28
    • Kazuhiro NishijimaTadashi Okawa
    • Kazuhiro NishijimaTadashi Okawa
    • C08G77/06
    • C08G77/455C09D183/10
    • The present invention relates to a process for producing an aramid silicone polymer. The present invention is characterized by reacting (A) a both-terminal amino-modified diorganopolysiloxane having a group represented by the following formula: —B—NH2 wherein B represents a divalent hydrocarbon group, at both terminals of a molecular chain, (B) an aromatic diamine, and (C) an aromatic dicarboxylic acid dihalide, in the presence of (D) an inorganic base, in (S1) water and (S2) an aprotic organic solvent, at a temperature of 10° C. or more. The present invention does not have to be carried out at a low temperature, and by-products can be easily treated. Furthermore, the present invention does not require a large amount of a reprecipitation solvent, and therefore it can be suitably used in mass production of an aramid silicone polymer.
    • 本发明涉及芳族聚酰胺硅氧烷聚合物的制备方法。 本发明的特征在于:(A)具有由下式表示的基团的双末端氨基改性二有机聚硅氧烷:B-NH 2,其中B表示二价烃基,在分子链的两个末端,(B) 芳族二胺和(C)芳族二羧酸二卤化物,在(D)无机碱存在下,在(S1)水中和(S2)非质子性有机溶剂中,在10℃以上的温度下进行。 本发明不必在低温下进行,副产物可以容易地处理。 此外,本发明不需要大量的再沉淀溶剂,因此可以适当地用于大量生产芳族聚酰胺硅氧烷聚合物。