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1. 发明申请

US20100092692A1 METHOD AND DEVICE FOR COATING SUBSTRATES 审中-公开
标题翻译：用于涂覆基材的方法和装置
公开(公告)号：US20100092692A1
公开(公告)日：2010-04-15
申请号：US12312999
申请日：2007-11-15
申请人： Karl-Heinz Dulle , Ulf-Steffen Baeumer , Randolf Kiefer , Peter Woltering , Dirk Hoormann , Stefan Oelmann , Joachim-H. Hoedtke , Oliver Kayser
发明人： Karl-Heinz Dulle , Ulf-Steffen Baeumer , Randolf Kiefer , Peter Woltering , Dirk Hoormann , Stefan Oelmann , Joachim-H. Hoedtke , Oliver Kayser
IPC分类号： C23C16/50 , C23C16/00 , C23C14/34
CPC分类号： C23C14/024 , C23C14/566
摘要： The invention relates to a method for coating one or more sides of substrates with catalytically active material, comprising material deposition under vacuum in a vacuum chamber, wherein the following steps are performed: (a) loading the vacuum chamber with at least one substrate, (b) closing and evacuating the vacuum chamber, (c) cleaning the substrate by introducing a gaseous reducing agent into the vacuum chamber, (d) increasing the size of the substrate surface by depositing a vaporous component on the substrate surface, (e) coating by a coating process taken from the group of plasma coating processes, physical gas deposition, sputtering processes or the like, wherein one or more metals and/or alkaline and/or earth alkaline metals or their oxides are applied to the surface of the substrate. This method may be used, for example, for coating electrodes which are used in the chlor-alkali electrolysis.
摘要翻译：本发明涉及一种用催化活性材料涂覆一层或多层衬底的方法，包括在真空室中真空沉积材料，其中执行以下步骤：（a）用至少一个衬底装载真空室，（b）关闭并排空真空室，（c）通过将气态还原剂引入真空室来清洁基板;（d）通过在基板表面上沉积气态成分来增加基板表面的尺寸，（e）涂层通过从等离子体涂覆工艺，物理气体沉积，溅射工艺等组中获得的涂覆工艺，其中将一种或多种金属和/或碱土金属和/或碱土金属或其氧化物施加到基材的表面。该方法可以用于例如用于氯碱电解中的涂覆电极。

2. 发明申请

US20130146445A1 PROCESS FOR COATING A SUBSTRATE BY MEANS OF AN ARC 审中-公开
标题翻译：通过电弧涂覆基板的方法
公开(公告)号：US20130146445A1
公开(公告)日：2013-06-13
申请号：US13808577
申请日：2011-07-12
申请人： Oliver Kayser
发明人： Oliver Kayser
IPC分类号： C23C14/32
CPC分类号： C23C14/325 , C23C14/0021 , C25B11/00 , H01J37/32055 , H01J37/3244 , H01J37/32568 , H01J37/32614 , H01J2237/332
摘要： The invention relates to a process and an evaporator for coating a substrate by means of an arc in a vacuum chamber (10) in the case of low-pressure arc evaporation, wherein the vacuum chamber (10) has at least one evaporator, which comprises a target material (20), reactive gas supply lines (53, 54) for supplying reactive gas, and a vacuum pump, wherein the evaporator comprising the target material (20) serves as the cathode and the inner wall (36) of the vacuum chamber (10) serves as the anode between which the arc is generated. According to the invention, high-melting point metal is used as the target material (20) for catalysis, and the pressure in the vacuum chamber (20) during coating is at least 0.5 Pa, in particular at least 3 Pa, preferably 5 Pa. A layer of catalytically active metal having a high oxygen content is formed on the substrate.
摘要翻译：本发明涉及一种用于在低压电弧蒸发的情况下通过真空室（10）中的电弧涂覆衬底的工艺和蒸发器，其中真空室（10）具有至少一个蒸发器，其包括目标材料（20），用于供应反应性气体的反应气体供应管线（53,54）和真空泵，其中包括目标材料（20）的蒸发器用作阴极和真空的内壁（36）室（10）用作产生电弧的阳极。根据本发明，使用高熔点金属作为催化剂的目标材料（20），并且涂覆期间真空室（20）中的压力为至少0.5Pa，特别是至少3Pa，优选5Pa 在衬底上形成具有高氧含量的催化活性金属层。

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