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    • 2. 发明授权
    • Method for surface treatment
    • 表面处理方法
    • US07147795B2
    • 2006-12-12
    • US10953879
    • 2004-09-29
    • Hiroshi KoedaKatsuji ArakawaKazufumi Oya
    • Hiroshi KoedaKatsuji ArakawaKazufumi Oya
    • B44C1/22
    • H01L21/6838Y10T29/49822Y10T29/53274Y10T29/53683
    • A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface treatment apparatus 1 are conveyed to the inside of a decompression chamber to decompress a plurality of concave portions 32 (enclosed spaces); a second step in which the surface treatment apparatus 1 and the substrate 10 are brought out from the inside of the decompression chamber to environment under atmospheric pressure in a state where the substrate 10 is being attracted to the surface treatment apparatus 1 with the use of a difference between negative pressure inside the concave portions 32 and atmospheric pressure; and a third step in which the surface treatment is carried out to a back surface 101 of the substrate 10 with the substrate 10 being attracted by the surface treatment apparatus 1.
    • 表面处理方法包括:第一步骤,其中表面处理装置1和基板10处于基板10的前表面102面向表面处理装置1的状态,被输送到减压室的内部以减压 多个凹部32(封闭空间); 在基板10被吸引到表面处理装置1的状态下,使用表面处理装置1和基板10从压缩室的内部脱离到大气压环境的第二步骤 凹部32内的负压与大气压的差; 以及第三步骤,其中基板10被表面处理装置1吸引而进行到基板10的背面101的表面处理。
    • 5. 发明申请
    • Surface treatment apparatus
    • 表面处理装置
    • US20050115679A1
    • 2005-06-02
    • US10953871
    • 2004-09-29
    • Ryuichi KurosawaFumio TakagiHiroshi KoedaKazufumi OyaKatsuji Arakawa
    • Ryuichi KurosawaFumio TakagiHiroshi KoedaKazufumi OyaKatsuji Arakawa
    • H01L21/02C23F1/08H01L21/306H01L21/683C23F1/00
    • H01L21/6838C23F1/08
    • A surface treatment apparatus 1 is constructed to hold a substrate 10 when surface treatment is carried out to a back surface 101 of the substrate 10. The surface treatment apparatus 1 includes at least one enclosed space each defined by a concave portion 32 and a front surface 102 of the substrate 10; and an O-ring 2 (contact portion) adapted to hermetically contact with the front surface 102 of the substrate 10 to produce negative pressure in cooperation with the O-ring 2 and the front surface 102 of the substrate 10. The surface treatment apparatus 1 is constructed so that the substrate 10 is attracted onto the surface treatment apparatus 1 using a difference between the negative pressure and atmospheric pressure by decompressing the enclosed space in a decompression chamber and then bringing out the substrate 10 from the inside of the decompression chamber to environment under atmospheric pressure.
    • 当对基板10的背面101进行表面处理时,表面处理装置1被构造成保持基板10。 表面处理装置1包括由凹部32和基板10的前表面102限定的至少一个封闭空间; 以及适于与基板10的前表面102气密接触以产生与O形环2和基板10的前表面102协作的负压的O形环2(接触部分)。 表面处理装置1被构造成使得通过减压减压室中的封闭空间将衬底10从负压和大气压之间的差异吸引到表面处理装置1上,然后从衬底10的内部引出衬底10 减压室在大气压下环境。