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    • 4. 发明申请
    • Method of optimizing optical power use in a parallel processing laser system
    • 并行处理激光系统中光功率优化的优化方法
    • US20060000815A1
    • 2006-01-05
    • US10881317
    • 2004-06-30
    • Daniel Hogan
    • Daniel Hogan
    • B23K26/067
    • B23K26/067B23K26/0608B23K26/0624B23K26/382B23K26/389B23K26/40B23K2103/42B23K2103/50B23K2103/52
    • The present invention relates to optimizing optical power from a laser processing system, and more specifically to a method of optimizing the optical power by employing parallel laser processing techniques to maximize fabrication quality and yield. The method in the present invention includes the steps of: determining the specification for the final product, selecting the proper combination of optical power and processing method for processing a single feature, determining the maximum number of features in pattern to be parallel processed, selecting a portion of the desired pattern that can be parallel processed, designing the DOEs, manufacturing the DOEs, incorporating the DOE into laser processing system, operating and controlling the laser processing system, and determining if more DOEs are needed to complete the laser processing.
    • 本发明涉及从激光加工系统优化光功率,更具体地说,涉及通过采用平行激光加工技术来优化光功率以最大化制造质量和产量的方法。 本发明的方法包括以下步骤:确定最终产品的规格,选择光功率的适当组合和处理单个特征的处理方法,确定要并行处理的图案中的最大特征数,选择 可以并行处理的所需图案的一部分,设计DOE,制造DOE,将DOE并入激光加工系统,操作和控制激光加工系统,以及确定是否需要更多的DOE来完成激光加工。
    • 5. 发明申请
    • Cell, packaging system, and method for fabricating the packaging system
    • 电池,包装系统和制造包装系统的方法
    • US20050259925A1
    • 2005-11-24
    • US11189673
    • 2005-07-26
    • Takuma AsariDaniel Hogan
    • Takuma AsariDaniel Hogan
    • G02B6/42G02B6/36G02B6/43G06E3/00H01L31/12
    • G02B6/43
    • The present invention provides cells which are capable of transmitting both optical information and electrical signals when connected with each other, and a packaging system in which these cells are connected. A first connector and a second connector are formed on each cell. These two connectors are configured complementary to each other. When two cells are pressed against each other with the first connector of one of the cells facing the second connector of the other, electrical connectors engage with each other, whereby the cells are connected electrically and mechanically. A first optical device and a second optical device are also disposed in complementary positions. When the cells are connected electrically and mechanically, the tip of the first optical device and the tip of the second optical device are brought into contact with each other, allowing an optical signal to be transmitted.
    • 本发明提供了当彼此连接时能够传输光学信息和电信号的单元,以及连接这些单元的封装系统。 在每个单元上形成第一连接器和第二连接器。 这两个连接器互相配置。 当两个电池单元彼此按压时,其中一个电池单元的第一连接器面对另一电池单元的第二连接器时,电连接器彼此接合,由此电池电连接和机械连接。 第一光学装置和第二光学装置也布置在互补位置。 当电池电连接和机械连接时,第一光学装置的尖端和第二光学装置的尖端彼此接触,允许光信号被传输。
    • 8. 发明申请
    • Stressed organic semiconductor devices
    • 强调有机半导体器件
    • US20070272919A1
    • 2007-11-29
    • US11499311
    • 2006-08-04
    • Kiyotaka MoriDaniel Hogan
    • Kiyotaka MoriDaniel Hogan
    • H01L29/08
    • H01L51/0096H01L51/0012H01L51/0508H01L51/0575H01L51/52Y02E10/549
    • An organic semiconductor device including: a substrate having a first thermal expansion coefficient; and an organic semiconductor material coupled to the substrate at an interface therebetween. The organic semiconductor material includes a polymer organic semiconductor material and/or an oligomer organic semiconductor material. The organic semiconductor material also has a second thermal expansion coefficient that is different from the first thermal expansion coefficient, such that a mechanical stress is transferred from the substrate to the organic semiconductor material through the interface. This mechanical stress is related to the difference between the first and second thermal expansion coefficients and the change in temperature of the organic semiconductor device.
    • 一种有机半导体器件,包括:具有第一热膨胀系数的衬底; 以及在它们之间的界面处耦合到所述衬底的有机半导体材料。 有机半导体材料包括聚合物有机半导体材料和/或低聚物有机半导体材料。 有机半导体材料还具有与第一热膨胀系数不同的第二热膨胀系数,使得机械应力通过界面从基板转移到有机半导体材料。 该机械应力与第一和第二热膨胀系数之间的差异以及有机半导体器件的温度变化有关。