专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2007079344A3 METHODS AND SYSTEMS FOR BINNING DEFECTS DETECTED ON A SPECIMEN 审中-公开
标题翻译：用于在样本上检测缺陷的方法和系统
公开(公告)号：WO2007079344A3
公开(公告)日：2008-10-02
申请号：PCT/US2006062100
申请日：2006-12-14
申请人： KLA TENCOR TECH CORP , LIN JASON Z , CHU XING , WU KENONG , MCCAULEY SHARON
发明人： LIN JASON Z , CHU XING , WU KENONG , MCCAULEY SHARON
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G06T2207/30148
摘要： Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image.
摘要翻译：提供了在样本上检测到的合并缺陷的方法和系统。一种方法包括将测试图像与参考图像进行比较。测试图像包括形成在样本上的接近于在样本上检测到的缺陷的一个或多个图案特征的图像。参考图像包括在形成在样本上的装置内的与感兴趣的不同区域相关联的一个或多个图案特征的图像。如果测试图像的一个或多个图案特征与参考图像之一的一个或多个图案特征匹配，则该方法包括将缺陷分配给对应于与参考图像相关联的感兴趣区域的区域。

2. 发明申请

WO2006133233A3 COMPUTER-IMPLEMENTED METHODS FOR PERFORMING DEFECT-TELATED FUNCTIONS 审中-公开
标题翻译：用于执行缺陷函数的计算机实现方法
公开(公告)号：WO2006133233A3
公开(公告)日：2007-11-22
申请号：PCT/US2006022005
申请日：2006-06-06
申请人： KLA TENCOR TECH CORP , DISHNER MARK , LEE CHRISTOPHER W , MCCAULEY SHARON , HUET PATRICK , WANG DAVID
发明人： DISHNER MARK , LEE CHRISTOPHER W , MCCAULEY SHARON , HUET PATRICK , WANG DAVID
IPC分类号： G01B5/28 , G06F19/00
CPC分类号： G05B23/0221
摘要： To use diversity sampling, the user can select diversity sampling and possibly parameters of diversity sampling to be used in the methods described herein One possible interface that provides this capability is a screenshot illustrating one example of a user interface that can be used to select diversity sampling for use in an embodiment of a computer-implemented method described herein Wafer Post processing user interface (18) illustrates a number of options in list (20) In particular, list (20) includes options for Clustering (22). Sampling (24), Repeaters (26), and Defect Limits (28) The Sampling options include Review options (30). Review options (30) include Diversity Sampling option (32) as well as other sampling options. The user may select one or more of the sampling options by clicking on the box next to the name of the sampling option.
摘要翻译：为了使用分集采样，用户可以选择将在本文描述的方法中使用的分集采样和可能的分集采样参数。提供该能力的一个可能的接口是示出可用于选择分集采样的用户界面的一个示例的截图用于在本文描述的计算机实现的方法的实施例中。晶片后处理用户界面（18）示出了列表（20）中的多个选项。特别地，列表（20）包括用于聚类（22）的选项。抽样（24），中继者（26）和缺陷限制（28）抽样选项包括审阅选项（30）。审查选项（30）包括多样性抽样选项（32）以及其他抽样选项。用户可以通过点击采样选项名称旁的方框来选择一个或多个采样选项。

3. 发明专利

DE602004020230D1 未知
公开(公告)号：DE602004020230D1
公开(公告)日：2009-05-07
申请号：DE602004020230
申请日：2004-07-02
申请人： KLA TENCOR TECH CORP
发明人： MARELLA PAUL FRANK , MCCAULEY SHARON , CHANG ELLIS , VOLK WILLIAM , WILEY JAMES , WATSON STERLING , KEKARE SAGAR A , HESS CARL
IPC分类号： G01N21/95 , G01N21/956 , G03F1/44 , G03F7/20
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

4. 发明专利

AT426835T 未知
公开(公告)号：AT426835T
公开(公告)日：2009-04-15
申请号：AT04777530
申请日：2004-07-02
申请人： KLA TENCOR TECH CORP
发明人： MARELLA PAUL FRANK , MCCAULEY SHARON , CHANG ELLIS , VOLK WILLIAM , WILEY JAMES , WATSON STERLING , KEKARE SAGAR A , HESS CARL
IPC分类号： G01N21/95 , G01N21/956 , G03F1/44 , G03F7/20
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

5. 发明申请

WO2005008747A3 METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA 审中-公开
标题翻译：使用设计者信息数据检查波形和反射的方法和系统
公开(公告)号：WO2005008747A3
公开(公告)日：2005-08-25
申请号：PCT/US2004021459
申请日：2004-07-02
申请人： KLA TENCOR TECHNOLOGIES , MARELLA PAUL FRANK , MCCAULEY SHARON , CHANG ELLIS , VOLK WILLIAM , WILEY JAMES , WATSON STERLING , KEKARE SAGAR A , HESS CARL
发明人： MARELLA PAUL FRANK , MCCAULEY SHARON , CHANG ELLIS , VOLK WILLIAM , WILEY JAMES , WATSON STERLING , KEKARE SAGAR A , HESS CARL
IPC分类号： G01N21/95 , G03F1/44 , G03F7/20 , G03F1/00 , G01N21/956
CPC分类号： G06T7/0006 , G01N21/9501 , G01N21/956 , G01N2021/95676 , G03F1/84 , G03F7/7065 , G06T7/0008 , G06T2207/30148
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
摘要翻译：提供了使用设计人员意图数据检查晶圆和标线的方法和系统。一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。另一种计算机实现的方法包括通过结合表示标线的数据分析由晶片的检查产生的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式