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    • 2. 发明申请
    • Switching circuitry for reconfigurable arrays of sensor elements
    • 用于可重构阵列的传感器元件的开关电路
    • US20050169107A1
    • 2005-08-04
    • US10978196
    • 2004-10-29
    • Kai ThomeniusRayette FisherRobert WodnickiChristopher HazardLowell SmithDavid Mills
    • Kai ThomeniusRayette FisherRobert WodnickiChristopher HazardLowell SmithDavid Mills
    • A61B8/00B06B1/02B06B1/06H04R17/00E03B7/07F16K37/00F17D3/00G01S15/00H04B1/02
    • H03M11/00B06B1/0207B06B1/0292G01N29/262G01N2291/044G01N2291/106
    • A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.
    • 一种包括可通过交换网络重新配置的传感器阵列的设备。 传感器可以是光学,热或压力传感器或超声换能器。 更具体地,该装置包括:多个传感器元件; 多条总线; 一组接入开关,用于选择性地将一行中的传感器元件连接到总线,其中一个接入开关连接到第一传感器元件; 多个矩阵开关组,每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件,矩阵开关中的一个连接到第一传感器元件,并且 第二传感器元件,其不是该组传感器元件的构件; 以及控制电路,其根据选择的开关配置来控制接入开关和矩阵开关,使得第一传感器元件经由所述一个接入开关连接到总线,同时第二传感器元件连接到所述 一个接入开关经由所述一个矩阵开关。
    • 4. 发明申请
    • Integrated interface electronics for reconfigurable sensor array
    • 用于可重构传感器阵列的集成接口电子设备
    • US20050094490A1
    • 2005-05-05
    • US10977930
    • 2004-10-29
    • Kai ThomeniusRayette FisherRobert WodnickiWilliam Burdick
    • Kai ThomeniusRayette FisherRobert WodnickiWilliam Burdick
    • A61B8/00B06B1/02B06B1/06H04R17/00
    • B06B1/0292G01N29/06G01N29/262G01N2291/106H01L2924/0002H01L2924/00
    • An integrated switch matrix for reconfiguring subelements of a mosaic sensor array to form elements. The configuration of the switch matrix is fully programmable. The switch matrix includes access switches that connect subelements to bus lines and matrix switches that connect subelements to subelements. Each subelement has a unit switch cell comprising at least one access switch, at least one matrix switch, a respective memory element for storing the future state of each switch, and a respective control circuit for each switch. The access and matrix switches are of a type having the ability to memorize control data representing the current switch state of the switch, which control data includes a data bit input to turn-on/off circuits incorporated in the control circuit. The sensor array and the switching matrix may be built in different strata of a co-integrated structure or they may be built on separate wafers that are electrically connected. If the sensors are arranged on a hexagonal grid, the unit switch cells may be arranged on either a hexagonal or rectangular grid.
    • 一种用于重新配置马赛克传感器阵列的子元素以形成元素的集成开关矩阵。 开关矩阵的配置是完全可编程的。 开关矩阵包括将子元件连接到总线线路的接入开关和将子元件连接到子元件的矩阵开关。 每个子元件具有包括至少一个存取开关,至少一个矩阵开关,用于存储每个开关的未来状态的相应存储元件以及每个开关的相应控制电路的单元开关单元。 存取和矩阵开关是具有存储表示开关的当前开关状态的控制数据的能力的类型,该控制数据包括输入到控制电路中的导通/截止电路的数据位。 传感器阵列和开关矩阵可以内置在共同一体化结构的不同层中,或者它们可以被构建在电连接的分开的晶片上。 如果传感器布置在六边形网格上,则单元开关单元可以布置在六边形或矩形网格上。
    • 6. 发明申请
    • Integrated low-voltage transmit/receive switch for ultrasound imaging system
    • 用于超声成像系统的集成低压发射/接收开关
    • US20050154300A1
    • 2005-07-14
    • US10749977
    • 2003-12-30
    • Robert WodnickiRayette Fisher
    • Robert WodnickiRayette Fisher
    • A61B8/00B06B1/02G01N29/06G03B42/06H04B11/00
    • H04B11/00B06B1/0215
    • A low-voltage transmit/receive switch that acts to protect sensitive low-voltage electronics from high-voltage pulse signals used to drive an ultrasonic transducer. The low-voltage transmit/receive switch comprises a series resistor and a parallel MOSFET pair. The parallel MOSFETs are low-voltage devices. The low-voltage transmit/receive switch is placed between the output of a high-voltage pulser and the input of a receive pre-amplifier. If dual high- and low-voltage pulsers are used, then the low-voltage pulser is connected so that it is also protected from the high-voltage pulse signals by the low-voltage transmit/receive switch. In an alternative embodiment, the low-voltage pulser and the receive pre-amplifier are protected from the high-voltage pulse signals by a high-voltage transmit/receive switch.
    • 低压发射/接收开关,用于保护敏感的低压电子元件免受用于驱动超声波换能器的高电压脉冲信号。 低压发射/接收开关包括串联电阻和并联MOSFET对。 并联MOSFET是低压器件。 低压发射/接收开关位于高压脉冲发生器的输出端和接收前置放大器的输入端之间。 如果使用双高压脉冲发生器,则连接低压脉冲发生器,以便通过低压发射/接收开关保护其免受高电压脉冲信号的影响。 在替代实施例中,通过高压发射/接收开关来保护低压脉冲发生器和接收前置放大器免受高电压脉冲信号的影响。
    • 7. 发明申请
    • Transmit and receive interface array for highly integrated ultrasound scanner
    • 发射和接收接口阵列,用于高度集成的超声波扫描仪
    • US20070016026A1
    • 2007-01-18
    • US11172599
    • 2005-06-29
    • Kai ThomeniusRobert WodnickiYe-Ming Li
    • Kai ThomeniusRobert WodnickiYe-Ming Li
    • A61B8/00
    • G10K11/341A61B8/56G01S7/5208
    • An ultrasonic transducer probe having a highly integrated interface circuit array. Low-voltage transmit control signals from the system are transmitted on the system transmit channels via the ultrasound probe cable and into the interface circuit array. These transmit control signals are routed through the interface circuit array using a dense switching matrix. Once the low-voltage transmit control signals reach individual cells within the interface array, they are decoded and used to control local high-voltage pulser circuits to drive individual ultrasound transducer elements made up of selected subelements that are co-integrated with the interface electronics. The interface cell circuitry further comprises a high-voltage transmit/receive switch, which is closed when the high-voltage pulser is transmitting to protect the low-voltage components.
    • 具有高度集成的接口电路阵列的超声换能器探针。 来自系统的低电压发射控制信号通过超声探头电缆在系统发射通道上传输到接口电路阵列中。 这些发送控制信号使用密集的交换矩阵通过接口电路阵列路由。 一旦低压发射控制信号到达接口阵列内的单个小区,就将它们解码并用于控制本地高压脉冲发生器电路,以驱动由与接口电子器件共同集成的选定子元件组成的各个超声换能器元件。 接口单元电路还包括高压发射/接收开关,当高压脉冲发生器正在传输时,该高压发射/接收开关闭合以保护低电压部件。
    • 9. 发明申请
    • Ultrasound Imaging System
    • 超声成像系统
    • US20080183078A1
    • 2008-07-31
    • US11669235
    • 2007-01-31
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • A61B8/00
    • A61B8/00A61B1/0005B06B1/0622G01S7/5208G01S15/8925G01S15/8927G03B42/06
    • An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
    • 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。