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    • 7. 发明公开
    • Optical printed circuit board module for high speed data transmission between high speed chips
    • 用于高速数据传输的光电印刷电路板模块
    • KR20120063961A
    • 2012-06-18
    • KR20100125155
    • 2010-12-08
    • KOREA ADVANCED INST SCI & TECH
    • PARK HYO HOONLEE TAE WOOCHO MU HEEIKECHI AUGUSTINE UKAEGBUCHOI BYEONG HO
    • G02B6/12G02B6/42
    • G02B6/428G02B6/138G02B6/43G02B2006/12073H05K1/0274H05K2201/10121
    • PURPOSE: A PCB(Printed Circuit Board) with an optical PCB module, which is a sub board, for high speed data transmission between high speed chips is provided to eliminate interference of peripheral components in optical connection while being attached to a main board. CONSTITUTION: An optical PCB has an optical waveguide forming a plurality of optical channels. The optical PCB exposes an end portion of the optical waveguide to each both end surface and includes an aligning hole. An optical PCB(100) includes a unit mounting unit in which a wiring pattern is formed. The wiring pattern includes a plurality of wiring lines for electrical connection with the outside of the optical PCB module. An IC packaging unit(200) comprises an optical transmitting device or an optical receiving device, a chip mounting unit, and a conductive line. The optical transmitting device or the optical receiving device receives and transmits light through the optical waveguide. The chip mounting unit equips a driving IC driving the optical transmitting device or the optical receiving device.
    • 目的:提供一种PCB(印刷电路板),其具有作为子板的光学PCB模块,用于在高速芯片之间进行高速数据传输,以消除外部组件在连接到主板时的光学连接中的干扰。 构成:光学PCB具有形成多个光通道的光波导。 光学PCB将光波导的端部暴露于每个两个端面,并且包括对准孔。 光学PCB(100)包括其中形成布线图案的单元安装单元。 布线图案包括用于与光学PCB模块的外部电连接的多条布线。 IC封装单元(200)包括光发送装置或光接收装置,芯片安装单元和导线。 光发送装置或光接收装置通过光波导接收和透射光。 芯片安装单元配备驱动IC驱动光传输装置或光接收装置的驱动IC。
    • 10. 发明申请
    • OPTICAL INTERCONNECTION SYSTEM USING OPTICAL WAVEGUIDE-INTEGRATED OPTICAL PRINTED CIRCUIT BOARD
    • 使用光波导光电印刷电路板的光学互连系统
    • WO2009041771A2
    • 2009-04-02
    • PCT/KR2008005627
    • 2008-09-22
    • ICU RES & IND COOP GROUPKIM DO WONLEE TAE WOOPARK HYO HOON
    • KIM DO WONLEE TAE WOOPARK HYO HOON
    • G02B6/43
    • G02B6/43G02B6/4214H05K1/0274
    • An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on a top-surface of the transmitter-unit optical interconnection block exposed to a top-surface of the optical PCB; a driver integrated circuit that is formed on the top-surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on a top-surface of the receiver-unit optical interconnection block exposed to the top-surface of the optical PCB; and a receiver integrated circuit that is formed on the top-surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The top-surfaces of the respective optical interconnection blocks are substantially aligned with the top-surface of the PCB.
    • 提供光互连系统。 光互连系统包括光学印刷电路板(PCB),其包括用于将光路弯曲预定角度的发射器单元和接收器单元光学互连块,包括插入每个光路中的光波导的单个单元光波导 以连接发射机单元和接收机单元光学互连块的光路,以及将其中集成有单一单元光波导的PCB连接在一起; 在暴露于光学PCB的顶表面的发射器单元光学互连块的顶表面上与光波导成一直线形成的发光元件; 驱动器集成电路,其形成在光学PCB的顶表面上并电连接到发光元件和光学PCB; 在暴露于光学PCB的顶表面的接收单元光互连块的顶表面上与光波导成一直线形成的光接收元件; 以及形成在光学PCB的顶表面上并电连接到光接收元件和光学PCB的接收器集成电路。 各个光互连块的顶表面基本上与PCB的顶表面对准。