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1. 发明申请

WO2008007237A3 SUBMOUNT FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：针对电子元器件
公开(公告)号：WO2008007237A3
公开(公告)日：2008-06-05
申请号：PCT/IB2007052096
申请日：2007-06-05
申请人： KONINKL PHILIPS ELECTRONICS NV , BHATTACHARYA RABIN , SNIJDER PIETER J , VAN PIETERSON LIESBETH , ZAINZINGER ERICH
发明人： BHATTACHARYA RABIN , SNIJDER PIETER J , VAN PIETERSON LIESBETH , ZAINZINGER ERICH
IPC分类号： H05K3/30 , A41D1/00
CPC分类号： H05K3/301 , H05K1/038 , H05K3/308 , H05K3/321 , H05K2201/029 , H05K2201/10106 , H05K2201/10325 , H05K2201/10651 , H05K2201/10818 , H05K2201/10825 , H05K2201/10962 , H05K2201/209 , H05K2203/1446
摘要： A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.
摘要翻译：提供了用于在基板上布置电子组件的基板。基台包括头部件和从头部件突出的至少一个基板接合件。头部件包括彼此隔开的至少两个导电部分，其中每个导电部分包括适于将电子部件连接到其上的部件触点以及布置在所述衬底侧上的衬底触点，适于使所述衬底与包含在所述衬底中的电路接触的导电部分。本发明的基座可以用于将诸如发光二极管的电子部件附着到纺织品衬底上，而不需要将电子部件直接焊接在衬底上。

2. 发明申请

WO2010058346A2 ELECTRONIC TEXTILE 审中-公开
标题翻译：电子纺织品
公开(公告)号：WO2010058346A2
公开(公告)日：2010-05-27
申请号：PCT/IB2009055130
申请日：2009-11-18
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN PIETERSON LIESBETH , BHATTACHARYA RABIN , VAN HERPEN MAARTEN M J W
发明人： VAN PIETERSON LIESBETH , BHATTACHARYA RABIN , VAN HERPEN MAARTEN M J W
IPC分类号： A41D27/00
CPC分类号： H05K1/038 , G09F9/33 , G09F21/02 , G09F2013/222 , G09F2013/225 , H05K2201/0281 , H05K2201/029 , H05K2201/10106 , H05K2203/1115 , H05K2203/161
摘要： There is provided an electronic textile (10) which comprises a textile member (11) comprising a textile electrode (30), and at least one electronic component (12) arranged in connection to the textile member. The electronic component is electrically addressable via the textile electrode. The electronic textile further comprises a top layer (20), which comprises a chromic compound. The top layer is arranged on top of the textile member. The top layer is further arranged such that a sub area thereof, in response to an external stimulus capable of activating the chromic compound, is reversibly switchable from a first optical state to a second optical state.
摘要翻译：提供了一种电子纺织品（10），其包括具有纺织电极（30）的织物构件（11）和至少一个与织物构件连接的电子元件（12）。电子组件可通过纺织电极电寻址。电子织物还包含顶层（20），其包含铬化合物。顶层布置在织物构件的顶部。顶层还布置成使得其子区域响应于能够激活铬化合物的外部刺激而可逆地从第一光学状态切换到第二光学状态。

3. 发明申请

WO2008120134A1 LIGHT-EMITTING DEVICE COMPRISING AN ELASTOMERIC LAYER 审中-公开
标题翻译：包含弹性体层的发光装置
公开(公告)号：WO2008120134A1
公开(公告)日：2008-10-09
申请号：PCT/IB2008051101
申请日：2008-03-25
申请人： KONINKL PHILIPS ELECTRONICS NV , BHATTACHARYA RABIN , HACK MARTINUS J J , SEMPEL ADRIANUS
发明人： BHATTACHARYA RABIN , HACK MARTINUS J J , SEMPEL ADRIANUS
IPC分类号： H01L27/32 , F21V33/00
CPC分类号： A41D31/02 , A41D27/085 , G09F13/20 , G09F21/02 , H01L27/322 , H01L2251/5338 , H05K1/189 , H05K2201/10106
摘要： A light emitting device (100) is provided, which comprises a substrate (101) accomodating at least one light emitting diode (104) and an elastomeric layer (105) arranged to receive light from the light emitting diode(s) (104). The elastomeric layer (105) comprises phosphors (106), which enhance the output of light from the device (100). The light emitting device (100) is flexible and may be incorporated into a fabric, such as a textile or a plastics. Consequently, a textile product (300) comprising such a device (100) is provided.
摘要翻译：提供了一种发光器件（100），其包括容纳至少一个发光二极管（104）的基板（101）和布置成接收来自发光二极管（104）的光的弹性体层（105）。弹性体层（105）包括磷光体（106），其增强来自装置（100）的光的输出。发光器件（100）是柔性的，并且可以结合到诸如织物或塑料的织物中。因此，提供了包括这种装置（100）的纺织品（300）。

4. 发明申请

WO2011114263A3 LIGHT-EMITTING TEXTILE-BASED ARCHITECTURAL ELEMENT 审中-公开
标题翻译：基于发光纺织品的建筑元素
公开(公告)号：WO2011114263A3
公开(公告)日：2011-11-24
申请号：PCT/IB2011050999
申请日：2011-03-10
申请人： KONINKL PHILIPS ELECTRONICS NV , CORNELISSEN HUGO JOHAN , BHATTACHARYA RABIN , ZEPER WOUTER BASTIAAN
发明人： CORNELISSEN HUGO JOHAN , BHATTACHARYA RABIN , ZEPER WOUTER BASTIAAN
IPC分类号： F21S8/00 , D03D15/00 , F21S4/00 , F21V1/14 , F21Y101/02 , F21Y103/00 , F21Y105/00 , F21Y113/00 , H05K1/00
CPC分类号： F21V1/14 , F21S4/20 , F21S8/033 , F21S8/04 , F21V7/0008 , F21Y2103/10 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H05K1/038 , H05K2201/029 , H05K2201/10106 , H05K2201/2018
摘要： A light-emitting textile-based architectural element (1), comprising a frame (4); and a first textile sheet (5) being tensioned by the frame (4) to cover an area defined by the frame (4). The first textile-sheet (5) is a light-emitting electronic textile comprising a textile substrate (6) having a preformed conductor pattern (7a-b); and a plurality of light sources (8) attached to the textile substrate (6) in such a way that each light source (8) is electrically connected to the conductor pattern (7a-b).
摘要翻译： 1。一种基于发光纺织品的建筑元件（1），包括框架（4）; 和由所述框架（4）张紧以覆盖由所述框架（4）限定的区域的第一织物片材（5）。第一织物片（5）是包括具有预成型的导体图案（7a-b）的织物基底（6）的发光电子织物; 以及多个光源（8），以使每个光源（8）电连接到导体图案（7a-b）的方式附接到织物基底（6）。

5. 发明申请

WO2008044202A2 TEXTILE FOR CONNECTION OF ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备连接的纺织品
公开(公告)号：WO2008044202A2
公开(公告)日：2008-04-17
申请号：PCT/IB2007054103
申请日：2007-10-09
申请人： KONINKL PHILIPS ELECTRONICS NV , BHATTACHARYA RABIN
发明人： BHATTACHARYA RABIN
CPC分类号： D03D11/00 , D03D1/0088 , D10B2401/16 , F21K9/00 , H05K1/038 , H05K1/189 , H05K2201/0281 , H05K2201/029 , H05K2201/10106
摘要： A textile (100; 300; 400) having a multi-layer warp which includes an upper warp layer (101) comprising an upper array of conductive warp yarns (104a-b; 303a-e; 406a-b), a lower warp layer (102) comprising a lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), and an intermediate warp layer (103) arranged between the upper (101) and lower (102) warp layers. The textile further includes a weft in which a first set of conductive weft yarns (108; 302a- f; 407a-b) cross the upper array of conductive warp yarns (104a-b, 303a-e; 406a-b), such that electrical contact is achieved therebetween, and a second set of conductive weft yarns (109a-b; 305a- f; 424, 430, 440) cross the lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), such that electrical contact is achieved therebetween. The second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) form loops (110; 425, 431, 441) around non-conductive warp yarns in the upper (101) and intermediate (103) warp layers, each of the loops (110; 425, 431, 441) providing a first upper layer connection point (307; 408-410) for enabling connection of an electronic device (309; 401-403) between the first upper layer connection point (307; 408- 410) and a second upper layer connection point (308).
摘要翻译：一种具有多层经纱的织物（100; 300; 400），其包括上导向经纱（104a-b; 303a-e; 406a-b）的上经线层（101），下经纱层（102）包括下阵列的导电经纱（106a-b; 306a-e; 421a-d）和布置在上（101）和下（102）经线层之间的中间经纱层（103）。纺织品还包括纬纱，其中第一组导电纬纱（108; 302a-f; 407a-b）穿过导电经纱的上排阵列（104a-b，303a-e; 406a-b），使得第二组导电纬纱（109a-b; 305a-f; 424,430,440）穿过导电经纱（106a-b; 306a-e; 421a-d）的下排阵列，，使得它们之间实现电接触。第二组导电纬纱（109a-b; 305a-f; 424,430,440）在上（101）和中间（103）中的非导电经纱周围形成环（110; 425,431,441）经线层，每个环路（110; 425,431,441）提供第一上层连接点（307; 408-410），用于使第一上层连接点（307; 408-410）能够连接电子设备点（307; 408-410）和第二上层连接点（308）。

6. 发明申请

WO2008044167A3 TEXTILE FOR CONNECTION OF ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备连接的纺织品
公开(公告)号：WO2008044167A3
公开(公告)日：2011-11-17
申请号：PCT/IB2007054013
申请日：2007-10-03
申请人： KONINKL PHILIPS ELECTRONICS NV , BHATTACHARYA RABIN
发明人： BHATTACHARYA RABIN
IPC分类号： D03D11/00 , D03D15/00 , H05K1/00
CPC分类号： H05K1/038 , D03D1/0088 , D03D11/00 , D03D15/00 , D10B2401/16 , H05K1/189 , H05K2201/0281 , H05K2201/029 , H05K2201/10106 , Y10T442/3179
摘要： A textile (100; 300; 400) having a multi-layer warp which includes an upper warp layer (101) comprising an upper array of conductive warp yarns (104a-b; 303a-e; 406a-b), a lower warp layer (102) comprising a lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), and an intermediate warp layer (103) arranged between the upper (101) and lower (102) warp layers. The textile further includes a weft in which a first set of conductive weft yarns (108; 302a- f; 407a-b) cross the upper array of conductive warp yarns (104a-b, 303a-e; 406a-b), such that electrical contact is achieved there between, and a second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) cross the lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), such that electrical contact is achieved there between. The second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) form loops (110; 425, 431, 441) around non-conductive warp yarns in the upper (101) and intermediate (103) warp layers, each of the loops (110; 425, 431, 441) providing a first upper layer connection point (307; 408-410) for enabling connection of an electronic device (309; 401-403) between the first upper layer connection point (307; 408- 410) and a second upper layer connection point (308).
摘要翻译：一种具有多层经纱的织物（100; 300; 400），其包括上导向经纱（104a-b; 303a-e; 406a-b）的上经线层（101），下经纱层（102）包括下阵列的导电经纱（106a-b; 306a-e; 421a-d）和布置在上（101）和下（102）经线层之间的中间经纱层（103）。纺织品还包括纬纱，其中第一组导电纬纱（108; 302a-f; 407a-b）穿过导电经纱的上排阵列（104a-b，303a-e; 406a-b），使得在第二组导电纬纱（109a-b; 305a-f; 424,430,440）与第二组导电经纱（106a-b; 306a-e; 421a-d ），使得之间实现电接触。第二组导电纬纱（109a-b; 305a-f; 424,430,440）在上（101）和中间（103）中的非导电经纱周围形成环（110; 425,431,441）经线层，每个环路（110; 425,431,441）提供第一上层连接点（307; 408-410），用于使第一上层连接点（307; 408-410）能够连接电子设备点（307; 408-410）和第二上层连接点（308）。

7. 发明申请

WO2009037667A3 TEXTILE-BASED ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFORE 审中-公开
标题翻译：基于纺织品的电子设备及其制造方法
公开(公告)号：WO2009037667A3
公开(公告)日：2009-07-30
申请号：PCT/IB2008053815
申请日：2008-09-19
申请人： KONINKL PHILIPS ELECTRONICS NV , BHATTACHARYA RABIN
发明人： BHATTACHARYA RABIN
IPC分类号： A41D1/00
CPC分类号： H05K1/038 , H01L51/0097 , H05K1/16 , H05K2201/0281 , H05K2201/029 , H05K2201/0329 , Y02E10/549 , Y02P70/521
摘要： A textile-based electronic device (1; 40) comprising a textile substrate (2), first (3) and second (4) conductors and a conductive polymer layer (5) interconnecting the first (3) and second (4) conductors. Through the provision of textile-based electronic devices according to the present invention, connections between a flexible textile substrate and rigid electronic components can be avoided or at least reduced considerably. Hereby, the manufacture of low-cost and durable electronic textiles is enabled.
摘要翻译：一种基于纺织品的电子设备（1; 40），包括织物基底（2），第一（3）和第二（4）导体以及互连第一（3）和第二（4）导体的导电聚合物层。通过提供根据本发明的基于纺织品的电子设备，可以避免或至少减少柔性织物基底和刚性电子部件之间的连接。因此，制造低成本和耐用的电子纺织品成为可能。

8. 发明专利

DE602007003473D1 未知
公开(公告)号：DE602007003473D1
公开(公告)日：2010-01-07
申请号：DE602007003473
申请日：2007-06-05
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： BHATTACHARYA RABIN , SNIJDER PIETER J , VAN PIETERSON LIESBETH , VAN DRIEL JACQULINE , KRANS MARTIJN , DOUGLAS ALEXANDER U , ASVADI SIMA , HACK MARTINUS J J , ZAINZINGER ERICH
IPC分类号： H05K3/30 , A41D1/00
摘要： A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

9. 发明专利

BRPI0917051A2 conjunto modular flexível e método para a fabricação de um conjunto modular flexível 未知
公开(公告)号：BRPI0917051A2
公开(公告)日：2016-02-16
申请号：BRPI0917051
申请日：2009-12-03
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： ALTEWISCHER ERWIN , LAMERICHS GUIDO , PIETERSON LIESBETH VAN , KRANS MARTIJN , BHATTACHARYA RABIN , SCHULER THOMAS
IPC分类号： H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36

10. 发明专利

AT450134T 未知
公开(公告)号：AT450134T
公开(公告)日：2009-12-15
申请号：AT07825796
申请日：2007-06-05
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： BHATTACHARYA RABIN , SNIJDER PIETER , VAN PIETERSON LIESBETH , VAN DRIEL JACQULINE , KRANS MARTIJN , DOUGLAS ALEXANDER , ASVADI SIMA , HACK MARTINUS , ZAINZINGER ERICH
IPC分类号： H05K3/30 , A41D1/00
摘要： A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

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