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1. 发明公开

EP2623850A4 CIRCUIT MODULE, LIGHT-EMITTING MODULE, AND VEHICLE LAMP 审中-公开
标题翻译：电路模块和发光模块车灯
公开(公告)号：EP2623850A4
公开(公告)日：2016-03-30
申请号：EP11828328
申请日：2011-09-08
申请人： KOITO MFG CO LTD
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： F21S8/10
CPC分类号： F21V19/042 , B60Q1/00 , B60Q1/0408 , F21S41/147 , F21S41/19 , F21S45/47 , F21V23/00 , F21V23/02 , F21V29/70 , F21Y2115/10
摘要： In a circuit module 14, a supporting member 24 has both an element mounting surface on which a package 16 can be mounted and a circuit mounting surface on which a lighting control circuit 22 that controls lighting of a semiconductor light emitting element can be mounted. The lighting control circuit 22 is mounted on the circuit mounting surface. The circuit mounting surface is formed so as to be orthogonalized or inclined with respect to the element mounting surface. Thereby, the length in the longitudinal direction of the circuit module can be made smaller in comparison with that of a circuit module in which a circuit mounting surface and an element mounting surface are formed on the same plane.

2. 发明公开

EP2827048A4 LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS FOR VEHICLE 有权
标题翻译：爱丽丝·弗吉尼亚州
公开(公告)号：EP2827048A4
公开(公告)日：2015-11-11
申请号：EP13761876
申请日：2013-03-04
申请人： KOITO MFG CO LTD
发明人： TSUTSUMI YASUAKI , SONE NAOKI
IPC分类号： F21S8/10 , F21V9/08 , F21Y101/02
CPC分类号： F21S48/1394 , F21S41/125 , F21S41/14 , F21S41/143 , F21S41/16 , F21S41/19 , F21S41/255 , F21S41/285 , F21S41/29 , F21S41/32 , F21S41/322 , F21S41/37 , F21S41/47 , F21S41/663 , F21S45/43 , F21V13/08
摘要： A light-emitting device (20) is provided with an LED chip (37) and a condenser (25) for concentrating the light emitted by the LED chip (37). The condenser (25) has a first opening (25a) that serves as an incidence part on which light from the LED chip (37) is incident, a side-surface part (25c) that serves as a reflecting part for reflecting light that is incident from the first opening (25a), and a second opening (25b) that serves as an emission part for emitting the light reflected by the side-surface part (25c). The first opening (25a) of the condenser (25) has a fluorescent layer (38) formed therein for wavelength-converting and emitting the light produced by the LED chip (37). The condenser (25) is positioned in a manner such that the fluorescent layer (38) is located above the light-emitting surface of the LED chip (37).
摘要翻译：发光装置（20）具有用于聚集由LED芯片（37）发射的光的LED芯片（37）和聚光器（25）。冷凝器（25）具有作为来自LED芯片（37）入射的入射部的入射部的第一开口部（25a），作为反射光的反射部的侧面部（25c）以及作为用于发射由侧面部（25c）反射的光的发射部的第二开口（25b）。冷凝器（25）的第一开口（25a）具有形成在其中的荧光层（38），用于对由LED芯片（37）产生的光进行波长转换和发射。聚光器（25）以使得荧光层（38）位于LED芯片（37）的发光表面之上的方式定位。

3. 发明公开

EP2623851A4 CIRCUIT MODULE, LIGHT-EMITTING MODULE, AND VEHICLE LAMP 有权
公开(公告)号：EP2623851A4
公开(公告)日：2018-04-18
申请号：EP11828329
申请日：2011-09-08
申请人： KOITO MFG CO LTD
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , INOUE TAKASHI , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： F21S45/43 , B60Q1/00 , B60Q1/04 , F21S41/19 , F21S45/49 , F21V23/02 , F21V29/67 , F21V29/70 , F21Y115/10
CPC分类号： F21V19/042 , B60Q1/0094 , B60Q1/0408 , F21S41/147 , F21S41/192 , F21S45/43 , F21S45/49 , F21V23/02 , F21V29/02 , F21V29/677 , F21V29/70 , F21Y2115/10
摘要： A circuit module 14 includes: a lighting control circuit 22 that controls lighting of a semiconductor light emitting element; a first heat radiating member 24 on which the lighting control circuit 22 is mounted; a second heat radiating member 26 that is separated from the first heat radiating member 24 and has a surface 40a on which the semiconductor light emitting element is mounted; and a connecting mechanism 28 having both a housing 30 that connects the first heat radiating member 24 and the second heat radiating member 26 together and a conductive portion 32 that transmits a signal from the lighting control circuit 22 to the semiconductor light emitting element. The housing 30 is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member 24 and the second heat radiating member 26.

4. 发明专利

JP2013016261A Light source fixing member 有权
标题翻译：光源固定器
公开(公告)号：JP2013016261A
公开(公告)日：2013-01-24
申请号：JP2011146267
申请日：2011-06-30
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , SONE NAOKI , NANBA TAKANORI , INOUE TAKASHI , TANAKA HIDETADA , MATSUMOTO AKIHIRO
IPC分类号： F21S8/10 , F21V19/00 , F21V23/00 , F21V29/00 , F21Y101/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To promptly connect a light source and a control circuit part for controlling lighting of the light source.SOLUTION: A first heat sink for radiating heat of a light-emitting element is attached on a lower surface of an attachment 34. A package fixing part 34f fixes a package having the light-emitting element to the first heat sink by attaching the attachment 34 to the first heat sink. On a circuit housing part 34a, a control circuit board for controlling lighting of the light-emitting element is mounted. The attachment 34 includes a conductive member 64 connected with the control circuit board. The conductive member 64 comes in contact with an electrode of the light-emitting element as the attachment 34 is attached to the first heat sink, and is provided so as to electrically connect the control circuit board and the light-emitting element.
摘要翻译：要解决的问题：及时连接用于控制光源照明的光源和控制电路部分。解决方案：用于散发发光元件的第一散热器附着在附件34的下表面上。封装固定部分34f将具有发光元件的封装通过附接固定到第一散热器附件34到第一散热器。在电路壳体部分34a上安装用于控制发光元件的点亮的控制电路板。附件34包括与控制电路板连接的导电构件64。导电构件64随着附件34附接到第一散热器而与发光元件的电极接触，并且被设置为电连接控制电路板和发光元件。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2017117845A 半導体発光素子およびその製造方法审中-公开
公开(公告)号：JP2017117845A
公开(公告)日：2017-06-29
申请号：JP2015248898
申请日：2015-12-21
申请人：株式会社小糸製作所 , Koito Mfg Co Ltd
发明人： SONE NAOKI , NOMURA AKIHIRO , SUGIMORI SHOGO
IPC分类号： H01L33/06 , C23C16/34
摘要：【課題】ラストバリア層の表面状態を良好にして結晶品質を維持し、発光効率を向上させることが可能な半導体発光素子およびその製造方法を提供する。【解決手段】障壁層と井戸層を交互に積層した多重量子井戸活性層と、多重量子井戸活性層の上に形成された電子ブロック層とを備える半導体発光素子であって、障壁層のうち最上層であるラストバリア層は、他の障壁層よりも厚く、電子ブロック層からの不純物が拡散されている拡散領域と、電子ブロック層からの不純物が到達していない非拡散領域とを備えている。【選択図】図3

6. 发明专利

JP2012074218A Circuit module, light emitting module, and lighting fixture for vehicle 有权
标题翻译：电路模块，发光模块和车辆照明装置
公开(公告)号：JP2012074218A
公开(公告)日：2012-04-12
申请号：JP2010217566
申请日：2010-09-28
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , INOUE TAKASHI , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： F21S8/10 , F21V29/00 , F21V29/02 , F21Y101/02
CPC分类号： F21V19/042 , B60Q1/0408 , F21S41/147 , F21S41/192 , F21S45/43 , F21S45/49 , F21S48/1109 , F21S48/1159 , F21S48/321 , F21S48/325 , F21V23/02 , F21V29/02 , F21V29/677 , F21V29/70 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a technology which can individually optimize heat radiation of a semiconductor light-emitting element and a lighting control circuit.SOLUTION: The circuit module 14 includes a lighting control circuit 22 for controlling lighting of a semiconductor light-emitting element, a first heat radiation member 24 on which the lighting control circuit 22 is mounted, a second heat radiation member 26 which is separated from the first heat radiation member 24 and has a surface 40a on which the semiconductor light-emitting element is mounted, a housing 30 which joins mutually the first heat radiation member 24 and the second heat radiation member 26, and a connection mechanism 28 having a conductive part 32 for transmitting a signal from the lighting control circuit 22 to the semiconductor light-emitting element. The housing 30 is constructed of a material having a thermal conductivity lower than that of the first heat radiation member 24 and the second heat radiation member 26.
摘要翻译：要解决的问题：提供可以单独优化半导体发光元件和照明控制电路的散热的技术。电路模块14包括用于控制半导体发光元件的点亮的点亮控制电路22，安装着照明控制电路22的第一散热构件24，第二散热构件26，与第一散热构件24分离并且具有安装有半导体发光元件的表面40a，将第一散热构件24和第二散热构件26相互连接的壳体30以及具有第一散热构件24的连接机构28，用于将来自点亮控制电路22的信号发送到半导体发光元件的导电部32。壳体30由导热率低于第一散热构件24和第二散热构件26的导热性的材料构成。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2013020935A Vehicle headlight 有权
标题翻译：车辆头灯
公开(公告)号：JP2013020935A
公开(公告)日：2013-01-31
申请号：JP2012002289
申请日：2012-01-10
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： INOUE TAKASHI , SUZUKI TETSUYA , MATSUMOTO AKIHIRO , SONE NAOKI , NANBA TAKANORI , TANAKA HIDETADA
IPC分类号： F21S8/10 , F21V29/00 , F21W101/10 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To suppress an occupied space of a vehicle headlight.SOLUTION: As for a vehicle headlight, a light-emitting module 14 is integrally constructed of a light-emitting element 20 and a control circuit part 42 for controlling lighting of the light-emitting element 20. The control circuit part 42 is arranged at a lower part of a shade so as to avoid a course of light used for formation of a low-beam light distribution pattern out of the light emitted by the light-emitting element 20 further in front of the lamp than the light-emitting element 20. In this case, a main optical axis Ax2 of the light-emitting element 20 is vertical to a lamp optical axis Ax1, and the light-emitting part is arranged so as to project further in a main optical axis Ax2 direction than the control circuit part 42.
摘要翻译：要解决的问题：抑制车辆前灯的占用空间。解决方案：对于车辆前照灯，发光模块14由发光元件20和用于控制发光元件20的点亮的控制电路部42一体地构成。控制电路部分42是布置在阴影的下部，以避免用于在发光元件20发射的光之外用于形成远光配光图案的光线比发光在这种情况下，发光元件20的主光轴Ax2与灯光轴Ax1垂直，发光部配置成比主光轴Ax2方向更远控制电路部分42.版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012074217A Circuit module, light emitting module, and lighting fixture for vehicle 有权
标题翻译：电路模块，发光模块和车辆照明装置
公开(公告)号：JP2012074217A
公开(公告)日：2012-04-12
申请号：JP2010217565
申请日：2010-09-28
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： F21S8/10 , F21Y101/02
CPC分类号： F21V19/042 , B60Q1/00 , B60Q1/0408 , F21S41/147 , F21S41/19 , F21S45/47 , F21V23/00 , F21V23/02 , F21V29/70 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a circuit module and a light-emitting module which contribute to downsizing of a lighting fixture for vehicle.SOLUTION: In the circuit module 14, a support member 24 has an element mounting face which can mount a package 16 and a circuit mounting face and can mount a lighting control circuit 22 for controlling lighting of a semiconductor light-emitting element. The lighting control circuit 22 is mounted on the circuit mounting face. The circuit mounting face is formed to be at right angles or inclined against the element mounting face. Thereby, compared with a circuit module in which the circuit mounting face and the element mounting face are formed on an identical plane, the length in a longitudinal direction of the circuit module can be made shorter.
摘要翻译：要解决的问题：提供有助于车辆用照明器具的小型化的电路模块和发光模块。解决方案：在电路模块14中，支撑构件24具有能够安装封装16和电路安装面的元件安装面，并且可以安装用于控制半导体发光元件的点亮的点亮控制电路22。照明控制电路22安装在电路安装面上。电路安装面形成为直角或相对于元件安装面倾斜。因此，与将电路安装面和元件安装面形成在同一平面上的电路模块相比，电路模块的长度方向的长度可以缩短。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2013105929A Light emitting module, manufacturing method of the same, and lamp fitting for vehicle 有权
标题翻译：发光模块及其制造方法及灯具配件
公开(公告)号：JP2013105929A
公开(公告)日：2013-05-30
申请号：JP2011249386
申请日：2011-11-15
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： H01L33/56 , F21S8/10 , F21W101/10 , F21Y101/02
CPC分类号： H01L33/52 , H01L33/005 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable light emitting module which improves mechanical and chemical strength of a metal wire for supplying power to a semiconductor light emitting element.SOLUTION: A light emitting module LM is equipped with an LED element 23, supplies power by a metal wire 3, and includes: a first resin (a sealing material) 4 sealing the metal wire 3 and a second resin (a dam wall) 5 enclosing at least a part of an outer periphery of the first resin. The first resin 4 has lower viscosity and lower elastic modulus compared to the second resin 5. The first resin 4 mechanically and chemically protects the metal wire 3 and the second resin 5 prevents the first resin 4 from flowing out to the periphery and maintains the sealing state of the metal wire 3 which is formed by the first resin 4.
摘要翻译：要解决的问题：获得提供用于向半导体发光元件供电的金属线的机械和化学强度的高度可靠的发光模块。解决方案：发光模块LM配备有LED元件23，通过金属线3供电，并且包括：密封金属线3的第一树脂（密封材料）4和第二树脂（坝壁）5，其包围第一树脂的外周的至少一部分。第一树脂4与第二树脂5相比具有较低的粘度和较低的弹性模量。第一树脂4机械和化学地保护金属丝3，并且第二树脂5防止第一树脂4流出到周边并保持密封由第一树脂4形成的金属丝3的状态。（C）2013，JPO＆INPIT

10. 发明专利

JP2017117844A 半導体発光素子およびその製造方法审中-公开
公开(公告)号：JP2017117844A
公开(公告)日：2017-06-29
申请号：JP2015248896
申请日：2015-12-21
申请人：株式会社小糸製作所 , Koito Mfg Co Ltd
发明人： SONE NAOKI
IPC分类号： H01L33/06 , H01L33/32
摘要：【課題】電子ブロック層の成長初期段階から不純物を適切にドープすることができる半導体発光素子およびその製造方法を提供する。【解決手段】障壁層と井戸層を交互に積層した多重量子井戸活性層と、多重量子井戸活性層の上に形成された電子ブロック層とを備える半導体発光素子であって、障壁層のうち最上層であるラストバリア層は、電子ブロック層にドープされた不純物と同じ不純物をドープしたドープ領域を備えている。【選択図】図3

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