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1. 发明授权

US08587086B2 Self-aligned dual depth isolation and method of fabrication 失效
标题翻译：自对准双深度隔离和制造方法
公开(公告)号：US08587086B2
公开(公告)日：2013-11-19
申请号：US13598992
申请日：2012-08-30
申请人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
发明人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
IPC分类号： H01L21/70
CPC分类号： H01L21/84 , H01L21/3086 , H01L21/76283 , H01L27/1104
摘要： FDSOI devices and methods for the fabrication thereof are provided. In one aspect, a method for fabricating a device includes the following steps. A wafer is provided having a substrate, a BOX and a SOI layer. A hardmask layer is deposited over the SOI layer. A photoresist layer is deposited over the hardmask layer and patterned into groups of segments. A tilted implant is performed to damage all but those portions of the hardmask layer covered or shadowed by the segments. Portions of the hardmask layer damaged by the implant are removed. A first etch is performed through the hardmask layer to form a deep trench in the SOI layer, the BOX and at least a portion of the substrate. The hardmask layer is patterned using the patterned photoresist layer. A second etch is performed through the hardmask layer to form shallow trenches in the SOI layer.
摘要翻译：提供了FDSOI器件及其制造方法。一方面，一种制造装置的方法包括以下步骤。提供具有基板，BOX和SOI层的晶片。硬掩模层沉积在SOI层上。光致抗蚀剂层沉积在硬掩模层上并且被图案化成一组片段。执行倾斜的植入物以损坏被片段覆盖或遮蔽的硬掩模层的所有部分。移除由植入物损坏的硬掩模层的部分。通过硬掩模层执行第一蚀刻，以在SOI层，BOX和衬底的至少一部分中形成深沟槽。使用图案化的光致抗蚀剂层对硬掩模层进行图案化。通过硬掩模层进行第二蚀刻，以在SOI层中形成浅沟槽。

2. 发明授权

US08293615B2 Self-aligned dual depth isolation and method of fabrication 有权
标题翻译：自对准双深度隔离和制造方法
公开(公告)号：US08293615B2
公开(公告)日：2012-10-23
申请号：US13070568
申请日：2011-03-24
申请人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
发明人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
IPC分类号： H01L21/328
CPC分类号： H01L21/84 , H01L21/3086 , H01L21/76283 , H01L27/1104
摘要： FDSOI devices and methods for the fabrication thereof are provided. In one aspect, a method for fabricating a device includes the following steps. A wafer is provided having a substrate, a BOX and a SOI layer. A hardmask layer is deposited over the SOI layer. A photoresist layer is deposited over the hardmask layer and patterned into groups of segments. A tilted implant is performed to damage all but those portions of the hardmask layer covered or shadowed by the segments. Portions of the hardmask layer damaged by the implant are removed. A first etch is performed through the hardmask layer to form a deep trench in the SOI layer, the BOX and at least a portion of the substrate. The hardmask layer is patterned using the patterned photoresist layer. A second etch is performed through the hardmask layer to form shallow trenches in the SOI layer.
摘要翻译：提供了FDSOI器件及其制造方法。一方面，一种制造装置的方法包括以下步骤。提供具有基板，BOX和SOI层的晶片。硬掩模层沉积在SOI层上。光致抗蚀剂层沉积在硬掩模层上并且被图案化成一组片段。执行倾斜的植入物以损坏被片段覆盖或遮蔽的硬掩模层的所有部分。移除由植入物损坏的硬掩模层的部分。通过硬掩模层执行第一蚀刻，以在SOI层，BOX和衬底的至少一部分中形成深沟槽。使用图案化的光致抗蚀剂层对硬掩模层进行图案化。通过硬掩模层进行第二蚀刻，以在SOI层中形成浅沟槽。

3. 发明申请

US20120241902A1 SELF-ALIGNED DUAL DEPTH ISOLATION AND METHOD OF FABRICATION 有权
标题翻译：自对准的双深度隔离和制造方法
公开(公告)号：US20120241902A1
公开(公告)日：2012-09-27
申请号：US13070568
申请日：2011-03-24
申请人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
发明人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
IPC分类号： H01L29/06 , H01L21/302
CPC分类号： H01L21/84 , H01L21/3086 , H01L21/76283 , H01L27/1104
摘要： FDSOI devices and methods for the fabrication thereof are provided. In one aspect, a method for fabricating a device includes the following steps. A wafer is provided having a substrate, a BOX and a SOI layer. A hardmask layer is deposited over the SOI layer. A photoresist layer is deposited over the hardmask layer and patterned into groups of segments. A tilted implant is performed to damage all but those portions of the hardmask layer covered or shadowed by the segments. Portions of the hardmask layer damaged by the implant are removed. A first etch is performed through the hardmask layer to form a deep trench in the SOI layer, the BOX and at least a portion of the substrate. The hardmask layer is patterned using the patterned photoresist layer. A second etch is performed through the hardmask layer to form shallow trenches in the SOI layer.
摘要翻译：提供了FDSOI器件及其制造方法。一方面，一种制造装置的方法包括以下步骤。提供具有基板，BOX和SOI层的晶片。硬掩模层沉积在SOI层上。光致抗蚀剂层沉积在硬掩模层上并且被图案化成一组片段。执行倾斜的植入物以损坏被片段覆盖或遮蔽的硬掩模层的所有部分。移除由植入物损坏的硬掩模层的部分。通过硬掩模层执行第一蚀刻，以在SOI层，BOX和衬底的至少一部分中形成深沟槽。使用图案化的光致抗蚀剂层对硬掩模层进行图案化。通过硬掩模层进行第二蚀刻，以在SOI层中形成浅沟槽。

4. 发明申请

US20120319232A1 Self-Aligned Dual Depth Isolation and Method of Fabrication 失效
标题翻译：自对准双深度隔离和制作方法
公开(公告)号：US20120319232A1
公开(公告)日：2012-12-20
申请号：US13598992
申请日：2012-08-30
申请人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
发明人： Kangguo Cheng , Robert Heath Dennard , Bruce B. Doris , Ali Khakifirooz , Ghavam G. Shahidi
IPC分类号： H01L29/06
CPC分类号： H01L21/84 , H01L21/3086 , H01L21/76283 , H01L27/1104
摘要： FDSOI devices and methods for the fabrication thereof are provided. In one aspect, a method for fabricating a device includes the following steps. A wafer is provided having a substrate, a BOX and a SOI layer. A hardmask layer is deposited over the SOI layer. A photoresist layer is deposited over the hardmask layer and patterned into groups of segments. A tilted implant is performed to damage all but those portions of the hardmask layer covered or shadowed by the segments. Portions of the hardmask layer damaged by the implant are removed. A first etch is performed through the hardmask layer to form a deep trench in the SOI layer, the BOX and at least a portion of the substrate. The hardmask layer is patterned using the patterned photoresist layer. A second etch is performed through the hardmask layer to form shallow trenches in the SOI layer.
摘要翻译：提供了FDSOI器件及其制造方法。一方面，一种制造装置的方法包括以下步骤。提供具有基板，BOX和SOI层的晶片。硬掩模层沉积在SOI层上。光致抗蚀剂层沉积在硬掩模层上并且被图案化成一组片段。执行倾斜的植入物以损坏被片段覆盖或遮蔽的硬掩模层的所有部分。移除由植入物损坏的硬掩模层的部分。通过硬掩模层执行第一蚀刻，以在SOI层，BOX和衬底的至少一部分中形成深沟槽。使用图案化的光致抗蚀剂层对硬掩模层进行图案化。通过硬掩模层进行第二蚀刻，以在SOI层中形成浅沟槽。

5. 发明授权

US09054211B2 Compressively stressed FET device structures 有权
标题翻译：压应力FET器件结构
公开(公告)号：US09054211B2
公开(公告)日：2015-06-09
申请号：US13540801
申请日：2012-07-03
申请人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
发明人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
IPC分类号： H01L27/088 , H01L21/8234 , H01L21/8238 , H01L29/66 , H01L29/78
CPC分类号： H01L21/823431 , H01L21/823412 , H01L21/823807 , H01L21/823821 , H01L29/66795 , H01L29/7843 , H01L29/7846 , H01L29/785
摘要： An FET device structure has a Fin-FET device with a fin of a Si based material. An oxide element is abutting the fin and exerts pressure onto the fin. The Fin-FET device channel is compressively stressed due to the pressure on the fin. A further FET device structure has Fin-FET devices in a row. An oxide element extending perpendicularly to the row of fins is abutting the fins and exerts pressure onto the fins. Device channels of the Fin-FET devices are compressively stressed due to the pressure on the fins.
摘要翻译： FET器件结构具有具有Si基材料的翅片的Fin-FET器件。氧化物元件邻接翅片并对翅片施加压力。 Fin-FET器件通道由于鳍上的压力而受到压缩应力。另外的FET器件结构具有Fin-FET器件。垂直于翅片排延伸的氧化物元件邻接散热片并对翅片施加压力。 Fin-FET器件的器件通道由于鳍片上的压力而受到压缩应力。

6. 发明授权

US08629504B2 Extremely thin semiconductor-on-insulator (ETSOI) integrated circuit with on-chip resistors and method of forming the same 有权
标题翻译：具有片上电阻的非常薄的绝缘体上半导体（ETSOI）集成电路及其形成方法
公开(公告)号：US08629504B2
公开(公告)日：2014-01-14
申请号：US13433401
申请日：2012-03-29
申请人： Bruce B. Doris , Kangguo Cheng , Ali Khakifirooz , Ghavam G. Shahidi
发明人： Bruce B. Doris , Kangguo Cheng , Ali Khakifirooz , Ghavam G. Shahidi
IPC分类号： H01L21/00
CPC分类号： H01L27/1214 , H01L21/84 , H01L27/1203 , H01L27/13
摘要： An electrical device is provided that in one embodiment includes a semiconductor-on-insulator (SOI) substrate having a semiconductor layer with a thickness of less than 10 nm. A semiconductor device having a raised source region and a raised drain region of a single crystal semiconductor material of a first conductivity is present on a first surface of the semiconductor layer. A resistor composed of the single crystal semiconductor material of the first conductivity is present on a second surface of the semiconductor layer. A method of forming the aforementioned electrical device is also provided.
摘要翻译：提供了一种电气装置，其在一个实施例中包括具有厚度小于10nm的半导体层的绝缘体上半导体（SOI）基板。在半导体层的第一表面上存在具有第一导电性的单晶半导体材料的升高的源极区域和升高的漏极区域的半导体器件。由第一导电性的单晶半导体材料构成的电阻器存在于半导体层的第二表面上。还提供了形成上述电气装置的方法。

7. 发明授权

US08546228B2 Strained thin body CMOS device having vertically raised source/drain stressors with single spacer 有权
标题翻译：应变的薄体CMOS器件具有单个间隔物的垂直升高的源/漏应力源
公开(公告)号：US08546228B2
公开(公告)日：2013-10-01
申请号：US12816399
申请日：2010-06-16
申请人： Bruce B. Doris , Kangguo Cheng , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
发明人： Bruce B. Doris , Kangguo Cheng , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
IPC分类号： H01L21/336
CPC分类号： H01L29/66477 , H01L21/823807 , H01L21/823814 , H01L21/84 , H01L27/1203 , H01L29/66628 , H01L29/66772 , H01L29/7848 , H01L29/78618
摘要： A method of forming a transistor device includes forming a patterned gate structure over a semiconductor substrate; forming a spacer layer over the semiconductor substrate and patterned gate structure; removing horizontally disposed portions of the spacer layer so as to form a vertical sidewall spacer adjacent the patterned gate structure; and forming a raised source/drain (RSD) structure over the semiconductor substrate and adjacent the vertical sidewall spacer, wherein the RSD structure has a substantially vertical sidewall profile so as to abut the vertical sidewall spacer and produce one of a compressive and a tensile strain on a channel region of the semiconductor substrate below the patterned gate structure.
摘要翻译：一种形成晶体管器件的方法包括在半导体衬底上形成图案化栅极结构; 在半导体衬底上形成间隔层和图案化栅极结构; 去除间隔层的水平设置部分，以形成邻近图案化栅极结构的垂直侧壁间隔物; 以及在所述半导体衬底上并且邻近所述垂直侧壁间隔物形成升高的源极/漏极（RSD）结构，其中所述RSD结构具有基本上垂直的侧壁轮廓，以便邻接所述垂直侧壁间隔物并产生压缩和拉伸应变之一在图案化的栅极结构下方的半导体衬底的沟道区上。

8. 发明授权

US08404540B2 Device and method of reducing junction leakage 有权
标题翻译：减少结漏电的装置和方法
公开(公告)号：US08404540B2
公开(公告)日：2013-03-26
申请号：US13446602
申请日：2012-04-13
申请人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
发明人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
IPC分类号： H01L21/8238
CPC分类号： H01L29/66628 , H01L21/26513 , H01L29/0847 , H01L29/41783 , H01L29/665 , H01L29/6656 , H01L29/6659 , H01L29/7834
摘要： A device and method for reducing junction leakage in a semiconductor junction includes forming a faceted raised structure in a source/drain region of the device. Dopants are diffused from the faceted raised structure into a substrate below the faceted raised structure to form source/drain regions. A sprinkle implantation is applied on the faceted raised structure to produce a multi-depth dopant profile in the substrate for the source/drain regions.
摘要翻译：用于减少半导体结中的结漏电的器件和方法包括在器件的源极/漏极区域中形成刻面的凸起结构。掺杂剂从小面凸起结构扩散到小平面凸起结构下面的基底中以形成源极/漏极区域。在刻面凸起结构上施加喷洒注入，以在源/漏区的衬底中产生多深度掺杂物分布。

9. 发明授权

US08383474B2 Thin channel device and fabrication method with a reverse embedded stressor 有权
标题翻译：具有反向嵌入式应力源的薄通道器件和制造方法
公开(公告)号：US08383474B2
公开(公告)日：2013-02-26
申请号：US12789699
申请日：2010-05-28
申请人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
发明人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
IPC分类号： H01L21/8238
CPC分类号： H01L29/7849 , H01L21/26506 , H01L29/66772 , H01L29/785 , H01L29/78654
摘要： A device and method for inducing stress in a semiconductor layer includes providing a substrate having a dielectric layer formed between a first semiconductor layer and a second semiconductor layer. A removable buried layer is provided on or in the second semiconductor layer. A gate structure with side spacers is formed on the first semiconductor layer. Recesses are formed down to the removable buried layer in areas for source and drain regions. The removable buried layer is etched away to form an undercut below the dielectric layer below the gate structure. A stressor layer is formed in the undercut, and source and drain regions are formed.
摘要翻译：用于在半导体层中诱发应力的装置和方法包括提供在第一半导体层和第二半导体层之间形成介电层的基板。可移除的掩埋层设置在第二半导体层上或第二半导体层中。在第一半导体层上形成具有侧面间隔物的栅极结构。在源区和漏区的区域中形成凹陷到可移除的掩埋层。蚀刻掉可移除的掩埋层，以在栅极结构下面的介电层下方形成底切。在底切中形成应力层，形成源区和漏区。

10. 发明授权

US08278175B2 Compressively stressed FET device structures 有权
标题翻译：压应力FET器件结构
公开(公告)号：US08278175B2
公开(公告)日：2012-10-02
申请号：US12813311
申请日：2010-06-10
申请人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
发明人： Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
IPC分类号： H01L21/335
CPC分类号： H01L21/823431 , H01L21/823412 , H01L21/823807 , H01L21/823821 , H01L29/66795 , H01L29/7843 , H01L29/7846 , H01L29/785
摘要： Methods for fabricating FET device structures are disclosed. The methods include receiving a fin of a Si based material, and converting a region of the fin into an oxide element. The oxide element exerts pressure onto the fin where a Fin-FET device is fabricated. The exerted pressure induces compressive stress in the device channel of the Fin-FET device. The methods also include receiving a rectangular member of a Si based material and converting a region of the member into an oxide element. The methods further include patterning the member that N fins are formed in parallel, while being abutted by the oxide element, which exerts pressure onto the N fins. Fin-FET devices are fabricated in the compressed fins, which results in compressively stressed device channels. FET devices structures are also disclosed. An FET devices structure has a Fin-FET device with a fin of a Si based material. An oxide element is abutting the fin and exerts pressure onto the fin. The Fin-FET device channel is compressively stressed due to the pressure on the fin. A further FET device structure has Fin-FET devices in a row each having fins. An oxide element extending perpendicularly to the row of fins is abutting the fins and exerts pressure onto the fins. Device channels of the Fin-FET devices are compressively stressed due to the pressure on the fins.
摘要翻译：公开了用于制造FET器件结构的方法。所述方法包括接收Si基材料的翅片，以及将鳍片的区域转换为氧化物元件。氧化物元件在制造Fin-FET器件的鳍片上施加压力。施加的压力在Fin-FET器件的器件沟道中引起压应力。所述方法还包括接收Si基材料的矩形构件并将所述构件的区域转换为氧化物元件。所述方法进一步包括在与N个翅片施加压力的同时被N型翅片平行地形成的构件图案化。 Fin-FET器件制造在压缩鳍片中，这导致压缩应力器件通道。还公开了FET器件结构。 FET器件结构具有具有Si基材料的翅片的Fin-FET器件。氧化物元件邻接翅片并对翅片施加压力。 Fin-FET器件通道由于鳍上的压力而受到压缩应力。另外的FET器件结构具有各自具有鳍片的Fin-FET器件。垂直于翅片排延伸的氧化物元件邻接散热片并对翅片施加压力。 Fin-FET器件的器件通道由于鳍片上的压力而受到压缩应力。

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