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    • 2. 发明专利
    • NOVEL HEAT-RESISTANT RESIN
    • JPH09157340A
    • 1997-06-17
    • JP34568295
    • 1995-12-08
    • KYOEISHA CHEMICAL
    • KUKI YUKIHIROTAKENAKA NAOI
    • C08F299/00C08F290/00C09D4/02C09D163/10
    • PROBLEM TO BE SOLVED: To obtain a novel heat-resistant resin which has a high glass transition temp. and low moisture absorption and is less likely to create stress and tough by using an epoxy (meth)acrylate resin (BE) having a biphenyl skeleton as a functional polymer material. SOLUTION: The BE resin is represented by formula I (wherein R represents H or methyl; and (n) is an integer of not less than 0) and prepd. by a general epoxy synthetic process. Specifically, it is easily prepd., in the absence of a solvent, by reacting an epoxy resin, with both terminals being glycidyl etherified, with (meth)acrylic acid in the presence of a catalyst (e.g. a quaternary salt or a Lewis base with specific examples thereof including triethylbenzyl chloride) and a polymn. inhibitor (e.g. hydroquinone) at 90 to 100 deg.C for 12 to 15hr. The BE resin may be used, as a photosensitive material, either alone or in combination with other base resin(s) and a reactive diluent for applications such as various coating agents (particularly applications where heat resistance is required), UV coating materials, or resists.