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    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND IMAGING DEVICE
    • 半导体器件和成像器件
    • US20160268345A1
    • 2016-09-15
    • US14943221
    • 2015-11-17
    • Kabushiki Kaisha Toshiba
    • Takashi MIYAZAKIHideyuki FUNAKIYoshinori llDAlsao TAKASUYuki NOBUSA
    • H01L27/30H01L51/44
    • H01L27/307H01L27/1461H01L27/1464H01L27/14645H01L27/14667H01L27/14694H01L51/424Y02E10/549
    • According to an embodiment, a semiconductor device includes a silicon substrate, a photoelectric conversion layer, a termination layer, and an electrode layer. In the silicon substrate, first semiconductor regions and second semiconductor regions are alternately arranged along a first surface on a light incident side of the silicon substrate. The first semiconductor regions are doped with impurities of first concentration and have a conductivity of either one of p-type and n-type. The second semiconductor regions are doped with impurities of a second concentration lower than the first concentration and have a conductivity of the other type. The photoelectric conversion layer is disposed on a first surface side of the silicon substrate. The termination layer is disposed between the silicon substrate and the photoelectric conversion layer, in contact with the first surface, and to terminate dangling bonds of the silicon substrate. The electrode layer is provided on the light incident side.
    • 根据实施例,半导体器件包括硅衬底,光电转换层,端接层和电极层。 在硅衬底中,第一半导体区域和第二半导体区域沿着硅衬底的光入射侧的第一表面交替布置。 第一半导体区域掺杂有第一浓度的杂质并且具有p型和n型中的任一种的导电性。 第二半导体区掺杂有低于第一浓度的第二浓度的杂质,并具有另一种类型的导电性。 光电转换层设置在硅衬底的第一表面侧。 端接层设置在硅衬底和光电转换层之间,与第一表面接触,并终止硅衬底的悬挂键。 电极层设置在光入射侧。