专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2007000697A2 METHOD OF MANUFACTURING AN ASSEMBLY AND ASSEMBLY 审中-公开
标题翻译：制造装配和装配的方法
公开(公告)号：WO2007000697A2
公开(公告)日：2007-01-04
申请号：PCT/IB2006052040
申请日：2006-06-23
申请人： KONINKL PHILIPS ELECTRONICS NV , DEKKER RONALD , DE SAMBER MARC A , DE HAAS WILHELMUS H , MICHIELSEN THEODORUS M , SCHOOFS FRANCISCUS A C M , VAN VEEN NICOLAAS J A
发明人： DEKKER RONALD , DE SAMBER MARC A , DE HAAS WILHELMUS H , MICHIELSEN THEODORUS M , SCHOOFS FRANCISCUS A C M , VAN VEEN NICOLAAS J A
CPC分类号： H01L24/16 , H01L21/4846 , H01L21/568 , H01L21/6835 , H01L25/0652 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/73204 , H01L2224/81005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , Y02P80/30 , H01L2924/00
摘要： The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.
摘要翻译：组件（100）包括横向受限的半导体衬底区域（15），其中限定了电气元件（20）。其中存在互连结构（21）。在其第一侧（101）处设置有用于联接到电气设备（30）的接触焊盘（25,26），并且在其第二侧（102）处提供与电气元件（11）的连接（20）。端子（52,53）存在于互连结构（21）的第二侧（102）处，并且通过横向移位并与半导体衬底区域隔离的延伸部（22,23）耦合到互连结构（21）（15）。电气装置（30）组装到互连结构（21）的第一侧（101），以及在互连结构（21）的第一侧（101）上延伸以便支撑它的封装（40）存在电气装置（30）的封装。

2. 发明申请

WO2006051448A3 ARRAY OF SPATIAL LIGHT MODULATORS AND METHOD OF PRODUCTION OF A SPATIAL LIGHT MODULATOR DEVICE 审中-公开
标题翻译：空间光调制器阵列及空间光调制器装置的制造方法
公开(公告)号：WO2006051448A3
公开(公告)日：2006-12-21
申请号：PCT/IB2005053588
申请日：2005-11-03
申请人： KONINKL PHILIPS ELECTRONICS NV , DE SAMBER MARC A , DE JONG MICHIEL , NELLISSEN ANTONIUS J M , VAN VEEN NICOLAAS J A
发明人： DE SAMBER MARC A , DE JONG MICHIEL , NELLISSEN ANTONIUS J M , VAN VEEN NICOLAAS J A
IPC分类号： G03F7/20 , G02B26/00
CPC分类号： G03F7/70283 , G03F7/70291 , G03F7/70825 , Y10T29/49826
摘要： For the production of a SLM device, one mounts a spatial light modulator (SLM) (2) on a substrate (3) of the same material as the main material of the SLM (2) to be juxtaposed with the substrate (3). Particularly, silicon based SLMs (2) are mounted on a silicon substrate (3). This leads to arrays of SLMs (2) that maintain a high accuracy with respect to position of the SLMs (2) and planarity. To further improve the planarity, it is preferred to mount the SLMs (2) on the substrate (3) by soldering, using the self-aligning effect of solder connections (20).
摘要翻译：为了制造SLM装置，人们在与SLM（2）的主要材料相同的材料的衬底（3）上将空间光调制器（SLM）（2）安装成与衬底（3）并置。特别地，基于硅的SLM（2）安装在硅衬底（3）上。这导致SLM（2）阵列相对于SLM（2）的位置和平面性保持高精度。为了进一步改善平面性，优选使用焊接连接（20）的自对准效果，通过焊接将SLM（2）安装在基板（3）上。

3. 发明申请

WO2004064151A3 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING A SUBSTRATE 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：WO2004064151A3
公开(公告)日：2005-01-20
申请号：PCT/IB0306345
申请日：2003-12-10
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN VEEN NICOLAAS J A , DE SAMBER MARC A , VAN ARENDONK ANTON P M , WEEKAMP JOHANNUS W
发明人： VAN VEEN NICOLAAS J A , DE SAMBER MARC A , VAN ARENDONK ANTON P M , WEEKAMP JOHANNUS W
IPC分类号： H01L23/14 , H01L23/498 , H01L23/373
CPC分类号： H01L23/49816 , H01L23/10 , H01L23/142 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45099 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15321 , H01L2924/16195 , H01L2924/3011 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Provided is an electronic device (1) with a semiconductor element (5) and a substrate (3) of a material chosen from the group of AlSi, AlSiC, AlSiGe and the like. These materials are provided by providing preferably crystalline particles of a semiconductor material in a thermally conducting matrix material, after which the material is adequately strengthened by a heat treatment. The semiconductor element (5) is a digital integrated circuit with a large number of first contact pad (32) by preference. In such applications, thermal mismatch can easily lead to breakdown of the packaged device. This is prevented through the use of the substrate (3) of the invention.
摘要翻译：提供一种具有半导体元件（5）和选自AlSi，AlSiC，AlSiGe等的材料的衬底（3）的电子器件（1）。这些材料通过在导热基质材料中提供半导体材料的优选结晶颗粒提供，之后通过热处理充分地增强了材料。半导体元件（5）是具有大量第一接触焊盘（32）的数字集成电路。在这种应用中，热失配容易导致封装器件的破坏。这通过使用本发明的基板（3）来防止。

4. 发明申请

WO02089184A2 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE OBTAINED IN THIS WAY AND SUITABLE SUPPORT PLATE FOR THIS SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法，以这种方式获得的半导体器件和适用于该半导体器件的支持板
公开(公告)号：WO02089184A2
公开(公告)日：2002-11-07
申请号：PCT/IB0201446
申请日：2002-04-22
申请人： KONINKL PHILIPS ELECTRONICS NV , DE SAMBER MARC A , VAN VEEN NICOLAAS J A , WEEKAMP JOHANNUS W , VAN GRUNSVEN ERIK C E
发明人： DE SAMBER MARC A , VAN VEEN NICOLAAS J A , WEEKAMP JOHANNUS W , VAN GRUNSVEN ERIK C E
IPC分类号： H01L23/12 , H01L21/00 , H01L21/56 , H01L21/673 , H01L21/68 , H01L21/683
CPC分类号： H01L21/6835 , H01L24/33
摘要： The invention relates to a method of manufacturing a semiconductor device (10) comprising a semiconductor element (1), with two or more elements (1) being attached to a support plate (2). It is often desired in such a case that the elements(1) are positioned on the support plate (2) or on a further support plate (22) at a larger mutual distance than in the semiconductor body (100) in which the elements (1) are formed. According to the invention, the support plate (2) is formed as an array of rigid subplates (2A) to which the elements (1) are attached, and the rigid subplates (2A) are interconnected within the plate (2) by means of one or more flexible elements (3). In this way the elements (1) - after they have been attached to the support plate (2) and after they have been separated from each other within the semiconductor body (100) and after stretching of the flexible elements (3) - can be positioned in an accurate manner at a larger mutual distance. Subsequently - or after having been transferred to a further plate (22) - the elements (1) may be provided with an encapsulation (20) and can be mounted on to individual semiconductor devices (10).
摘要翻译：本发明涉及一种制造包括半导体元件（1）的半导体器件（10）的方法，其中两个或多个元件（1）附接到支撑板（2）。通常希望在这样的情况下，元件（1）以比半导体本体（100）中的相互距离更大的相互距离定位在支撑板（2）上或另一个支撑板（22）上，其中元件 1）。根据本发明，支撑板（2）形成为刚性基板（2A）的阵列，元件（1）附接到其上，并且刚性基板（2A）通过以下方式互连在板（2）内：借助于一个或多个柔性元件（3）。以这种方式，元件（1）在它们已经被附接到支撑板（2）之后并且在半导体本体（100）中彼此分离之后并且在柔性元件（3）的拉伸之后可以是以更大的相互距离以准确的方式定位。随后 - 或者在已经转移到另一个板（22）之后 - 元件（1）可以设置有封装（20），并且可以安装到单个半导体器件（10）上。

5. 发明申请

WO2006092754A3 A METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGES AND PACKAGES MADE 审中-公开
标题翻译：制造半导体封装和封装的方法
公开(公告)号：WO2006092754A3
公开(公告)日：2007-01-18
申请号：PCT/IB2006050599
申请日：2006-02-27
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN VEEN NICOLAAS J A , DEKKER RONALD , TAK COEN C
发明人： VAN VEEN NICOLAAS J A , DEKKER RONALD , TAK COEN C
IPC分类号： H01L21/60 , H01L23/498 , H01L23/538
CPC分类号： H01L23/5389 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2221/68331 , H01L2221/68345 , H01L2221/68368 , H01L2223/6677 , H01L2224/24226 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19042 , H01L2224/82 , H01L2924/00
摘要： The flexible package (100) has between a first (1) and a second side (2) a semiconductor device (20) with a thinned back substrate (10) and an interconnect structure. Contact means (31,33) for external contact and a first resin layer (52) are present at the first side (2) of the package (100), which contact means (31,33) are coupled to the interconnect structure. At the second side (2) the semiconductor device (20) is at least substantially covered with a second resin layer (12). The contact means (31,33) are present on the first resin layer (52) and are coupled to the interconnect structure with redistribution tracks (32,34) extending through the first resin layer (52). A passivation layer (55) covers the first resin layer (52) and the redistribution tracks (32,34) at least substantially.
摘要翻译：柔性封装（100）在第一（1）和第二侧（2）之间具有带有薄的背衬基板（10）和互连结构的半导体器件（20）。用于外部接触的接触装置（31,33）和第一树脂层（52）存在于封装（100）的第一侧（2）处，该接触装置（31,33）联接到互连结构。在第二侧（2），半导体器件（20）至少基本被第二树脂层（12）覆盖。接触装置（31,33）存在于第一树脂层（52）上，并且通过延伸穿过第一树脂层（52）的再分布轨道（32,34）与互连结构耦合。钝化层（55）至少基本上覆盖第一树脂层（52）和再分布轨道（32,34）。

6. 发明申请

WO2007107901A2 A SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES 审中-公开
标题翻译：一种用于电子微流控器件的系统级封装平台
公开(公告)号：WO2007107901A2
公开(公告)日：2007-09-27
申请号：PCT/IB2007050759
申请日：2007-03-07
申请人： KONINKL PHILIPS ELECTRONICS NV , DEKKER RONALD , PIJNENBURG REMCO H W , VAN VEEN NICOLAAS J A
发明人： DEKKER RONALD , PIJNENBURG REMCO H W , VAN VEEN NICOLAAS J A
IPC分类号： B01L3/00
CPC分类号： H01L37/00 , B01J2219/00783 , B01J2219/0095 , B01L3/502707 , B01L3/502715 , B01L2200/12 , B01L2200/14 , B01L2300/0645 , B01L2300/1827 , B01L2300/1883 , B01L2400/0415 , B81B2201/058 , B81C1/0023 , H01L2224/11 , Y10T436/11
摘要： The present invention relates to an integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A micro fluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-micro fluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.
摘要翻译：本发明涉及集成电子微流体装置，其集成电子微流体装置包括在第一（122）支撑件上的半导体衬底（106），在第一半导体衬底侧上的电子电路（102,104）的半导体衬底，以及到外部设备的信号接口结构。信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并且允许仅在与第一半导体相反的第二半导体衬底侧上流体流过微流体结构底部侧面和背面形成第一支撑。电子微流体装置形成用于形成各种系统级封装应用的灵活平台。它实现了电气和湿化学界面之间的清晰分离。所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

7. 发明申请

WO2007054894A3 CHIP ASSEMBLY AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：芯片组件及其制造方法
公开(公告)号：WO2007054894A3
公开(公告)日：2007-11-15
申请号：PCT/IB2006054149
申请日：2006-11-07
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN VEEN NICOLAAS J A , DEKKER RONALD , TAK COENRAAD C
发明人： VAN VEEN NICOLAAS J A , DEKKER RONALD , TAK COENRAAD C
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2225/06517 , H01L2225/06524 , H01L2225/06555 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/07811 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/48145 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An assembly of a first chip (100) and a second chip (200), which first chip (100) is flexible and is provided with a first and a second resin layer (12, 52) on opposite sides (1, 2) of the chip (100), which allows to keep the first chip under compressive conditions, on which first and second side (1,2) respectively first side contact pads (33) and second side contact pads (31) are present, which first side contact pads (33) are coupled to corresponding contact pads (211) of the second chip (200), and which second side contact pads (31) are designed for external connection of the assembly.
摘要翻译：第一芯片（100）和第二芯片（200）的组件，所述第一芯片（100）是柔性的并且在第一芯片（100）的相对侧（1,2）上设置有第一树脂层和第二树脂层芯片（100）允许保持第一芯片处于压缩状态，在第一侧和第二侧（1,2）或第一侧接触垫（33）和第二侧接触垫（31）存在于第一侧接触垫（33）耦合到第二芯片（200）的对应接触垫（211），并且所述第二侧接触垫（31）被设计用于组件的外部连接。

8. 发明申请

WO2006061792A3 HERMETICALLY SEALED INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：密封式集成电路封装
公开(公告)号：WO2006061792A3
公开(公告)日：2006-08-31
申请号：PCT/IB2005054119
申请日：2005-12-08
申请人： KONINKL PHILIPS ELECTRONICS NV , VERJUS FABRICE , YANNOU JEAN-MARC , CHEVRIE DAVID , LECORNEC FRANCOIS , VAN VEEN NICOLAAS J A
发明人： VERJUS FABRICE , YANNOU JEAN-MARC , CHEVRIE DAVID , LECORNEC FRANCOIS , VAN VEEN NICOLAAS J A
IPC分类号： H01L23/13 , B81B7/00 , H01L21/50 , H01L23/10 , H01L23/14 , H01L25/065 , H03H9/05
CPC分类号： B81C1/0023 , H01L21/50 , H01L23/057 , H01L23/10 , H01L23/13 , H01L23/147 , H01L23/49816 , H01L2224/48227 , H01L2924/01005 , H01L2924/1461 , H03H9/059 , H03H9/1057 , H03H9/1071 , H01L2924/00
摘要： A device substrate (2) has a device major surface (6), a semiconductor element (4) on the device major surface (6), and electrically conductive device connectors (16) extending across the device major surface (4). An interconnection substrate has an interconnection substrate (20) having an interconnection major surface (21 ), the interconnection substrate (20) defining at least one sealing recess (24) recessed from the interconnection major surface (21 ) , the sealing recess (24) being surrounded by a sealing ring (22). The device substrate (2) is mounted on the interconnection substrate (20) with the interconnection major surface (21 ) facing the device major surface (6), the sealing ring (22) around the semiconductor element (4) and with the device major surface (6) sealed against the sealing ring (22) so that the recess (24) forms a sealed cavity containing the semiconductor element (4). Electrical interconnects (30) extend across the interconnection major surface (21 ). Interconnection bumps (28) are provided outside the sealing ring (22) to electrically connect the device (2) to the interconnect substrate (20).
摘要翻译：器件衬底（2）具有器件主表面（6），器件主表面（6）上的半导体元件（4）和延伸穿过器件主表面（4）的导电器件连接器（16）。互连衬底具有互连主表面（21）的互连衬底（20），互连衬底（20）限定从互连主表面（21）凹陷的至少一个密封凹部（24），密封凹槽（24）被密封圈（22）包围。装置基板（2）安装在互连基板（20）上，其互连主表面（21）面向装置主表面（6），密封环（22）围绕半导体元件（4）和装置主体所述表面（6）密封在所述密封环（22）上，使得所述凹部（24）形成包含所述半导体元件（4）的密封空腔。电互连（30）跨过互连主表面（21）延伸。互连凸块（28）设置在密封环（22）的外部，以将装置（2）电连接到互连基板（20）。

9. 发明申请

WO2007007233A3 PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF 审中-公开
标题翻译：包装，其制造方法及其用途
公开(公告)号：WO2007007233A3
公开(公告)日：2007-07-05
申请号：PCT/IB2006052243
申请日：2006-07-04
申请人： KONINKL PHILIPS ELECTRONICS NV , WEEKAMP JOHANNES W , VAN VEEN NICOLAAS J A
发明人： WEEKAMP JOHANNES W , VAN VEEN NICOLAAS J A
IPC分类号： H01L23/498
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/4985 , H01L23/49855 , H01L2224/16 , H01L2224/8192 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/12044 , H01L2924/30105 , H01L2924/00
摘要： The flexible package (100) comprises coupling means (20) for electrical coupling to an external component, a chip (30) with contact pads (32) that face the coupling means (20) and are electrically coupled thereto, and an electrically insulating encapsulation (40) encapsulating the chip (30) and being attached to the coupling means (20), said encapsulation (40) and said coupling means (20) constituting a substrate for the chip (30). The package (100) further comprises means (50) for handling the package (100). This means (50) is mechanically connected to the coupling means (20) through the encapsulation (40) only. The package (100) is suitable for assembly to a foil, which may be attached to or integrated in an article such as a security paper.
摘要翻译：柔性封装（100）包括用于电耦合到外部组件的耦合装置（20），具有面向耦合装置（20）并与其电耦合的接触垫（32）的芯片（30），以及电绝缘封装（40），其封装所述芯片（30）并连接到所述耦合装置（20），所述封装（40）和所述耦合装置（20）构成所述芯片（30）的衬底。包装（100）还包括用于处理包装（100）的装置（50）。这意味着（50）仅通过封装（40）机械地连接到耦合装置（20）。包装（100）适合于组装到箔片上，该箔片可以附着到或集成在诸如安全纸张之类的物品中。

10. 发明申请

WO2005109503A3 A METHOD OF ASSEMBLY AND ASSEMBLY THUS MADE 审中-公开
标题翻译：一种组装和组装方法
公开(公告)号：WO2005109503A3
公开(公告)日：2006-03-16
申请号：PCT/IB2005051397
申请日：2005-04-28
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN VEEN NICOLAAS J A , HOCHSTENBACH HENDRIK P
发明人： VAN VEEN NICOLAAS J A , HOCHSTENBACH HENDRIK P
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L2224/16145 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06582 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/10253 , H01L2924/1461 , H01L2924/1532 , H01L2924/3025 , H01L2924/00
摘要： An assembly (100) is provided comprising a first chip (20) and a second chip (30) which are interconnected through solder connections. These comprise, at the first chip, an underbump metallisation and a solder bump, and, at the second chip, a metallisation. In this case the solder bump is provided as a fluid layer with a contact angle of less than 90
摘要翻译：提供了一种组件（100），其包括通过焊接连接互连的第一芯片（20）和第二芯片（30）。这些在第一芯片上包括底部灌注金属化和焊料凸块，并且在第二芯片处包括金属化。在这种情况下，焊料凸点被提供为具有小于90°的接触角的流体层

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式