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1. 发明申请

US20130188970A1 Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors 审中-公开
标题翻译：使用硅基车削镜的光电组件包装平台
公开(公告)号：US20130188970A1
公开(公告)日：2013-07-25
申请号：US13745773
申请日：2013-01-19
申请人： Kalpendu Shastri , Vipulkumar Patel , Soham Pathak , Utpal Chakrabarti , Bipin Dama , Ravinder Kachru , Kishor Desai
发明人： Kalpendu Shastri , Vipulkumar Patel , Soham Pathak , Utpal Chakrabarti , Bipin Dama , Ravinder Kachru , Kishor Desai
IPC分类号： H04B10/12
CPC分类号： H04B10/501 , G02B6/3512 , G02B6/3692 , G02B6/4214 , G02B6/4256 , G02B6/4292 , Y10T29/49002
摘要： An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.
摘要翻译：用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。外壳用于封装填充的插入器组件，并且包括硅侧壁和透明盖。侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征，转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。盖板设置在外壳上并与壳体对准，其中盖板包括硅侧壁构件，其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。由外壳重新引导的光学信号然后穿过外壳的透明盖，撞击盖板的转向镜元件，然后沿着纵向轴线重新定向。

2. 发明申请

US20130183008A1 Self-Aligning Connectorized Fiber Array Assembly 有权
标题翻译：自对准连接光纤阵列组件
公开(公告)号：US20130183008A1
公开(公告)日：2013-07-18
申请号：US13737080
申请日：2013-01-09
申请人： Kalpendu Shastri , Soham Pathak , Utpal Chakrabarti , Vipulkumar Patel , Bipin Dama , Ravinder Kachru , Kishor Desai
发明人： Kalpendu Shastri , Soham Pathak , Utpal Chakrabarti , Vipulkumar Patel , Bipin Dama , Ravinder Kachru , Kishor Desai
IPC分类号： G02B6/42
CPC分类号： G02B6/4292 , B82Y20/00 , C03C15/00 , G02B6/136 , G02B6/4214 , G02B6/4246 , G02B6/4259 , Y10T29/4978
摘要： An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.
摘要翻译：一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。在光信号通过的区域中，透明盖附着有板的形式的第一部分。第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。然后将纤维阵列以自对准的方式附接到第二板。

3. 发明授权

US08803269B2 Wafer scale packaging platform for transceivers 有权
标题翻译：收发器晶圆级封装平台
公开(公告)号：US08803269B2
公开(公告)日：2014-08-12
申请号：US13463408
申请日：2012-05-03
申请人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
发明人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
IPC分类号： H01L31/0232 , H01L29/40 , H01L23/053 , H01L23/12
CPC分类号： H01L25/50 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/426 , H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.
摘要翻译：光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义分离光学元件之间的光信号路径。实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

4. 发明申请

US20130101250A1 Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assemblies 有权
标题翻译：模制玻璃盖玻璃水平包装的光电子组件
公开(公告)号：US20130101250A1
公开(公告)日：2013-04-25
申请号：US13656528
申请日：2012-10-19
申请人： Kishor Desai , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
发明人： Kishor Desai , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
IPC分类号： G02B6/12 , H01L33/52
CPC分类号： G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
摘要： An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
摘要翻译：提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。设置一层密封材料以概述衬底的限定的周边区域。将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

5. 发明申请

US20130202255A1 Single Mode Fiber Array Connector For Opto-Electronic Transceivers 有权
标题翻译：单模光纤阵列连接器用于光电收发器
公开(公告)号：US20130202255A1
公开(公告)日：2013-08-08
申请号：US13755843
申请日：2013-01-31
申请人： Chris Kiyoshi Togami , Soham Pathak , Kalpendu Shastri , Kishor Desai , Ravinder Kachru , Bipin Dama , Vipulkumar Patel
发明人： Chris Kiyoshi Togami , Soham Pathak , Kalpendu Shastri , Kishor Desai , Ravinder Kachru , Bipin Dama , Vipulkumar Patel
IPC分类号： G02B6/42 , G02B6/43
CPC分类号： G02B6/421 , G02B6/3885 , G02B6/4204 , G02B6/4214 , G02B6/423 , G02B6/4244 , G02B6/4292 , G02B6/43
摘要： An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.
摘要翻译：用于在光电收发器和单模光纤阵列之间提供单模光信号耦合的装置采用透镜阵列和套圈部件的形式。透镜阵列包括多个单独的透镜元件，其设置成截取来自光电收发器的类似多个单模光输出信号，并提供其聚焦版本的输出。套圈组件包括与透镜阵列无源对准的多个单模光纤短截线，并支持将聚焦的单模光输出信号传输到相关联的单模光纤阵列。

6. 发明申请

US20120280344A1 Wafer Scale Packaging Platform For Transceivers 有权
标题翻译：收发器晶圆尺寸封装平台
公开(公告)号：US20120280344A1
公开(公告)日：2012-11-08
申请号：US13463408
申请日：2012-05-03
申请人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
发明人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
IPC分类号： H01L31/12
CPC分类号： H01L25/50 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/426 , H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.
摘要翻译：光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。特别地，硅晶片被用作平台（插入器），用于多个收发器模块的所有部件安装或集成在该平台上，硅插入器的顶表面用作用于定义光信号的参考平面分离的光学元件之间的路径。实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

7. 发明申请

US20130182996A1 Releasable Fiber Connector For Opto-Electronic Assemblies 有权
标题翻译：用于光电子组件的可释放光纤连接器
公开(公告)号：US20130182996A1
公开(公告)日：2013-07-18
申请号：US13737029
申请日：2013-01-09
申请人： Kalpendu Shastri , Soham Pathak , John Fangman , Vipulkumar Patel , Kishor Desai , Ravinder Kachru
发明人： Kalpendu Shastri , Soham Pathak , John Fangman , Vipulkumar Patel , Kishor Desai , Ravinder Kachru
IPC分类号： G02B6/42 , G02B6/12
CPC分类号： G02B6/42 , G02B6/12 , G02B6/3886 , G02B6/4214 , G02B6/4259 , G02B6/4292 , Y10T29/49155
摘要： An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.
摘要翻译：一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。

8. 发明申请

US20050289490A1 Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits 有权
标题翻译：用于单片硅基光电路的设计，仿真和验证的综合方法
公开(公告)号：US20050289490A1
公开(公告)日：2005-12-29
申请号：US11159283
申请日：2005-06-22
申请人： Kalpendu Shastri , Soham Pathak , Prakash Gothoskar , Paulius Mosinskis , Bipin Dama
发明人： Kalpendu Shastri , Soham Pathak , Prakash Gothoskar , Paulius Mosinskis , Bipin Dama
IPC分类号： G06F17/50 , G06G7/62
CPC分类号： G06F17/5036 , G06F17/5068
摘要： Computer-aided design (CAD) tools are used to perform the integrated design, verification and layout of electrical and optical components in a monolithic, silicon-based electro-optic chip. Separate top-level behavioral logic designs are prepared for the three different types of elements included within the final, silicon-based monolithic structure: (1) digital electronic integrated circuit elements; (2) analog/mixed signal electronic integrated circuit elements; and (3) opto-electronic elements (including passive and active optical elements). Once the behavioral logic design is completed, the results are combined and co-simulated. A physical layout design is developed and verified for each different type of element in the circuit. The separate physical layouts are then co-verified, to assess the properties of the overall physical design. The results of the co-simulation are compared to the results of the co-verification, with alterations made in the logic design and/or the physical layout until the desired operating parameters are obtained. Once the desired results are generated, conventional wafer-level fabrication operations are then considered to provide a final product (“tape out”).
摘要翻译：计算机辅助设计（CAD）工具用于在单片硅基电光芯片中执行电气和光学部件的集成设计，验证和布局。为最终的硅基单片结构中包含的三种不同类型的元件准备了独立的顶级行为逻辑设计：（1）数字电子集成电路元件; （2）模拟/混合信号电子集成电路元件; 和（3）光电元件（包括无源和有源光学元件）。一旦行为逻辑设计完成，结果将被合并并共同模拟。为电路中的每种不同类型的元件开发和验证物理布局设计。然后将单独的物理布局共同验证，以评估整体物理设计的属性。将共模拟的结果与协同验证的结果进行比较，在逻辑设计和/或物理布局中进行改变，直到获得所需的操作参数。一旦产生期望的结果，则常规晶圆级制造操作被认为是提供最终产品（“磁带输出”）。

9. 发明授权

US07269809B2 Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits 有权
标题翻译：用于单片硅基光电路的设计，仿真和验证的综合方法
公开(公告)号：US07269809B2
公开(公告)日：2007-09-11
申请号：US11159283
申请日：2005-06-22
申请人： Kalpendu Shastri , Soham Pathak , Prakash Gothoskar , Paulius Mosinskis , Bipin Dama
发明人： Kalpendu Shastri , Soham Pathak , Prakash Gothoskar , Paulius Mosinskis , Bipin Dama
IPC分类号： G06F17/50 , G06F17/10
CPC分类号： G06F17/5036 , G06F17/5068
摘要： Computer-aided design (CAD) tools are used to perform the integrated design, verification and layout of electrical and optical components in a monolithic, silicon-based electro-optic chip. Separate top-level behavioral logic designs are prepared for the three different types of elements included within the final, silicon-based monolithic structure: (1) digital electronic integrated circuit elements; (2) analog/mixed signal electronic integrated circuit elements; and (3) opto-electronic elements (including passive and active optical elements). Once the behavioral logic design is completed, the results are combined and co-simulated. A physical layout design is developed and verified for each different type of element in the circuit. The separate physical layouts are then co-verified, to assess the properties of the overall physical design. The results of the co-simulation are compared to the results of the co-verification, with alterations made in the logic design and/or the physical layout until the desired operating parameters are obtained. Once the desired results are generated, conventional wafer-level fabrication operations are then considered to provide a final product (“tape out”).
摘要翻译：计算机辅助设计（CAD）工具用于在单片硅基电光芯片中执行电气和光学部件的集成设计，验证和布局。为最终的硅基单片结构中包含的三种不同类型的元件准备了独立的顶级行为逻辑设计：（1）数字电子集成电路元件; （2）模拟/混合信号电子集成电路元件; 和（3）光电元件（包括无源和有源光学元件）。一旦行为逻辑设计完成，结果将被合并并共同模拟。为电路中的每种不同类型的元件开发和验证物理布局设计。然后将单独的物理布局共同验证，以评估整体物理设计的属性。将共模拟的结果与协同验证的结果进行比较，在逻辑设计和/或物理布局中进行改变，直到获得所需的操作参数。一旦产生期望的结果，则常规晶圆级制造操作被认为是提供最终产品（“磁带输出”）。

10. 发明授权

US07003196B2 External grating structures for interfacing wavelength-division-multiplexed optical sources with thin optical waveguides 有权
标题翻译：用于将波分复用光源与薄光波导接口连接的外部光栅结构
公开(公告)号：US07003196B2
公开(公告)日：2006-02-21
申请号：US10935145
申请日：2004-09-07
申请人： Margaret Ghiron , Prakash Gothoskar , Robert Keith Montgomery , Vipulkumar Patel , Soham Pathak , Kalpendu Shastri , Katherine A. Yanushefski
发明人： Margaret Ghiron , Prakash Gothoskar , Robert Keith Montgomery , Vipulkumar Patel , Soham Pathak , Kalpendu Shastri , Katherine A. Yanushefski
IPC分类号： G02B6/34
CPC分类号： G02B6/12007 , G02B6/122 , G02B6/29311 , G02B6/34
摘要： A coupling arrangement for allowing multiple wavelengths to be coupled into and out of a relatively thin silicon optical waveguide layer utilizes a diffractive optical element, in the form of a volume phase grating, in combination with a prism coupling structure. The diffractive optical element is formed to comprise a predetermined modulation index sufficient to diffract the various wavelengths through angles associated with improving the coupling efficiency of each wavelength into the silicon waveguide. The diffractive optical element may be formed as a separate element, or formed as an integral part of the coupling facet of the prism coupler.
摘要翻译：用于允许多个波长耦合到相对薄的硅光波导层中的耦合布置利用体积相位光栅的形式的衍射光学元件与棱镜耦合结构组合。衍射光学元件被形成为包括足以将各种波长衍射成与提高每个波长到硅波导的耦合效率相关联的角度的预定调制指数。衍射光学元件可以形成为单独的元件，或者形成为棱镜耦合器的耦合面的整体部分。

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