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1. 发明申请

WO2006114745A2 LIGHT SOURCE COMPRISING LED ARRANGED IN RECESS 审中-公开
标题翻译：包含发光二极管的光源
公开(公告)号：WO2006114745A2
公开(公告)日：2006-11-02
申请号：PCT/IB2006/051244
申请日：2006-04-21
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , VAN OS, Koen
发明人： DE SAMBER, Marc, A. , VAN OS, Koen
IPC分类号： H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L33/642 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light source comprising a substrate (1) having a first side and an opposing second side, at least one recess (2) being arranged in said first side of said substrate, a circuitry (4) at least partly arranged on said substrate (1), and at least one LED (3) being arranged in said at least one recess (2) and connected to said circuitry (4) is provided. The surface of said at least one recess (2) is continuous and is physically separated from said second side by substrate material. By arranging the LED in such a recess in the substrate, cross talk between adjacent LEDs is reduced, a good mechanical stability of the light source is maintained, and the thermal path through the substrate is reduced.
摘要翻译：一种光源，包括具有第一侧和相对的第二侧的衬底（1），至少一个凹槽（2）布置在所述衬底的所述第一侧中，至少部分地布置在所述衬底（1）上的电路），并且设置在所述至少一个凹部（2）中并连接到所述电路（4）的至少一个LED（3）。所述至少一个凹部（2）的表面是连续的，并且通过基底材料与所述第二侧物理分离。通过将LED布置在基板的这种凹部中，相邻LED之间的串扰减少，保持了良好的光源的机械稳定性，并且减小了通过基板的热路径。

2. 发明申请

WO2006075290A1 LIGHTING ARRANGEMENT 审中-公开
标题翻译：照明装置
公开(公告)号：WO2006075290A1
公开(公告)日：2006-07-20
申请号：PCT/IB2006/050087
申请日：2006-01-10
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , WEEKAMP, Johannus, W. , VAN OS, Koen , SWEEGERS, Norbertus, A., M.
发明人： DE SAMBER, Marc, A. , WEEKAMP, Johannus, W. , VAN OS, Koen , SWEEGERS, Norbertus, A., M.
IPC分类号： H01L33/00
CPC分类号： H05K3/3405 , F21K9/00 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/01087 , H01L2924/12041 , H05K2201/0919 , H05K2201/10106 , H05K2201/10446 , H01L2924/00014
摘要： The present invention relates to a light emitting arrangement comprising at least one LED, attached to an edge of a substrate. The substrate comprises planar conductors, extending in planes parallel to the main surfaces of the substrate and being able to connect the LED to a circuit on a PCB to which the light emitting arrangement is attached. At least one of the conductors extend in a plane between the first and second surface, i.e. buried beneath one of the surfaces. This allows light emitting arrangements of this kind to be densely packed. The invention also relates to a method for producing such a lighting arrangement.
摘要翻译：本发明涉及一种发光装置，其包括至少一个LED，其连接到基板的边缘。衬底包括平面导体，其平行于衬底的主表面延伸，并且能够将LED连接到发光装置所连接的PCB上的电路。导体中的至少一个在第一和第二表面之间的平面内延伸，即埋在一个表面之下。这使得这种类型的发光布置被密集地包装。本发明还涉及一种用于制造这种照明装置的方法。

3. 发明申请

WO2006054228A3 ILLUMINATOR AND METHOD FOR PRODUCING SUCH ILLUMINATOR 审中-公开
公开(公告)号：WO2006054228A3
公开(公告)日：2006-05-26
申请号：PCT/IB2005/053742
申请日：2005-11-14
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , HOELEN, Christoph, G., A. , VAN DEN ACKERVEKEN, Antonius, C., J., C. , RUTJES, Cornelius, F., J. , VAN OS, Koen , DE SAMBER, Marc, A. , TREURNIET, Theodoor, C.
发明人： HOELEN, Christoph, G., A. , VAN DEN ACKERVEKEN, Antonius, C., J., C. , RUTJES, Cornelius, F., J. , VAN OS, Koen , DE SAMBER, Marc, A. , TREURNIET, Theodoor, C.
IPC分类号： H01L33/00
摘要： The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light emitting duode (LED) chip (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one LED chip. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.

4. 发明申请

WO2006003563A2 LIGHT EMITTING DIODE MODULE 审中-公开
标题翻译：发光二极管模块
公开(公告)号：WO2006003563A2
公开(公告)日：2006-01-12
申请号：PCT/IB2005/052068
申请日：2005-06-23
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , HOELEN, Christoph, G., A. , VAN GRUNSVEN, Eric, C., E. , VAN OS, Koen
发明人： DE SAMBER, Marc, A. , HOELEN, Christoph, G., A. , VAN GRUNSVEN, Eric, C., E. , VAN OS, Koen
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/62 , H01L33/64 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/12041 , H01L2224/0401
摘要： The present invention relates to a LED module (10) comprising a substrate (12), at least one LED chip (20) mounted on a first side of said substrate, and an optical element (21) covering the LED chip(s) (20). The substrate (12) is further provided with at least one via channel (22) extending from the first side of the substrate to a second opposite side of the substrate, whereby the via channel(s) is provided with conducting means for electrically connecting the at least one LED chip (20) to a control circuit (32). By providing the substrate with via channels with conducting means, the control circuit may be connected at the second side (the bottom side) or at the edge of the substrate. Thus, no top mounted electrical interface is required from the substrate, which is advantageous with respect to miniaturization, light emission, etcetera.
摘要翻译：本发明涉及一种LED模块（10），其包括基板（12），安装在所述基板的第一侧上的至少一个LED芯片（20）和覆盖所述LED芯片的光学元件（21） 20）。衬底（12）还设置有从衬底的第一侧延伸到衬底的第二相对侧的至少一个通孔（22），由此通孔通道设置有用于电连接至少一个LED芯片（20）连接到控制电路（32）。通过为基板提供具有导电装置的通孔，控制电路可以在基板的第二侧（底侧）或边缘处连接。因此，从衬底不需要顶部安装的电接口，这对于小型化，发光等是有利的。

5. 发明申请

WO2006067689A2 PRINTED CIRCUIT BOARD ARRANGEMENT 审中-公开
标题翻译：印刷电路板布置
公开(公告)号：WO2006067689A2
公开(公告)日：2006-06-29
申请号：PCT/IB2005/054244
申请日：2005-12-14
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , VAN OS, Koen
发明人： DE SAMBER, Marc, A. , VAN OS, Koen
CPC分类号： H05K1/0206 , H05K2201/066 , H05K2201/09509 , H05K2201/09781
摘要： The present invention relates to a printed circuit board arrangement with a multi- layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).
摘要翻译：本发明涉及具有多层衬底（1,2）的印刷电路板装置，该多层衬底具有埋入导体（4）和接触区域（3），该接触区域连接到导体（4）并且设置在底物。为了改善掩埋导体的冷却，金属冷却区域（6）设置在导体（4）上方，并通过一个或多个通孔导体（7）与导体连接。

6. 发明申请

WO2003085736A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：WO2003085736A1
公开(公告)日：2003-10-16
申请号：PCT/IB2003/001296
申请日：2003-04-11
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , WEEKAMP, Johannus, W.
发明人： DE SAMBER, Marc, A. , WEEKAMP, Johannus, W.
IPC分类号： H01L23/538
CPC分类号： H01L24/83 , B81B7/007 , H01L21/568 , H01L21/6835 , H01L23/057 , H01L23/10 , H01L23/3107 , H01L23/36 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/82 , H01L2221/68359 , H01L2221/68363 , H01L2224/04105 , H01L2224/05568 , H01L2224/05573 , H01L2224/12105 , H01L2224/13111 , H01L2224/13144 , H01L2224/24227 , H01L2224/29111 , H01L2224/2919 , H01L2224/37599 , H01L2224/73253 , H01L2224/73267 , H01L2224/81801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/01007 , H01L2924/01031 , H01L2924/01015 , H01L2924/01049 , H01L2924/0105 , H01L2924/00 , H01L2224/37099
摘要： The electronic device (100) comprises a body (20) with a cavity (30) wherein a semiconductor element (10) and a thermally conductive layer (33) are present. The cavity (30) is filled with an encapsulation (35) of an electrically insulating material wherein contact faces (47, 48) are mechanically anchored.
摘要翻译：电子设备（100）包括具有空腔（30）的主体（20），其中存在半导体元件（10）和导热层（33）。空腔（30）填充有电绝缘材料的封装（35），其中机械地锚定接触面（47,48）。

7. 发明申请

WO2006103596A2 FLEXIBLE LED ARRAY 审中-公开
标题翻译：柔性LED阵列
公开(公告)号：WO2006103596A2
公开(公告)日：2006-10-05
申请号：PCT/IB2006/050877
申请日：2006-03-22
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , SIKKENS, Marten , EGGINK, Hendrik, J.
发明人： DE SAMBER, Marc, A. , SIKKENS, Marten , EGGINK, Hendrik, J.
IPC分类号： H01L33/64
CPC分类号： H05B33/26 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/647 , H01L2224/48091 , H01L2924/30107 , H05K1/0203 , H05K1/189 , H01L2924/00
摘要： A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3 a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.
摘要翻译：一种发光器件，包括具有单个结构化导电层（5）的柔性衬底（2）和布置在所述衬底（2）上的多个LED（3），所述结构化导电层（5）形成用于驱动的电极所述LED（3）。结构化导电层包括多个散热焊盘（8），每个散热焊盘具有明显大于每个LED（3）的面积的面积，并且每个LED（3a）热连接到所述焊盘（8a）中的至少一个），并且串联地电连接在两个焊盘（8a，8b）之间。通过这种设计，每个LED被热连接到相对较大的散热区域，并且LED中积聚的热能将分布在该区域上，然后从该区域向上和向下散开。由于可以通过单个导电层处理寻址，与多层基板相比，衬底的柔性得到改善。通过将每个LED串联连接在两个焊盘之间，导电层的非常大的部分可以用于焊盘，并且非常小的面积需要由导电轨道占据，否则可能是单层设计的问题。

8. 发明申请

WO2004107147A2 OPTO-ELECTRONIC INPUT DEVICE, METHOD OF MANUFACTURING SUCH A DEVICE AND METHOD OF MEASURING THE MOVEMENT OF AN OBJECT BY MEANS OF SUCH A DEVICE 审中-公开
标题翻译：光电输入装置，制造这种装置的方法以及通过这种装置的方法测量对象的运动的方法
公开(公告)号：WO2004107147A2
公开(公告)日：2004-12-09
申请号：PCT/IB2004/050760
申请日：2004-05-24
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , VRANKEN, Roger, A. , WEEKAMP, Johannus, W.
发明人： DE SAMBER, Marc, A. , VRANKEN, Roger, A. , WEEKAMP, Johannus, W.
IPC分类号： G06F3/00
CPC分类号： G06F3/03547 , G06F3/0421
摘要： The invention relates to an opto-electronic input device (10), wherein the input is formed by detected movements of an object (M), which opto-electronic input device is provided with an optical module (11) comprising at least one laser (1) mounted on a carrier plate (4), which laser emits a radiation beam (S) that is guided to a plate (V) close to the object (M) and, after reflection therefrom, causes a change in the resonant cavity of the laser (1) which is representative of the movement of the object (M), and which is measured within the module (11). According to the invention, the plate (V) close to the object (M) comprises, within a projection of the object (M), a first portion (VI) through which the beam (S) can pass and which has a fixed position with respect to the carrier plate (4), and a second portion (V2) which is movable in a direction perpendicular to the carrier plate (4) and which comprises signal means which, when they are moved, provide a signal that is observable by a user of the device (10). In this way, the device (10) provides feedback to a human user through his tactile sense and preferably also through his auditory sense. The invention also comprises a method of manufacturing such a device and a method of inputting the movement of an object (M) using such a device.
摘要翻译：本发明涉及一种光电输入设备（10），其中通过物体（M）的检测到的移动来形成输入，该光电输入设备设置有包括至少一个激光器的光学模块（11） 1），其安装在载体板（4）上，该激光器发射被引导到靠近物体（M）的板（V）的辐射束（S），并且在其反射之后，谐振腔激光器（1），其代表物体（M）的移动，并且在模块（11）内测量。根据本发明，靠近物体（M）的板（V）在物体（M）的突出部内包括第一部分（VI），梁（S）可以穿过该第一部分（VI）并具有固定位置和相对于承载板（4）的第二部分（V2），以及可沿垂直于承载板（4）的方向移动的第二部分（V2），并且包括信号装置，当信号装置移动时，提供可被设备（10）的用户。以这种方式，设备（10）通过他的触觉来优选地通过他的听觉来向人类用户提供反馈。本发明还包括制造这种装置的方法和使用这种装置输入物体（M）的运动的方法。

9. 发明申请

WO2002103792A2 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件和半导体器件的方法
公开(公告)号：WO2002103792A2
公开(公告)日：2002-12-27
申请号：PCT/IB2002/002305
申请日：2002-06-17
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , WEEKAMP, Johannus, W. , DE SAMBER, Marc, A. , DIJKEN, Durandus, K.
发明人： WEEKAMP, Johannus, W. , DE SAMBER, Marc, A. , DIJKEN, Durandus, K.
IPC分类号： H01L23/538
CPC分类号： H01L23/3107 , H01L21/56 , H01L23/051 , H01L23/66 , H01L25/0652 , H01L2224/05001 , H01L2224/05022 , H01L2224/051 , H01L2224/05571 , H01L2224/056 , H01L2224/16 , H01L2924/01079 , H01L2924/1423 , H01L2924/00014
摘要： The invention relates to a method of manufacturing a semiconductor device (10), wherein a semiconductor element (1) provided with a number of connection regions (2) is fitted between a first, electroconductive plate (3) and a second plate (4), wherein two connection conductors (3A, 3B) are formed, from the first plate (3), for the two connection regions (2A, 2B) of the element (1), wherein a passivating encapsulation (5) is provided between the plates (3, 4) and around the element (1), and wherein the device (10) is formed by applying a mechanical separating technique in two mutually perpendicular directions (L, M). In a method according to the invention, the connection conductors (3A, 3B) are formed by providing a mask (6) on the first conducting plate (3) in such a manner that a part (3C) of the plate (3) situated between the connection regions (2A, 2B) remains exposed, which part is subsequently removed by etching. Such a method enables a very compact discrete or at least semi-discrete semiconductor device (10) to be readily obtained at low cost, while a high yield is achieved. In a preferred embodiment, also further parts (3D) of the conducting plate (3) situated at the location where the device (10) is to be sawn, cut or broken remain uncovered by the mask (6) and are removed during etching.
摘要翻译：本发明涉及一种制造半导体器件（10）的方法，其中在第一导电板（3）和第二板（4）之间安装设有多个连接区域（2）的半导体元件（1），其中，对于所述元件（1）的两个连接区域（2A，2B），从所述第一板（3）形成两个连接导体（3A，3B），其中在所述板（3）和所述元件（1）周围，并且其中所述装置（10）通过在两个相互垂直的方向（L，M）上施加机械分离技术而形成。在根据本发明的方法中，连接导体（3A，3B）通过在第一导电板（3）上设置掩模（6）而形成，使得板（3）的部分（3C）位于在连接区域（2A，2B）之间保持暴露，随后通过蚀刻去除该部分。这种方法使得能够以低成本容易地获得非常紧凑的离散或至少半分立半导体器件（10），同时实现高产率。在优选实施例中，位于设备（10）将被锯，切割或断裂的位置处的导电板（3）的另外的部分（3D）保持未被掩模（6）覆盖，并且在蚀刻期间被移除。

10. 发明申请

WO2002089184A3 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SUPPORT PLATE THEREFOR 审中-公开
公开(公告)号：WO2002089184A3
公开(公告)日：2002-11-07
申请号：PCT/IB2002/001446
申请日：2002-04-22
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DE SAMBER, Marc, A. , VAN VEEN, Nicolaas, J., A. , WEEKAMP, Johannus, W. , VAN GRUNSVEN, Erik, C., E.
发明人： DE SAMBER, Marc, A. , VAN VEEN, Nicolaas, J., A. , WEEKAMP, Johannus, W. , VAN GRUNSVEN, Erik, C., E.
IPC分类号： H01L21/00
摘要： The invention relates to a method of manufacturing a semiconductor device (10) comprising a semiconductor element (1), with two or more elements (1) being attached to a support plate (2). It is often desired in such a case that the elements(1) are positioned on the support plate (2) or on a further support plate (22) at a larger mutual distance than in the semiconductor body (100) in which the elements (1) are formed. According to the invention, the support plate (2) is formed as an array of rigid subplates (2A) to which the elements (1) are attached, and the rigid subplates (2A) are interconnected within the plate (2) by means of one or more flexible elements (3). In this way the elements (1) - after they have been attached to the support plate (2) and after they have been separated from each other within the semiconductor body (100) and after stretching of the flexible elements (3) - can be positioned in an accurate manner at a larger mutual distance. Subsequently - or after having been transferred to a further plate (22) - the elements (1) may be provided with an encapsulation (20) and can be mounted on to individual semiconductor devices (10).

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