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1. 发明申请

WO2010011578A2 COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 审中-公开
标题翻译：用于检查和/或分类晶片的计算机实施的方法
公开(公告)号：WO2010011578A2
公开(公告)日：2010-01-28
申请号：PCT/US2009/051044
申请日：2009-07-17
申请人： KLA-TENCOR CORPORATION , REICH, Juergen , VINTRO, Louis , DIGHE, Prasanna , STEINBACH, Andrew , KAVALDJIEV, Daniel , BIELLAK, Stephen
发明人： REICH, Juergen , VINTRO, Louis , DIGHE, Prasanna , STEINBACH, Andrew , KAVALDJIEV, Daniel , BIELLAK, Stephen
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , G01N21/9501 , H01L2924/0002 , H01L2924/00
摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
摘要翻译：提供了用于检查和/或分类晶片的计算机实现的方法。一种计算机实现的方法包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数基于晶片的非空间局部化特性来确定，所述特性是利用响应于由检查系统产生的从晶片散射的光的输出而确定的。另一种计算机实现的方法包括基于晶片的非空间局部化特性的组合来对晶片进行分类，所述晶片的非空间局部化特性使用响应于由检查系统产生的晶片散射的光的输出而确定，并且使用输出确定的晶片的空间局部化特性

2. 发明申请

WO2009154952A2 SYSTEMS AND METHODS FOR DETERMINING TWO OR MORE CHARACTERISTICS OF A WAFER 审中-公开
标题翻译：用于确定波形的两个或更多特征的系统和方法
公开(公告)号：WO2009154952A2
公开(公告)日：2009-12-23
申请号：PCT/US2009/045124
申请日：2009-05-26
申请人： KLA-TENCOR CORPORATION , BIELLAK, Stephen , KAVALDJIEV, Daniel
发明人： BIELLAK, Stephen , KAVALDJIEV, Daniel
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , G01N21/9501 , G01N2021/8825 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.
摘要翻译：提供了用于确定晶片的两个或多个特性的系统和方法。两个或更多个特征包括在至少一个维度上空间定位的晶片的特性和晶片在两维空间上不局限的特征。

3. 发明申请

WO2009023154A2 SYSTEMS CONFIGURED TO INSPECT A WAFER 审中-公开
标题翻译：配置检查晶圆的系统
公开(公告)号：WO2009023154A2
公开(公告)日：2009-02-19
申请号：PCT/US2008/009571
申请日：2008-08-11
申请人： KLA-TENCOR CORPORATION , KADKLY, Azmi , BIELLAK, Stephen , VAEZ-IRAVANI, Mehdi
发明人： KADKLY, Azmi , BIELLAK, Stephen , VAEZ-IRAVANI, Mehdi
IPC分类号： H01L21/66
CPC分类号： G01N21/9501
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.
摘要翻译：提供了配置为检查晶片的系统。一个系统包括照明子系统，该照明子系统被配置成通过以斜入射角将光引导到晶片来照射晶片上的区域。该系统还包括收集子系统，该收集子系统被配置成同时收集从照射区域内的不同点散射的光并且将从不同点收集的光聚焦到图像平面中的对应位置。此外，该系统包括检测子系统，该检测子系统被配置为分别检测聚焦到图像平面中的对应位置的光并且响应于聚焦到图像平面中的对应位置的光分别生成输出。输出可用于检测晶圆上的缺陷。

4. 发明申请

WO2016014318A1 HIGH RESOLUTION HIGH QUANTUM EFFICIENCY ELECTRON BOMBARDED CCD OR CMOS IMAGING SENSOR 审中-公开
标题翻译：高分辨率高数量效率电子宝石CCD或CMOS成像传感器
公开(公告)号：WO2016014318A1
公开(公告)日：2016-01-28
申请号：PCT/US2015/040618
申请日：2015-07-15
申请人： KLA-TENCOR CORPORATION
发明人： JIANG, Ximan , BIELLAK, Stephen , FIELDEN, John
IPC分类号： H01L27/146
CPC分类号： H01J31/26 , G01N21/88 , H01J29/46
摘要： An electron-bombarded detector for detecting low light signals includes a vacuum tube structure defining a cylindrical vacuum tube chamber, a photocathode disposed at a first end of the vacuum tube chamber, a sensor disposed at a second end of the vacuum tube chamber, ring electrodes disposed in the vacuum tube chamber for generating an electric field that accelerates emitted photoelectrons toward the sensor, and a magnetic field generator configured to generate a symmetric magnetic field that applies a focusing lens effect on the photoelectrons. The ring electrodes and magnetic field generator are operating using one of a reduced distance focusing approach and an acceleration/deceleration approach such that the photoelectrons have a landing energy below 2keV. The use of reflective mode photocathodes is enabled using either multi-pole deflector coils, or ring electrodes formed by segmented circular electrode structures. Large angle deflections are achieved using magnetic or electrostatic deflectors.
摘要翻译：用于检测低光信号的电子轰击检测器包括限定圆柱形真空管室的真空管结构，设置在真空管室的第一端的光电阴极，设置在真空管室的第二端的传感器，环形电极设置在真空管室中，用于产生将发射的光电子朝向传感器加速的电场;以及磁场发生器，被配置为产生对光电子产生聚焦透镜效应的对称磁场。环形电极和磁场发生器使用减小的距离聚焦方法和加速/减速方法之一进行操作，使得光电子具有低于2keV的着陆能量。使用反射模式光电阴极可以使用多极偏转线圈或由分段圆形电极结构形成的环形电极。使用磁性或静电偏转器实现大角度偏转。

5. 发明申请

WO2014036164A1 IMAGE INTENSIFIER TUBE DESIGN FOR ABERRATION CORRECTION AND ION DAMAGE REDUCTION 审中-公开
标题翻译：图像增强管设计用于去除校正和离子损害减少
公开(公告)号：WO2014036164A1
公开(公告)日：2014-03-06
申请号：PCT/US2013/057125
申请日：2013-08-28
申请人： KLA-TENCOR CORPORATION
发明人： JIANG, Ximan , LI, Qing , BIELLAK, Stephen
IPC分类号： H01J31/50
CPC分类号： H01J40/16 , H01J31/50
摘要： The disclosure is directed to image intensifier tube designs for field curvature aberration correction and ion damage reduction. In some embodiments, electrodes defining an acceleration path from a photocathode to a scintillating screen are configured to provide higher acceleration for off-axis electrons along at least a portion of the acceleration path. Off-axis electrons and on-axis electrons are accordingly focused on the scintillating screen with substantial uniformity to prevent or reduce field curvature aberration. In some embodiments, the electrodes are configured to generate a repulsive electric field near the scintillating screen to prevent secondary electrons emitted or deflected by the scintillating screen from flowing towards the photocathode and forming damaging ions.
摘要翻译：本发明涉及用于场曲率像差校正和离子损伤降低的图像增强管设计。在一些实施例中，限定从光电阴极到闪烁屏幕的加速路径的电极被配置为沿着加速路径的至少一部分为离轴电子提供更高的加速度。因此，离轴电子和轴上电子聚焦在闪烁屏上，具有大体均匀性以防止或减小场曲率像差。在一些实施例中，电极被配置为在闪烁屏幕附近产生排斥电场，以防止由闪烁屏幕发射或偏转的二次电子朝向光电阴极流动并形成有害离子。

6. 发明申请

WO2013134631A1 WAFER INSPECTION WITH MULTI-SPOT ILLUMINATION AND MULTIPLE CHANNELS 审中-公开
标题翻译：具有多点照明和多通道的波形检测
公开(公告)号：WO2013134631A1
公开(公告)日：2013-09-12
申请号：PCT/US2013/029850
申请日：2013-03-08
申请人： KLA-TENCOR CORPORATION
发明人： BIELLAK, Stephen , VAEZ-IRAVANI, Mehdi
IPC分类号： H01L21/66
CPC分类号： G01N21/8806 , G01N21/9501
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate a set of spots on a wafer and a collection subsystem configured to collect light from the set of spots. The collection subsystem separately images the light collected from each of the individual spots onto only a corresponding first detector of a first detection subsystem. The collection subsystem also images the light collected from at least some of the individual spots onto a number of second detectors of a second detection subsystem that is less than a number of spots in the set. Output produced by the first and second detectors can be used to detect defects on the wafer.
摘要翻译：提供了配置用于检查晶片的系统。一个系统包括被配置为照亮晶片上的一组斑点的照明子系统和被配置为收集该组斑点的光的收集子系统。收集子系统将从每个单个斑点收集的光分别成像到第一检测子系统的对应的第一检测器上。收集子系统还将从至少一些单个点收集的光成像到第二检测子系统的多个第二检测器，该第二检测子系统小于集合中的多个点。由第一和第二检测器产生的输出可用于检测晶片上的缺陷。

7. 发明申请

WO2019075152A1 IMAGE SENSORS WITH GROUNDED OR OTHERWISE BIASED CHANNEL-STOP CONTACTS 审中-公开
公开(公告)号：WO2019075152A1
公开(公告)日：2019-04-18
申请号：PCT/US2018/055328
申请日：2018-10-11
申请人： KLA-TENCOR CORPORATION
发明人： LAI, Tzi-Cheng , CHERN, Jehn-Huar Howard , BIELLAK, Stephen
IPC分类号： H01L27/148 , H01L27/146
摘要： A back-illuminated image sensor includes a first pixel, a second pixel, and a channel stop situated between the first pixel and the second pixel to isolate the first pixel from the second pixel. The channel stop includes a LOCOS structure and a region of doped silicon beneath the LOCOS structure. The back-illuminated image sensor also includes a first electrically conductive contact that extends through the LOCOS structure and forms an ohmic contact with the region of doped silicon. The first electrically conductive contact may be grounded, negatively biased, or positively biased, depending on the application.

8. 发明申请

WO2016183194A1 SYSTEM AND METHOD FOR REDUCING RADIATION-INDUCED FALSE COUNTS IN AN INSPECTION SYSTEM 审中-公开
标题翻译：在检查系统中减少辐射诱发的虚假计数的系统和方法
公开(公告)号：WO2016183194A1
公开(公告)日：2016-11-17
申请号：PCT/US2016/031843
申请日：2016-05-11
申请人： KLA-TENCOR CORPORATION
发明人： JIANG, Ximan , ROMANOVSKY, Anatoly , WOLTERS, Christian , BIELLAK, Stephen
IPC分类号： G01N23/05 , G01N23/227
CPC分类号： G01T1/24 , G01N21/9501
摘要： An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.
摘要翻译：具有辐射诱导的假计数减轻的检查系统包括被配置为照亮样本的照明源，检测器组件，包括被配置为检测来自样品的照明的照明传感器，以及被配置为检测粒子辐射的一个或多个辐射传感器，以及控制电路通信地耦合到检测器。控制电路被配置为执行以下步骤：基于从辐射传感器接收的一个或多个辐射信号确定一组辐射检测事件，基于从照明传感器接收的照明信号确定一组成像事件，将该组的辐射检测事件发生到所述一组成像事件以产生一组重合事件，其中所述一致事件包括同时成像和辐射检测事件，并且从所述一组成像事件中排除所述一致事件组合以产生一组发现缺陷点。

9. 发明申请

WO2013142511A1 LASER WITH INTEGRATED MULTI LINE OR SCANNING BEAM CAPABILITY 审中-公开
标题翻译：具有集成多线或扫描光束能力的激光
公开(公告)号：WO2013142511A1
公开(公告)日：2013-09-26
申请号：PCT/US2013/032997
申请日：2013-03-19
申请人： KLA-TENCOR CORPORATION
发明人： WOLTERS, Christian , VAZHAEPARAMBIL, Jijen , WOLL, Dirk , ROMANOVSKY, Anatoly , WHITESIDE, Bret , BIELLAK, Stephen , ZHAO, Guoheng
IPC分类号： G02B27/10 , H01S3/101 , G02F1/35
CPC分类号： G02B27/1006 , G02B26/10 , G02B26/106 , G02F1/0105 , G02F1/353 , G03F7/7065 , H01S3/0071 , H01S3/0092
摘要： A method and system for providing illumination is disclosed. The method may include providing a laser having a predetermined wavelength; performing at least one of: beam splitting or beam scanning prior to a frequency conversion; converting a frequency of each output beam of the at least one of: beam splitting or beam scanning; and providing the frequency converted output beam for illumination.
摘要翻译：公开了一种用于提供照明的方法和系统。该方法可以包括提供具有预定波长的激光; 在频率转换之前进行光束分割或光束扫描中的至少一个; 转换以下至少一个的每个输出光束的频率：分束或光束扫描; 并提供用于照明的频率转换输出光束。

10. 发明申请

WO2007044320A3 METHODS AND SYSTEMS FOR INSPECTION OF A WAFER 审中-公开
公开(公告)号：WO2007044320A3
公开(公告)日：2007-04-19
申请号：PCT/US2006/038568
申请日：2006-09-29
申请人： KLA-TENCOR TECHNOLOGIES CORPORATION , SHORTT, David , BIELLAK, Stephen , BELYAEV, Alexander
发明人： SHORTT, David , BIELLAK, Stephen , BELYAEV, Alexander
IPC分类号： G01N21/00
摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.

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