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    • 1. 发明授权
    • Antenna device
    • 天线设备
    • US09190732B2
    • 2015-11-17
    • US13428573
    • 2012-03-23
    • Hirotaka FujiiEiichi KobayashiKaoru SudoToshiro Hiratsuka
    • Hirotaka FujiiEiichi KobayashiKaoru SudoToshiro Hiratsuka
    • H01Q1/38H01Q9/38H01Q9/04H01Q1/48
    • H01Q9/0414H01Q1/38H01Q1/48
    • A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.
    • 芯片天线安装在包括馈电线的母基板上。 在代表性的实施例中,芯片天线包括具有多个绝缘层的层压体,辐射导体元件,寄生导体元件,耦合调节导体板和LGA。 辐射导体元件通过LGA的第一扁平电极焊盘连接到馈电线。 另一方面,耦合调节导体板设置在辐射导体元件和寄生导体元件之间,耦合调节导体板的两端侧连接到LGA的第二和第三平面电极焊盘。 另一代表性实施例不包括层压体中的耦合调节导体板,并且包括可以包括第二和第三平坦电极焊盘的LGA,或者可以不包括第二和第三扁平电极焊盘。