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1. 发明申请

WO2005029177A1 LIQUID PHOTO SOLDER RESIST COMPOSITION AND PHOTO SOLDER RESIST FILM THEREOF 审中-公开
标题翻译：液体照片焊接电阻组合物及其照片焊接电阻膜
公开(公告)号：WO2005029177A1
公开(公告)日：2005-03-31
申请号：PCT/KR2004/001158
申请日：2004-05-17
申请人： KOLON INDUSTRIES INC. , PARK, Chan-Hyo , MOON, Sung-Bae , BONG, Dong-Hun , CHUNG, Chang-Beom
发明人： PARK, Chan-Hyo , MOON, Sung-Bae , BONG, Dong-Hun , CHUNG, Chang-Beom
IPC分类号： G03C1/04
CPC分类号： C08F283/10 , G03F7/038 , H05K3/287
摘要： The present invention is directed to a liquid photo solder resist composition and a solder resist film prepared from the composition. In the liquid photo solder resist composition including a UV-curing resin developable with an aqueous alkali solution, a UV-reactive acrylic monomer, an epoxy resin, a photopolymerization initiator, and an organic solvent, the epoxy resin has an isocyanurate structure comprising one epoxy group and at least two acryl groups in one molecule as prepared by steps including: (a) reacting a cyanurate compound with an acrylate-based monomer to yield a product having acryl groups; and (b) adding an epichlorohydrine to the product of the step (a). The photo solder resist film prepared from the liquid photo solder resist composition guarantees a wide dry control width without surface stickiness and provides excellent properties.
摘要翻译：本发明涉及由该组合物制备的液体光阻焊剂组合物和阻焊膜。在包含用碱性水溶液显影的UV固化树脂，UV反应性丙烯酸单体，环氧树脂，光聚合引发剂和有机溶剂的液态光阻焊剂组合物中，环氧树脂具有包含一个环氧树脂的异氰脲酸酯结构基团和至少两个丙烯酸基团，其通过以下步骤制备，所述方法包括：（a）使氰尿酸酯化合物与丙烯酸酯基单体反应，得到具有丙烯酰基的产物; 和（b）向步骤（a）的产物中加入表氯醇。由液态光阻焊剂组合物制备的光阻焊膜保证宽的干燥控制宽度，无表面粘性，并提供优异的性能。

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