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1. 发明专利

JP2012072440A Electroless plating method 审中-公开
标题翻译：电镀法
公开(公告)号：JP2012072440A
公开(公告)日：2012-04-12
申请号：JP2010218073
申请日：2010-09-29
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Toagosei Co Ltd , 東亞合成株式会社 , 株式会社関東学院大学表面工学研究所
发明人： HIRAOKA HIDEKI , KANBE SHINYA , HORIE YOJI , HONMA HIDEO , WATANABE MITSUHIRO , SAITO YUICHI
IPC分类号： C23C18/30 , H01L21/288 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating method, which can ensure good adhesion between a plating film and a workpiece without using any noble metal such as palladium and without using any harmful chemical such as chromic acid and can permit repeated use of a plating solution.SOLUTION: The electroless plating method includes: a step (1) of applying a polymer containing, as side chains, organic residues having the ability to reduce metallic ions of a plating metal onto the surface of a workpiece; a step (2) of depositing a partially reduced metal oxide of the metal ion on the surface of the workpiece with the applied polymer in a solution containing the metallic ions but not containing a reducing agent capable of reducing the metallic ions; a step (3) of reducing the partially reduced metal oxide into a self-catalytic plating metal in a solution containing a reducing agent capable of reducing the metal ions; and a step (4) of forming a coat of the plating metal on the surface of the workpiece in an electroless plating solution.
摘要翻译：要解决的问题：提供一种化学镀方法，其可以在不使用任何贵金属如钯并且不使用任何有害化学物质如铬酸的情况下确保镀膜和工件之间的良好粘附，并且可以重复使用的电镀液。解决方案：化学镀方法包括：将包含作为侧链的聚合物的聚合物施加到具有将电镀金属的金属离子还原到工件表面的能力的有机残余物的步骤（1）将所述金属离子的部分还原的金属氧化物沉积在所述工件的表面上，使所述涂覆的聚合物在含有所述金属离子但不包含能够还原金属离子的还原剂的溶液中; 在含有能够还原金属离子的还原剂的溶液中将部分还原的金属氧化物还原成自催化电镀金属的步骤（3）以及在化学镀溶液中在工件的表面上形成电镀金属的涂层的工序（4）。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011225929A Catalyst solution used in electroless plating method, method for preparing the catalyst solution, electroless plating method using the catalyst solution, and plated product with metal layer including metallic film formed by using the electroless plating method 有权
标题翻译：用于电沉积方法的催化剂溶液，用于制备催化剂溶液的方法，使用催化剂溶液的电沉积方法以及包含通过使用电沉积方法形成的金属膜的金属层的产品
公开(公告)号：JP2011225929A
公开(公告)日：2011-11-10
申请号：JP2010096460
申请日：2010-04-19
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , 株式会社関東学院大学表面工学研究所
发明人： HONMA HIDEO , WATANABE MITSUHIRO
IPC分类号： C23C18/28 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a catalyst solution which is used in an electroless plating method, the catalyst solution showing a good catalytic action and forming a copper catalyst nucleus which contains no metallic component such as palladium and tin having large specific resistance.SOLUTION: In order to solve the problem, the catalyst solution, which contains cuprous ion, hypophosphorous acid ion and chlorine ion and whose pH is 6.0-8.5, is employed. In the catalyst solution, the hypophosphorous acid stabilizes the existence of the cuprous ion. Accordingly, when a material to be plated is treated with the catalyst solution, the cuprous ion is uniformly adsorbed on the surface of the material to be plated. The cuprous ion, which is adsorbed on the material to be plated, becomes a catalyst nucleus of metal copper, when it is subjected to reduction treatment, to show a good catalytic action to an electroless plating solution. Further, by using this catalyst solution, a metallic component is prevented from remaining on the surface of a base material posterior to wire processing as in the case that a palladium catalyst is used. Consequently, even if fine pitch wiring is formed, high insulation reliability is maintained.
摘要翻译：要解决的问题：为了提供一种用于无电镀方法的催化剂溶液，催化剂溶液显示出良好的催化作用并形成不含金属组分如铜和锡的电阻率大的铜催化剂核。解决方案：为了解决这个问题，采用含有亚硝酸根离子，次磷酸离子和氯离子，其pH为6.0-8.5的催化剂溶液。在催化剂溶液中，次磷酸稳定了亚铜离子的存在。因此，当用催化剂溶液处理待镀覆的材料时，亚铜离子被均匀地吸附在被镀材料的表面上。吸附在被镀材料上的亚铁离子当进行还原处理时，成为金属铜的催化剂核，对化学镀溶液表现出良好的催化作用。此外，通过使用该催化剂溶液，如使用钯催化剂的情况那样，防止金属成分残留在线材加工后的基材的表面。因此，即使形成细间距布线，仍然保持高的绝缘可靠性。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2010251899A Metal composite material of electromagnetic wave transparency and method for manufacturing the same 有权
标题翻译：电磁波透明金属复合材料及其制造方法
公开(公告)号：JP2010251899A
公开(公告)日：2010-11-04
申请号：JP2009096974
申请日：2009-04-13
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Kanto Kasei Kogyo Kk , Sankei Giken Kogyo Co Ltd , 三恵技研工業株式会社 , 株式会社関東学院大学表面工学研究所 , 関東化成工業株式会社
发明人： HONMA HIDEO , WATANABE MITSUHIRO , YAMAMOTO SHUJI
IPC分类号： H01Q15/14 , B32B3/10 , B32B15/08 , H01Q1/42
摘要： PROBLEM TO BE SOLVED: To provide a metal composite material which includes electromagnetic wave (millimeter wave) transparency without using expensive metal, such as indium, and excellent decorativeness.
SOLUTION: The metal composite material (10) of the electromagnetic wave transparency includes a metal film (12) where metal regions (14) are formed into regular islands on a resin base material (11), an area of the metal region (14) ranges from 0.001-0.81 m
2 and an interval between the adjacent metal regions (14) and (14) ranges from 0.01-0.06 mm, and includes -5 to 0 dB absorption ratio for 1 to 110 GHz electromagnetic wave.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种包括电磁波（毫米波）透明度的金属复合材料，而不使用诸如铟的昂贵的金属，并且具有优异的装饰性。解决方案：电磁波透光体的金属复合材料（10）包括金属膜（12），其中金属区域（14）在树脂基材（11）上形成为规则的岛状，金属区域（14）的范围为0.001-0.81m 2 ，相邻的金属区域（14）和（14）之间的间隔为0.01-0.06mm，并且包括-5至0dB的吸收比为1 到110 GHz的电磁波。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010209222A Metal-coated foamed plastic and method for producing the metal-coated foamed plastic 审中-公开
标题翻译：金属包覆的泡沫塑料和用于生产金属包覆的泡沫塑料的方法
公开(公告)号：JP2010209222A
公开(公告)日：2010-09-24
申请号：JP2009057062
申请日：2009-03-10
申请人： Foam Kasei:Kk , Kanto Gakuin Univ Surface Engineering Research Institute , Kanto Kasei Kogyo Kk , 株式会社フォーム化成 , 株式会社関東学院大学表面工学研究所 , 関東化成工業株式会社
发明人： WATANABE MITSUHIRO , SAITO YUICHI , OTO SHINJI , OKADA SATORU
IPC分类号： C08J9/232 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To provide a metal-coated foamed plastic having a service temperature over 100°C, and to provide a method for producing the same.
SOLUTION: The metal-coated foamed plastic is prepared by coating a rigid foamed plastic with: at least one metal component selected from among nickel, cobalt, palladium, copper, silver, gold, platinum, and tin; or two or more metal components or like. The rigid foamed plastic can be produced by an in-mold expansion molding, and can have the melting point not lower than 120°C when it is a polyolefin type resin. The metal coating with which the rigid foamed plastic is surfaced is formed by using an electroless plating process. If necessary, a metal-coated foamed plastic partially coated with a metallic coating can be obtained by forming a thin resin layer on the surface of a rigid foamed plastic and irradiating the resultant foamed plastic with ultraviolet radiation through a photomask.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供使用温度超过100℃的金属涂层泡沫塑料，并提供其制造方法。金属涂覆的泡沫塑料通过用至少一种选自镍，钴，钯，铜，银，金，铂和锡的金属成分涂覆刚性发泡塑料来制备; 或两种以上的金属成分等。刚性发泡塑料可以通过模内膨胀成型制造，并且当它是聚烯烃类树脂时可以具有不低于120℃的熔点。通过使用无电解电镀工艺形成刚性发泡塑料表面的金属涂层。如果需要，可以通过在刚性发泡塑料的表面上形成薄树脂层并用紫外线照射所得到的泡沫塑料通过光掩模来获得部分涂覆有金属涂层的金属涂覆泡沫塑料。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2010165670A Method for manufacturing metallic porous body, and use of the metallic porous body 有权
标题翻译：制造金属多孔体的方法和金属多孔体的使用
公开(公告)号：JP2010165670A
公开(公告)日：2010-07-29
申请号：JP2009282194
申请日：2009-12-11
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社関東学院大学表面工学研究所
发明人： WATANABE MITSUHIRO , ISHIDA TAKUYA , HONMA HIDEO , NAKAYAMA HIDEKI
IPC分类号： H01M4/38 , H01M4/134 , H01M4/1395 , H01M4/66
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallic porous body useful for an active material of a lithium secondary battery or the like, and to provide an electrode and a battery using the porous body. SOLUTION: The method for manufacturing the metallic porous body includes formation of a composite plating film containing metal MA (tin for example) capable of reversibly absorbing and releasing lithium and an alkali metal (lithium for example) on a substrate by using a plating liquid containing a plating component in an organic solvent, and also includes removing of the alkali metal contained in the composite plating film by washing. Thereby, the metallic porous body having many pores produced by removing the alkali metal is manufactured. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造用于锂二次电池等的活性物质的金属多孔体的方法，并提供使用多孔体的电极和电池。解决方案：制造金属多孔体的方法包括在基板上形成含有能够可逆地吸收和释放锂的金属MA（例如锡）和碱金属（例如锂）的复合镀膜，在有机溶剂中含有电镀成分的电镀液，还可以通过洗涤除去复合镀膜中所含的碱金属。由此，制造具有通过除去碱金属而生成的多孔的金属多孔体。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009283248A Negative electrode for nonaqueous electrolyte secondary battery and its manufacturing method 审中-公开
标题翻译：非电解二次电池负极及其制造方法
公开(公告)号：JP2009283248A
公开(公告)日：2009-12-03
申请号：JP2008133180
申请日：2008-05-21
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社関東学院大学表面工学研究所
发明人： NAKAYAMA HIDEKI , WATANABE MITSUHIRO , ISHIDA TAKUYA
IPC分类号： H01M4/13 , H01M4/134 , H01M4/139 , H01M4/1395 , H01M4/38 , H01M4/62
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide a negative electrode for a nonaqueous electrolyte secondary battery for preventing decrease in capacity of the battery while enhancing cycle characteristics.
SOLUTION: Resist 30 having a plurality of openings 28 is formed on copper foil 26 (a current collector). The resist 30 is insoluble in an electrolyte 20. A tin alloy layer 32 (an active material layer) is formed so as to come in contact with the copper foil 26 inside the opening 28 of the resist 30. The tin alloy layer 32 contains an active material for storing and releasing lithium ions.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种非水电解质二次电池用负极，以防止电池的容量降低，同时提高循环特性。解决方案：具有多个开口28的抗蚀剂30形成在铜箔26（集电器）上。抗蚀剂30不溶于电解质20.形成锡合金层32（活性物质层），以与抗蚀剂30的开口28内的铜箔26接触。锡合金层32含有用于储存和释放锂离子的活性材料。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2008223082A Additive for copper plating, copper plating liquid using the additive for copper plating and copper electroplating method using the copper plating liquid 审中-公开
标题翻译：铜镀层添加剂，铜镀液添加剂用铜镀层和铜电镀方法使用铜镀液
公开(公告)号：JP2008223082A
公开(公告)日：2008-09-25
申请号：JP2007062627
申请日：2007-03-12
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Kanto Kasei Kogyo Kk , 株式会社関東学院大学表面工学研究所 , 関東化成工業株式会社
发明人： SUGIMOTO MASAHARU , WATANABE MITSUHIRO , HONMA HIDEO
IPC分类号： C25D3/38 , C25D7/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an additive for copper plating by which a stable effect can be obtained even if an insoluble anode is used.
SOLUTION: In the additive for copper plating containing a polyalkene oxide compound, the polyalkene oxide compound has constitutional formula, shown below, to which a functional group or halogen element is introduced in either one or both of its terminals and has a number average molecular weight of 100 to 2,000,000. When m in the constitutional formula is specified to 1 to 8 and R
1 or R
1 is defined as a functional group, the functional group is defined as any functional group selected from a functional group including a sulfonic group, N or S and a functional group selected from a functional group having an unsaturated bond. Further, when the additive for copper plating including the polyalkene oxide compound of 10,000 to 2,000,000 in molecular weight is employed, there is no need for making combination use of the additives, such as bis(3-sulfopropyl) disulfide and janus green, and the more preferable copper plating can be performed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供即使使用不溶性阳极也能获得稳定效果的镀铜添加剂。解决方案：在含有聚烯烃氧化物化合物的镀铜添加剂中，聚烯烃氧化物具有以下结构式，如下所示，在其末端的一个或两个中引入官能团或卤素元素并具有数平均分子量为100〜200万。当结构式中的m被规定为1至8且R 1 或R 1 被定义为官能团时，该官能团定义为任何官能团，包括磺酸基，N或S的官能团和选自具有不饱和键的官能团的官能团。此外，当使用包含分子量为10,000至2,000,000的聚烯烃氧化物化合物的镀铜添加剂时，不需要组合使用添加剂如二（3-磺基丙基）二硫化物和香蕉绿，并且可以进行更优选的镀铜。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007165751A Wiring board, and method for manufacturing same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2007165751A
公开(公告)日：2007-06-28
申请号：JP2005362930
申请日：2005-12-16
申请人： Ain:Kk , Kanto Gakuin Univ Surface Engineering Research Institute , Multi:Kk , 株式会社アイン , 株式会社マルチ , 株式会社関東学院大学表面工学研究所
发明人： WATANABE MITSUHIRO , ONO KAORU , ISHIDA TAKUYA
IPC分类号： H05K1/05 , H05K3/44
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for sufficiently achieving the insulation property of a substrate surface and the radiation property of the wiring board.
SOLUTION: An alumite layer 2 as a metal oxide insulating layer is formed on the surface of an aluminum substrate 1 as a metal board, and a heat conductive resin insulating layer 3 is formed on the surface of the alumite layer 2 at the opposite side of the aluminum substrate 1, and a wiring section 7 is formed on the surface of the heat conductive resin insulating layer 3 at the opposite side of the alumite layer 2. Then, the alumite layer 2 is provided with recesses 4a and 4b of at least one type of a hole and a crack on the surface, and the heat conductive resin insulating layer 3 is formed in such a status that it enters the recesses 4a and 4b.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于充分实现基板表面的绝缘性能和布线板的辐射性能的布线板。解决方案：在作为金属板的铝基板1的表面上形成作为金属氧化物绝缘层的耐酸铝层2，并且在该耐蚀铝层2的表面上形成导热树脂绝缘层3 在铝基板1的相对侧，在隔热层2的相对侧的导热性树脂绝缘层3的表面上形成配线部7.然后，在耐酸铝层2上设置有凹部4a，4b，至少一种类型的孔和表面上的裂纹，并且导热树脂绝缘层3形成为进入凹部4a和4b的状态。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006093420A Mounting method of semiconductor device 审中-公开
标题翻译：半导体器件的安装方法
公开(公告)号：JP2006093420A
公开(公告)日：2006-04-06
申请号：JP2004277283
申请日：2004-09-24
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Multi:Kk , Oki Electric Ind Co Ltd , Univ Waseda , 学校法人早稲田大学 , 株式会社マルチ , 株式会社関東学院大学表面工学研究所 , 沖電気工業株式会社
发明人： KOIWA ICHIRO , ASHIKAGA KINYA , WATANABE MITSUHIRO , AISAKA TETSUYA , HONMA HIDEO
IPC分类号： H01L21/60
CPC分类号： H01L24/81
摘要： PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor device for inexpensively mounting a chip on a mounted substrate of a semiconductor, by which the thickness of the semiconductor device can be made thin.
SOLUTION: The mounted substrate is prepared where metal wiring 240 is formed on a surface 230 on which a semiconductor chip of the mounted substrate 220 is mounted. The semiconductor chip is prepared where conductive terminals 90 are installed in recesses 85 formed on a face 111 confronted with the mounted substrate of the semiconductor chip 110. The metal wiring and the conductive terminals are bonded through conductive adhesive 240.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种用于将半导体器件的厚度变薄的用于将芯片廉价安装在半导体的安装基板上的半导体器件的安装方法。
解决方案：准备安装的基板，其中金属布线240形成在其上安装有安装基板220的半导体芯片的表面230上。制备半导体芯片，其中导电端子90安装在形成在面对着半导体芯片110的安装基板的面111上的凹槽85中。金属布线和导电端子通过导电粘合剂240粘结。 C）2006，JPO＆NCIPI

10. 发明专利

JP2012087386A Electroless nickel plating bath and electroless nickel plating method using the same 审中-公开
标题翻译：电镀镍镀镍浴和电镀镍镀层方法
公开(公告)号：JP2012087386A
公开(公告)日：2012-05-10
申请号：JP2010236378
申请日：2010-10-21
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社関東学院大学表面工学研究所
发明人： BESSHO TAKESHI , HONMA HIDEO , WATANABE MITSUHIRO , TASHIRO KATSUHIKO
IPC分类号： C23C18/36
CPC分类号： C23C18/36
摘要： PROBLEM TO BE SOLVED: To provide an electroless nickel plating bath capable of forming a nickel plating film with low film stress, and to provide an electroless nickel plating method using the same.SOLUTION: The plating film with low film stress can be formed by using the electroless nickel plating bath which contains metal antimony or an antimony compound as a stabilizer and contains succinic acid or one of a malic acid, and lactic acid, at a predetermined ratio as a complexing agent.

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