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1. 发明公开

EP2717658A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD 有权
标题翻译：接线板和制造接线板的方法
公开(公告)号：EP2717658A1
公开(公告)日：2014-04-09
申请号：EP12789574.6
申请日：2012-05-23
申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
发明人： OZAKI, Kiminori , KOIKE, Yasuhiro , ASANO, Hiroaki , SATO, Harumitsu , WATANABE, Hiroki , KACHI, Tadayoshi , SUZUKI, Takahiro , SHIMADU, Hitoshi , FURUTA, Tetsuya , MIYAKE, Masao , HAYAKAWA, Takahiro , ASAI, Tomoaki , YAMAUCHI, Ryou
IPC分类号： H05K1/11 , H05K3/40
CPC分类号： H05K1/11 , H05K1/0263 , H05K1/115 , H05K3/0094 , H05K3/4038 , H05K3/4046 , H05K3/4084 , H05K2201/0305 , H05K2201/09509 , H05K2201/0969 , H05K2203/033 , H05K2203/1178 , Y10T29/49165
摘要： An electrically conductive path (50) is configured from a first copper plate (30), a second copper plate (40), and solder (60). The first copper plate (30) has a first bent section (32) extended from a first joining section (31) joined to an electrically insulative board (20) and bent toward the rear surface of the electrically insulative board (20). The second copper plate (40) has a second bent section (42) which is extended from a second joining section (41) joined to the electrically insulative board (20), is bent toward the front surface of the electrically insulative board (20), and is disposed so as to cover, together with the first bent section (32), the inner wall surface of a base-material through-hole (21). Through-holes (43, 44) are provided in the portions of the second copper plate (40) which face the inside of the base-material through-hole (21). Solder (60) is filled between the first bent section (32) and the second bent section (42) including the insides of the through-holes (43, 44). The configuration provides a wiring board and a method for manufacturing a wiring board which are configured so that a large current can be conducted through the electrically conductive path which connects the first copper plate (30) and the second copper plate (40) and that the amount of an electricity conductive material which forms the electrically conduction path can be reduced.
摘要翻译：导电路径（50）由第一铜板（30），第二铜板（40）和焊料（60）构成。第一铜板30具有从接合到电绝缘板20并朝电绝缘板20的后表面弯曲的第一接合部分31延伸的第一弯曲部分32。第二铜板40具有从与电绝缘板20接合的第二接合部41延伸并朝向电绝缘板20的前表面弯曲的第二弯曲部42，配置成与第一弯曲部32一起覆盖基材贯通孔21的内壁面。在第二铜板（40）的与基材贯通孔（21）的内侧相对的部分设有贯通孔（43,44）。在第一弯曲部分32和包括通孔43,44的内侧的第二弯曲部分42之间填充焊料60。该结构提供一种布线基板以及布线基板的制造方法，该布线基板以及布线基板的制造方法构成为能够通过连接第一铜板（30）和第二铜板（40）的导电路径传导大电流，可以减少形成导电路径的导电材料的量。

2. 发明授权

EP2717658B1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD 有权
标题翻译：接线板和制造接线板的方法
公开(公告)号：EP2717658B1
公开(公告)日：2017-10-18
申请号：EP12789574.6
申请日：2012-05-23
申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
发明人： OZAKI, Kiminori , KOIKE, Yasuhiro , ASANO, Hiroaki , SATO, Harumitsu , WATANABE, Hiroki , KACHI, Tadayoshi , SUZUKI, Takahiro , SHIMADU, Hitoshi , FURUTA, Tetsuya , MIYAKE, Masao , HAYAKAWA, Takahiro , ASAI, Tomoaki , YAMAUCHI, Ryou
IPC分类号： H05K3/40 , H05K1/02 , H05K1/11 , H05K3/00
CPC分类号： H05K1/11 , H05K1/0263 , H05K1/115 , H05K3/0094 , H05K3/4038 , H05K3/4046 , H05K3/4084 , H05K2201/0305 , H05K2201/09509 , H05K2201/0969 , H05K2203/033 , H05K2203/1178 , Y10T29/49165

3. 发明公开

EP3267477A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：EP3267477A1
公开(公告)日：2018-01-10
申请号：EP17178953.0
申请日：2017-06-30
申请人： Kabushiki Kaisha Toyota Jidoshokki
发明人： KATO, Naoki , MORI, Shogo , SATO, Harumitsu , WATANABE, Hiroki , YUGUCHI, Hiroshi , NISHIMURA, Koji
IPC分类号： H01L23/13 , H01L25/065 , H01L23/498
CPC分类号： H01L23/50 , H01L23/057 , H01L23/16 , H01L23/24 , H01L24/83 , H01L25/0655 , H01L25/072 , H01L25/18 , H01L2224/40137 , H01L2224/83908 , H01L2224/83951 , H01L2224/83986 , H01L2924/10253 , H01L2924/10272 , H01L2924/13055
摘要： A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.
摘要翻译：半导体模块包括布线基板和安装在布线基板上的两个半导体器件。半导体模块包括具有包括四个侧壁的矩形框体的外壳。壳体包括桥接第一侧壁的梁。汇流条包括两个端部，各自从绝缘基板的厚度方向上的一个端部延伸的竖直部分，各自与竖直部分中的一个连续延伸的弯曲部分以及与弯曲部分连续延伸的延伸部。一部分延伸部分嵌入外壳中。

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