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1. 发明申请

WO2017176915A1 DUAL-COLUMN-PARALLEL CCD SENSOR AND INSPECTION SYSTEMS USING A SENSOR 审中-公开
标题翻译：双列并行CCD传感器和使用传感器的检测系统
公开(公告)号：WO2017176915A1
公开(公告)日：2017-10-12
申请号：PCT/US2017/026199
申请日：2017-04-05
申请人： KLA-TENCOR CORPORATION
发明人： CHUANG, Yung-Ho Alex , ZHANG, Jingjing , ZAMEK, Steve , FIELDEN, John , CONTARATO, Devis , BROWN, David L.
IPC分类号： H04N5/372 , H04N5/378 , H01L27/146
摘要： A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.
摘要翻译：双列并行图像CCD传感器利用包括两对交叉连接的传输门的双列并行读出电路交替地传输来自一对相邻像素列的像素数据（电荷）以低噪声高速共享输出电路。沿着两个相邻像素列以行时钟速率传输的电荷被传输门交替地传递到以两倍线路时钟速率操作的求和门，以将图像电荷传递到共享输出电路。在一个实施例中利用对称的Y形扩散来合并来自两个像素列的图像电荷。还描述了利用线路时钟同步来驱动双列并行CCD传感器的方法。还描述了使用双列并行CCD传感器检查样品的方法。

2. 发明申请

WO2015147963A2 ANTI-REFLECTION LAYER FOR BACK-ILLUMINATED SENSOR 审中-公开
标题翻译：用于背照式传感器的抗反射层
公开(公告)号：WO2015147963A2
公开(公告)日：2015-10-01
申请号：PCT/US2015/010672
申请日：2015-01-08
申请人： KLA-TENCOR CORPORATION
发明人： MURAMATSU, Masaharu , SUZUKI, Hisanori , YONETA, Yasuhito , OTSUKA, Shinya , CHERN, Jehn-Huar Howard , BROWN, David L. , CHUANG, Yung-Ho Alex , FIELDEN, John , IYER, Venkatraman
IPC分类号： H01L27/146 , H01L21/205
CPC分类号： H01L27/1462 , H01L27/1464 , H01L27/14685 , H01L27/14687
摘要： An image sensor for short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. An anti-reflection or protective layer is formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.
摘要翻译：用于短波长光的图像传感器包括半导体膜，在半导体膜的一个表面上形成的电路元件以及在半导体膜的另一个表面上的纯硼层。在纯硼层的顶部形成抗反射层或保护层。该图像传感器即使在多年的高通量连续使用下也具有高效率和高稳定性。图像传感器可以使用CCD（电荷耦合器件）或CMOS（互补金属氧化物半导体）技术制造。图像传感器可以是二维区域传感器或一维阵列传感器。

3. 发明申请

WO2014165544A1 PHOTOMULTIPLIER TUBE, IMAGE SENSOR, AND AN INSPECTION SYSTEM USING A PMT OR IMAGE SENSOR 审中-公开
标题翻译：照相机管，图像传感器和使用PMT或图像传感器的检查系统
公开(公告)号：WO2014165544A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/032579
申请日：2014-04-01
申请人： KLA-TENCOR CORPORATION
发明人： CHUANG, Yung-Ho Alex , BROWN, David L. , FIELDEN, John
IPC分类号： H01L27/146
CPC分类号： H01J40/06 , H01J43/08 , H01L31/02161 , H01L31/103
摘要： A photomultiplier tube includes a semiconductor photocathode and a photodiode. Notably, the photodiode includes a p-doped semiconductor layer, an n-doped semiconductor layer formed on a first surface of the p-doped semiconductor layer to form a diode, and a pure boron layer formed on a second surface of the p-doped semiconductor layer. A gap between the semiconductor photocathode and the photodiode may be less than about 1 mm or less than about 500 µm. The semiconductor photocathode may include gallium nitride, e.g. one or more p-doped gallium nitride layers. In other embodiments, the semiconductor photocathode may include silicon. This semiconductor photocathode can further include a pure boron coating on at least one surface.
摘要翻译：光电倍增管包括半导体光电阴极和光电二极管。值得注意的是，光电二极管包括p掺杂半导体层，形成在p掺杂半导体层的第一表面上以形成二极管的n掺杂半导体层，以及在p掺杂的第二表面上形成的纯硼层半导体层。半导体光电阴极和光电二极管之间的间隙可以小于约1mm或小于约500μm。半导体光电阴极可以包括例如氮化镓。一个或多个p掺杂氮化镓层。在其他实施例中，半导体光电阴极可以包括硅。该半导体光电阴极还可以在至少一个表面上包括纯硼涂层。

4. 发明申请

WO2018044623A1 APPARATUS FOR HIGH-SPEED IMAGING SENSOR DATA TRANSFER 审中-公开
标题翻译：用于高速成像传感器数据传输的装置
公开(公告)号：WO2018044623A1
公开(公告)日：2018-03-08
申请号：PCT/US2017/048011
申请日：2017-08-22
申请人： KLA-TENCOR CORPORATION
发明人： ZAMEK, Steve (Sharon) , BROWN, David L. , IYER, Venkatraman
IPC分类号： H01L27/146 , H01L25/18 , H01L25/16 , H01L21/67 , H01L21/66
摘要： An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.
摘要翻译：成像传感器组件包括至少一个包括多个基板信号线的基板。所述成像传感器组件还包括设置在所述至少一个基板上的至少一个成像传感器封装，所述至少一个成像传感器封装包括设置在至少一个成像传感器封装基板上的至少一个成像传感器。所述成像传感器组件还包括设置在所述至少一个基板上的至少一个接收器封装，所述接收器封装包括设置在至少一个接收器封装基板上的至少一个接收器集成电路。成像传感器组件还包括可操作地耦合到至少一个成像传感器封装和至少一个接收器封装的至少一个电互连。通过至少一个电互连在至少一个成像传感器封装和至少一个接收器封装之间传输多个数据信号。

5. 发明申请

WO2013116579A1 INTEGRATED MULTI-CHANNEL ANALOG FRONT END AND DIGITIZER FOR HIGH SPEED IMAGING APPLICATIONS 审中-公开
标题翻译：用于高速成像应用的集成多通道模拟前端和数字
公开(公告)号：WO2013116579A1
公开(公告)日：2013-08-08
申请号：PCT/US2013/024240
申请日：2013-02-01
申请人： KLA-TENCOR CORPORATION
发明人： BROWN, David L. , KERMAT, Mansour , GLASSER, Lance , NIELSEN, Henrik , ZHENG, Guowu , LEHMAN, Kurt , HATCH, Kenneth , CHUANG, Alex , IYER, Venkatraman
IPC分类号： G06T1/00 , G06T7/00
CPC分类号： H04N5/378 , H01L27/14634 , H04N5/3694 , H04N5/37206 , H04N5/37213
摘要： A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of high density digitizers (HDDs) for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an analog front end (AFE) for conditioning a signal representing one sensor analog output, an analog-to-digital converter (ADC) for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.
摘要翻译：用于高速图像处理的模块包括用于产生表示图像的多个模拟输出的图像传感器和用于同时处理多个模拟输出的多个高密度数字转换器（HDD）。每个HDD是被配置为并行处理预定的一组模拟输出的集成电路。 HDD的每个通道可以包括用于调节表示一个传感器模拟输出的信号的模拟前端（AFE），用于将经调节的信号转换成数字信号的模数转换器（ADC），以及用于校准和格式化数字信号以便传输到片外设备。 HDD和驱动电子设备与图像传感器组合成一个封装，以优化信号完整性和高动态范围，并通过使用同步的HDD通道实现高数据速率。组合多个模块可实现高度可扩展的成像子系统，以优化检测和计量应用。

6. 发明申请

WO2013090261A1 ELECTRON-BOMBARDED CHARGE-COUPLED DEVICE AND INSPECTION SYSTEMS USING EBCCD DETECTORS 审中-公开
标题翻译：使用EBCCD检测器的电子支付充电耦合器件和检查系统
公开(公告)号：WO2013090261A1
公开(公告)日：2013-06-20
申请号：PCT/US2012/068944
申请日：2012-12-11
申请人： KLA-TENCOR CORPORATION
发明人： CHUANG, Yung-Ho Alex , LIU, Xuefeng , FIELDEN, John , BROWN, David L.
IPC分类号： H01J31/50
CPC分类号： G01N21/88 , G01N21/9501 , G01N2021/8822 , G01N2021/95676 , H01J31/26 , H01L27/14806 , H01L27/14818 , H01L27/14856
摘要： A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a plurality of ridges between the holes. The control device may be separated from the photocathode by approximately half a shorter dimension of a CCD pixel or less. A plurality of first electrodes may be provided, wherein each first electrode surrounds a given hole and is separated from the given hole by a gap.
摘要翻译：聚焦EBCCD包括位于光电阴极和CCD之间的控制装置。控制装置具有多个孔，其中多个孔垂直于光电阴极的表面形成，并且其中多个孔的图案与CCD中的像素图案对准。每个孔被形成在面向光电阴极的控制装置的表面上的至少一个第一电极包围。控制装置可以包括孔之间的多个脊。控制装置可以与光电阴极分离CCD像素的大约一半的较短尺寸或更小。可以提供多个第一电极，其中每个第一电极围绕给定的孔并且通过间隙与给定的孔分离。

7. 发明申请

WO2016183451A1 SENSOR WITH ELECTRICALLY CONTROLLABLE APERTURE FOR INSPECTION AND METROLOGY SYSTEMS 审中-公开
标题翻译：具有电气可控制的传感器用于检查和计量系统
公开(公告)号：WO2016183451A1
公开(公告)日：2016-11-17
申请号：PCT/US2016/032378
申请日：2016-05-13
申请人： KLA-TENCOR CORPORATION
发明人： CHUANG, Yung-Ho Alex , FIELDEN, John , BROWN, David L. , ZHANG, Jingjing , LYON, Keith , WANG, Mark Shi
IPC分类号： G01N21/17 , G01B11/30 , G01N21/27
CPC分类号： H04N5/3722 , G01N21/956 , G01N2201/12
摘要： Pixel aperture size adjustment in a linear sensor is achieved by applying more negative control voltages to central regions of the pixel's resistive control gate, and applying more positive control voltages to the gate's end portions. These control voltages cause the resistive control gate to generate an electric field that drives photoelectrons generated in a selected portion of the pixel's light sensitive region into a charge accumulation region for subsequent measurement, and drives photoelectrons generated in other portions of the pixel's light sensitive region away from the charge accumulation region for subsequent discard or simultaneous readout. A system utilizes optics to direct light received at different angles or locations from a sample into corresponding different portions of each pixel's light sensitive region. Multiple aperture control electrodes are selectively actuated to collect/measure light received from either narrow or wide ranges of angles or locations, thereby enabling rapid image data adjustment.
摘要翻译：通过对像素的电阻控制栅极的中心区域施加更多的负的控制电压，并对栅极的端部施加更多的正的控制电压来实现线性传感器中的像素孔径尺寸调整。这些控制电压使得电阻控制栅极产生将在像素的感光区域的选定部分中产生的光电子驱动到用于后续测量的电荷累积区域中的电场，并驱动在像素的光敏区域的其它部分中产生的光电子从电荷累积区域进行随后的丢弃或同时读出。系统利用光学器件将从不同角度或不同位置接收的光引导到每个像素的光敏区域的相应不同部分。选择性地启动多个孔径控制电极以收集/测量从窄范围或宽范围的角度或位置接收的光，从而实现快速的图像数据调整。

8. 发明申请

WO2016033388A1 SCANNING ELECTRON MICROSCOPE AND METHODS OF INSPECTING AND REVIEWING SAMPLES 审中-公开
标题翻译：扫描电子显微镜及其检测方法
公开(公告)号：WO2016033388A1
公开(公告)日：2016-03-03
申请号：PCT/US2015/047307
申请日：2015-08-28
申请人： KLA-TENCOR CORPORATION
发明人： BROWN, David L. , CHUANG, Yung-Ho Alex , FIELDEN, John , TRIMPL, Marcel , ZHANG, Jingjing , CONTARATO, Devis , IYER, Venkatraman
IPC分类号： H01J37/28
CPC分类号： G01N30/72 , G01T1/24 , G06F19/00 , H01J37/244 , H01J37/28 , H01J49/02 , H01J2237/2441 , H01J2237/2446 , H01J2237/24475 , H01J2237/24495 , H01J2237/24592 , H01L27/1464 , H01L27/14659 , H01L27/14661 , H01L31/00
摘要： A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such an unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.
摘要翻译：扫描电子显微镜结合了多像素固态电子检测器。多像素固态检测器可以检测反向散射和/或二次电子。多像素固态检测器可以并入模数转换器和其他电路。多像素固态检测器可以能够近似地确定入射电子的能量和/或可以包含用于处理或分析电子信号的电路。多像素固态检测器适用于高速操作，例如以大约100MHz或更高的速度。扫描电子显微镜可以用于检查，检查或测量诸如未图案化的半导体晶片，图案化半导体晶片，掩模版或光掩模的样品。还描述了检查或检查样品的方法。

9. 发明授权

EP2973713B1 PHOTOMULTIPLIER TUBE, IMAGE SENSOR, AND AN INSPECTION SYSTEM USING A PMT OR IMAGE SENSOR 有权
标题翻译：光电倍增管，图像传感器和使用PMT或图像传感器的检测系统
公开(公告)号：EP2973713B1
公开(公告)日：2017-11-29
申请号：EP14779717.9
申请日：2014-04-01
申请人： KLA - Tencor Corporation
发明人： CHUANG, Yung-Ho Alex , BROWN, David L. , FIELDEN, John
IPC分类号： H01L31/0216 , H01J40/06 , H01J43/08 , H01L31/103
CPC分类号： H01J40/06 , H01J43/08 , H01L31/02161 , H01L31/103
摘要： A photomultiplier tube includes a semiconductor photocathode and a photodiode. Notably, the photodiode includes a p-doped semiconductor layer, an n-doped semiconductor layer formed on a first surface of the p-doped semiconductor layer to form a diode, and a pure boron layer formed on a second surface of the p-doped semiconductor layer. A gap between the semiconductor photocathode and the photodiode may be less than about 1 mm or less than about 500 μm. The semiconductor photocathode may include gallium nitride, e.g. one or more p-doped gallium nitride layers. In other embodiments, the semiconductor photocathode may include silicon. This semiconductor photocathode can further include a pure boron coating on at least one surface.

10. 发明公开

EP2810244A1 INTEGRATED MULTI-CHANNEL ANALOG FRONT END AND DIGITIZER FOR HIGH SPEED IMAGING APPLICATIONS 审中-公开
标题翻译：综合模拟多声道前端和转换器，用于高速记录应用
公开(公告)号：EP2810244A1
公开(公告)日：2014-12-10
申请号：EP13743326.4
申请日：2013-02-01
申请人： Kla-Tencor Corporation
发明人： BROWN, David L. , KERMAT, Mansour , GLASSER, Lance , NIELSEN, Henrik , ZHENG, Guowu , LEHMAN, Kurt , HATCH, Kenneth , CHUANG, Alex , IYER, Venkatraman
IPC分类号： G06T1/00 , G06T7/00
CPC分类号： H04N5/378 , H01L27/14634 , H04N5/3694 , H04N5/37206 , H04N5/37213
摘要： A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of high density digitizers (HDDs) for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an analog front end (AFE) for conditioning a signal representing one sensor analog output, an analog-to-digital converter (ADC) for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

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