会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • INTEGRATED TRANSFORMER WITH STACK STRUCTURE
    • 具有堆叠结构的集成变压器
    • US20060077028A1
    • 2006-04-13
    • US10906540
    • 2005-02-24
    • Kai-Yi Huang
    • Kai-Yi Huang
    • H01F27/28
    • H01F17/0006H01F27/2804H01F2017/0046H01F2021/125
    • An integrated transformer with a stack structure comprises a middle dielectric layer, a bottom dielectric layer, a first winding and a second winding. A portion of the first winding is disposed over a surface of the middle dielectric layer and the remaining portion of the first winding is disposed over a surface of the bottom dielectric layer. A portion of the second winding is disposed over the surface of the middle dielectric layer and the remaining portion of the second winding is disposed over the surface of the bottom dielectric layer. The second winding doesn't intersect with the first winding. The portions of the first and second windings over the surface of the middle dielectric layer connect with the remaining portions of the first and second windings over the surface of the bottom dielectric through via plugs.
    • 具有堆叠结构的集成变压器包括中间电介质层,底部电介质层,第一绕组和第二绕组。 第一绕组的一部分设置在中间电介质层的表面上,并且第一绕组的剩余部分设置在底部电介质层的表面上。 第二绕组的一部分设置在中间电介质层的表面上,并且第二绕组的剩余部分设置在底部电介质层的表面上。 第二绕组不与第一绕组相交。 中间电介质层表面上的第一和第二绕组的部分通过通孔连接在底部电介质的表面上的第一和第二绕组的剩余部分。
    • 6. 发明授权
    • Integrated transformer with stack structure
    • 集成式变压器堆叠结构
    • US07164339B2
    • 2007-01-16
    • US10906540
    • 2005-02-24
    • Kai-Yi Huang
    • Kai-Yi Huang
    • H01F5/00
    • H01F17/0006H01F27/2804H01F2017/0046H01F2021/125
    • An integrated transformer with a stack structure comprises a middle dielectric layer, a bottom dielectric layer, a first winding and a second winding. A portion of the first winding is disposed over a surface of the middle dielectric layer and the remaining portion of the first winding is disposed over a surface of the bottom dielectric layer. A portion of the second winding is disposed over the surface of the middle dielectric layer and the remaining portion of the second winding is disposed over the surface of the bottom dielectric layer. The second winding doesn't intersect with the first winding. The portions of the first and second windings over the surface of the middle dielectric layer connect with the remaining portions of the first and second windings over the surface of the bottom dielectric through via plugs.
    • 具有堆叠结构的集成变压器包括中间电介质层,底部电介质层,第一绕组和第二绕组。 第一绕组的一部分设置在中间电介质层的表面上,并且第一绕组的剩余部分设置在底部电介质层的表面上。 第二绕组的一部分设置在中间电介质层的表面上,并且第二绕组的剩余部分设置在底部电介质层的表面上。 第二绕组不与第一绕组相交。 中间电介质层表面上的第一和第二绕组的部分通过通孔连接在底部电介质的表面上的第一和第二绕组的剩余部分。
    • 8. 发明授权
    • Stacked structure of a spiral inductor
    • 螺旋电感器的堆叠结构
    • US07936245B2
    • 2011-05-03
    • US12773024
    • 2010-05-04
    • Kai-Yi HuangYuh-Sheng JeanTa-Hsun Yeh
    • Kai-Yi HuangYuh-Sheng JeanTa-Hsun Yeh
    • H01F5/00
    • H01F17/0006
    • A stacked structure of a spiral inductor includes a first metal layer, a second metal layer, a first set of vias, and a second set of vias. The first metal layer includes a first segment, a second segment, and a third segment, wherein the layout direction of the third segment is different from the layout direction of the first and second segments. The second metal layer includes a fourth segment, a fifth segment, and a sixth segment connected to the fifth segment, wherein the layout direction of the sixth segment is different from the layout direction of the fourth and fifth segments. The first set of vias connects the first and fourth segments, and they construct a first shunt winding. The second set of vias connects the second and fifth segments, and they construct a second shunt winding. The third and sixth segments construct a crossover region.
    • 螺旋电感器的堆叠结构包括第一金属层,第二金属层,第一组通孔和第二组通孔。 第一金属层包括第一段,第二段和第三段,其中第三段的布局方向与第一段和第二段的布局方向不同。 第二金属层包括第四段,第五段和连接到第五段的第六段,其中第六段的布局方向与第四段和第五段的布局方向不同。 第一组通孔连接第一和第四段,并构成第一个分流绕组。 第二组通孔连接第二和第五段,并且它们构成第二分流绕组。 第三和第六段构成交叉区域。
    • 10. 发明申请
    • TRANSCEIVER HAVING AN ON-CHIP CO-TRANSFORMER
    • 具有片上共变换器的收发器
    • US20130267185A1
    • 2013-10-10
    • US13857922
    • 2013-04-05
    • Yu-Hsin ChenKai-Yi Huang
    • Yu-Hsin ChenKai-Yi Huang
    • H04B1/44
    • H04B1/44
    • A transceiver formed on an integrated-circuit substrate is disclosed. The transceiver includes: a co-transformer comprising first, second and third windings which wrap each other but are separated from each other; a power amplifier coupled to the co-transformer; and a low-noise amplifier coupled to the co-transformer; wherein the co-transformer is configured for converting a first signal from the power amplifier into a second signal to be transmitted by an antenna when the transceiver is in its transmitter mode, and for converting a third signal from the antenna into a fourth signal to be outputted to the low-noise amplifier when the transceiver is in its receiver mode.
    • 公开了一种形成在集成电路基板上的收发器。 收发器包括:共变压器,包括彼此包裹但彼此分离的第一,第二和第三绕组; 耦合到共变压器的功率放大器; 以及耦合到共变压器的低噪声放大器; 其中,所述共变压器被配置为当所述收发器处于其发射器模式时将来自所述功率放大器的第一信号转换为由天线发射的第二信号,并且用于将来自所述天线的第三信号转换为第四信号为 当收发器处于接收器模式时,输出到低噪声放大器。