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1. 发明授权

US08911125B2 Circuit module, light emitting module, and automotive lamp 有权
标题翻译：电路模块，发光模块和汽车灯
公开(公告)号：US08911125B2
公开(公告)日：2014-12-16
申请号：US13837670
申请日：2013-03-15
申请人： Koito Manufacturing Co., Ltd.
发明人： Tetsuya Suzuki , Akihiro Matsumoto , Takashi Inoue , Tomoyuki Nakagawa , Naoki Sone
IPC分类号： F21V29/00 , F21S8/10 , F21V29/02 , F21V23/02 , F21Y101/02
CPC分类号： B60Q1/0408 , B60Q1/0094 , F21S41/147 , F21S41/192 , F21S45/43 , F21S45/49 , F21V23/02 , F21V29/677 , F21V29/70 , F21Y2115/10
摘要： A circuit module includes: a lighting control circuit that controls lighting of a semiconductor light emitting element; a first heat radiating member on which the lighting control circuit is mounted; a second heat radiating member that is separated from the first heat radiating member and has a surface on which the semiconductor light emitting element is mounted; and a connecting mechanism having both a housing that connects the first heat radiating member and the second heat radiating member together and a conductive portion that transmits a signal from the lighting control circuit to the semiconductor light emitting element. The housing is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member and the second heat radiating member.
摘要翻译：电路模块包括：照明控制电路，其控制半导体发光元件的点亮; 第一散热构件，其上安装有照明控制电路; 第二散热构件，其与第一散热构件分离并且具有其上安装有半导体发光元件的表面; 以及连接机构，其具有将第一散热构件和第二散热构件连接在一起的壳体和将发光控制电路的信号发送到半导体发光元件的导电部。壳体由导热系数低于第一散热构件和第二散热构件的材料形成。

2. 发明授权

US10317064B2 Light source unit and vehicle lamp fitting 有权
公开(公告)号：US10317064B2
公开(公告)日：2019-06-11
申请号：US15561646
申请日：2016-03-16
申请人： KOITO MANUFACTURING CO., LTD.
发明人： Atsushi Ozawa , Tomoyuki Nakagawa , Tsutomu Machida
IPC分类号： F21V29/503 , F21V23/06 , F21S43/00 , F21S43/37 , F21S43/19 , F21V19/00 , F21S43/14 , F21S41/19 , F21S41/143 , F21S45/48 , F21V15/00 , F21V17/00 , F21V29/74 , F21S45/50
摘要： A light source unit includes a light emitting element which functions as a light source, a wiring pattern on which the light emitting element is mounted, an electrode pad connected to the wiring pattern, a substrate on which the wiring pattern is formed and the electrode pad is mounted, a power supply body which supplies external power to the electrode pad, and a socket housing which has an engaging portion engaged with a predetermined member and holds the substrate, the light emitting element and the power supply body. The power supply body has a terminal holding portion formed of an insulating resin material and a connection terminal supported by the terminal holding portion and connected to an external power supply. The connection terminal and the electrode pad are connected to each other by a conduction connecting part.

3. 发明授权

US10032968B2 Light emitting module, method for manufacturing light emitting module, and vehicular lamp 有权
公开(公告)号：US10032968B2
公开(公告)日：2018-07-24
申请号：US13676187
申请日：2012-11-14
申请人： KOITO MANUFACTURING CO., LTD.
发明人： Tetsuya Suzuki , Akihiro Matsumoto , Tomoyuki Nakagawa , Naoki Sone
IPC分类号： H01L33/00 , H01L33/52 , H01L33/56
摘要： Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.

4. 发明授权

US10018324B2 Light source unit with light emitting module, sealing part and lens part 有权
公开(公告)号：US10018324B2
公开(公告)日：2018-07-10
申请号：US15084647
申请日：2016-03-30
申请人： KOITO MANUFACTURING CO., LTD.
发明人： Tomoyuki Nakagawa , Atsushi Ozawa , Ryota Naito
IPC分类号： F21S41/19 , F21S8/10 , F21S41/141 , F21S41/29 , F21S41/255 , F21S43/19 , F21S43/14 , F21S43/27 , F21S43/20 , F21S45/10 , F21V5/04 , F21Y115/10 , F21S45/47
CPC分类号： F21S43/26 , F21S41/141 , F21S41/192 , F21S41/194 , F21S41/255 , F21S41/295 , F21S43/14 , F21S43/195 , F21S43/27 , F21S45/10 , F21S45/47 , F21V5/04 , F21Y2115/10
摘要： A light source unit of one embodiment includes a socket housing, a light emitting module, a substrate, a sealing part, and a lens part. The sealing part seals the light emitting element and the conductive part to the substrate. A lens part is formed on the sealing part. Alastic modulus of the lens part is higher than that of the sealing part.

5. 发明授权

US08803168B2 Light emitting module 有权
标题翻译：发光模块
公开(公告)号：US08803168B2
公开(公告)日：2014-08-12
申请号：US13715498
申请日：2012-12-14
申请人： Koito Manufacturing Co., Ltd.
发明人： Akihiro Matsumoto , Tetsuya Suzuki , Tomoyuki Nakagawa
IPC分类号： H01L29/18
CPC分类号： H01L33/62 , H01L25/0753 , H01L27/15 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series.
摘要翻译：在发光模块中，半导体发光元件安装在安装板上。电镀层设置在安装板的表面上，以便与安装在安装板上的半导体发光元件电连接。镀层具有供电部和元件连接部。供电部将安装板的表面从其上安装有半导体发光元件的上表面延伸到位于上表面下方的台阶表面，从而能够在台阶表面上供电，到半导体发光元件。元件连接部设置在上表面上，使得安装在上表面上的多个半导体发光元件串联连接在一起。

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