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1. 发明申请

WO2005038882A3 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：电子装置及其制造方法
公开(公告)号：WO2005038882A3
公开(公告)日：2005-06-02
申请号：PCT/IB2004052068
申请日：2004-10-12
申请人： KONINKL PHILIPS ELECTRONICS NV , SCHRIKS CORNELIS G , DIJKSTRA PAUL , VAN DE WATER PETER W M , GROENHUIS ROELF A J , WEEKAMP JOHANNUS W
发明人： SCHRIKS CORNELIS G , DIJKSTRA PAUL , VAN DE WATER PETER W M , GROENHUIS ROELF A J , WEEKAMP JOHANNUS W
IPC分类号： H01L21/48 , H01L21/68 , H01L23/31 , H01L23/485 , H01L23/498
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/3107 , H01L23/49827 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L2221/68377 , H01L2224/05571 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13144 , H01L2224/16 , H01L2924/00013 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15173 , H01L2924/15313 , H01L2924/18301 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
摘要翻译：该设备有一个载体和一个电子元件。载体具有第一和相对侧，并设有连接层，中间层和接触垫。该元件存在于第一侧并连接至连接层。它至少部分地被封装延伸到中间层图案之间的隔离区中。保护层存在于载体的第二侧，其覆盖接触垫和中间层之间的界面。

2. 发明专利

AT325715T 未知
公开(公告)号：AT325715T
公开(公告)日：2006-06-15
申请号：AT02772699
申请日：2002-10-08
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： BOSMAN JOHAN , VAN DE WATER PETER W M , GROENHUIS ROELF A J
IPC分类号： H01L23/00 , B41M5/24 , B41M5/26 , H01L21/68 , H01L23/544
摘要： The invention relates to a method of manufacturing an electronic component (1), in particular a semiconductor component (1), which is provided with electric connection regions (2), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (3). In a method according to the invention, the component (1) is attached with one (4) of its sides (4, 7) to a foil (5) by means of an adhesive layer (6), and the component is provided, on said side (4), with the mark (M) through the foil (5) and the adhesive layer (6). In this manner, a large number of components (1) can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer (5, 6) is very well feasible. The component (1) can be attached to the foil (6) without contact between the electric connection region (2) and the adhesive layer. Preferably, a large number of components (1) are manufactured simultaneously and within a single body (10) that is attached to the foil (5). After the provision of the mark (M), the components (1) are separated from each other.

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