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1. 发明申请

WO2010011578A3 COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 审中-公开
标题翻译：用于检查和/或分类WAFER的计算机实现方法
公开(公告)号：WO2010011578A3
公开(公告)日：2010-04-22
申请号：PCT/US2009051044
申请日：2009-07-17
申请人： KLA TENCOR CORP , REICH JUERGEN , VINTRO LOUIS , DIGHE PRASANNA , STEINBACH ANDREW , KAVALDJIEV DANIEL , BIELLAK STEPHEN
发明人： REICH JUERGEN , VINTRO LOUIS , DIGHE PRASANNA , STEINBACH ANDREW , KAVALDJIEV DANIEL , BIELLAK STEPHEN
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , G01N21/9501 , H01L2924/0002 , H01L2924/00
摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
摘要翻译：提供了用于检查和/或分类晶片的计算机实现的方法。一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性的组合，以及使用输出确定的晶片的空间局部化特性。

2. 发明申请

WO2009154952A3 SYSTEMS AND METHODS FOR DETERMINING TWO OR MORE CHARACTERISTICS OF A WAFER 审中-公开
标题翻译：用于确定波形的两个或更多特征的系统和方法
公开(公告)号：WO2009154952A3
公开(公告)日：2010-02-25
申请号：PCT/US2009045124
申请日：2009-05-26
申请人： KLA TENCOR CORP , BIELLAK STEPHEN , KAVALDJIEV DANIEL
发明人： BIELLAK STEPHEN , KAVALDJIEV DANIEL
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , G01N21/9501 , G01N2021/8825 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.
摘要翻译：提供了用于确定晶片的两个或多个特性的系统和方法。两个或更多个特征包括在至少一个维度上空间定位的晶片的特性和晶片在两维空间上不局限的特征。

3. 发明申请

WO2009023154A3 SYSTEMS CONFIGURED TO INSPECT A WAFER 审中-公开
标题翻译：系统配置检查波形
公开(公告)号：WO2009023154A3
公开(公告)日：2009-04-23
申请号：PCT/US2008009571
申请日：2008-08-11
申请人： KLA TENCOR CORP , KADKLY AZMI , BIELLAK STEPHEN , VAEZ-IRAVANI MEHDI
发明人： KADKLY AZMI , BIELLAK STEPHEN , VAEZ-IRAVANI MEHDI
IPC分类号： H01L21/66
CPC分类号： G01N21/9501
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.
摘要翻译：提供了配置用于检查晶片的系统。一个系统包括照明子系统，该照明子系统被配置为以倾斜的入射角将光引导到晶片上来照射晶片上的区域。该系统还包括收集子系统，其被配置为同时收集从照明区域内的不同点散射的光并且将从不同点收集的光聚焦到图像平面中的相应位置。另外，该系统包括检测子系统，该检测子系统被配置为分别检测聚焦到图像平面中的对应位置的光，并且响应于聚焦到图像平面中的对应位置的光单独产生输出。该输出可用于检测晶圆上的缺陷。

4. 发明公开

KR20180031060A 저 노이즈 센서를 이용한 암시야 검사 审中-公开
标题翻译：使用低噪音传感器进行暗场检测
公开(公告)号：KR20180031060A
公开(公告)日：2018-03-27
申请号：KR20187007275
申请日：2016-08-13
申请人： KLA TENCOR CORP
发明人： CHUANG YUNG HO ALEX , BROWN DAVID L , CONTARATO DEVIS , FIELDEN JOHN , KAVALDJIEV DANIEL IVANOV , ZHAO GUOHENG , CHERN JEHN HUAR HOWARD , ZHENG GUOWU , PETTIBONE DONALD , BIELLAK STEPHEN
IPC分类号： G01N21/17 , G01J1/02 , G01N21/88 , H04N5/367
CPC分类号： H04N5/335 , G01N21/9501 , G01N2021/95676 , H04N5/2256 , H04N5/347
摘要： 이미지센서에의해캡쳐되는아날로그이미지데이터값(전하)이, 이미지센서의출력감지노드(부유확산부) 상에서출력신호로서전송되기이전에또는전송되는동안비닝(결합)되고, ADC가출력감지노드각각의리셋사이에서복수의대응하는디지털이미지데이터값을순차적으로생성하도록제어되는검사시스템및 방법. 출력비닝방법에따르면, 이미지센서는각각의리셋사이에서출력감지노드상으로복수의전하를순차적으로전송하도록구동되고, ADC는, 각각의전하가출력감지노드상으로전송된이후, 점진적으로증가하는출력신호를변환하도록제어된다. 다중샘플링방법에따르면, 출력감지노드로전송되기이전에복수의전하는수직으로또는수평으로비닝(합산/결합)되고, ADC는각각의대응하는출력신호를복수회 샘플링한다. 출력비닝및 다중샘플링방법은결합될수도있다.
摘要翻译：的模拟图像数据值（电荷）由图像传感器（副浮动扩散）的图像传感器中，每个ADC失控力感测节点的被捕获，和分级（组合的），而转移或传输到作为输出感测节点上的输出信号被发送并且在该组图像之间顺序地生成多个对应的数字图像数据值。根据该功率比紧固方法，该图像传感器驱动到多个中的电荷传输到每个复位序列，ADC之间的输出感测节点，每次充电以后发送到输出感测节点，以逐渐增加的并被控制来转换输出信号。根据多重采样方法，多个电荷在被发送到输出感测节点之前被垂直或水平地合并（相加/组合），并且ADC对多个相应的输出信号进行采样。输出分箱和多种采样方法可以结合使用。

5. 发明专利

DE112015004550T5 TDI-SENSOR IN EINEM DUNKELFELD-SYSTEM 未知
公开(公告)号：DE112015004550T5
公开(公告)日：2017-06-14
申请号：DE112015004550
申请日：2015-10-02
申请人： KLA TENCOR CORP
发明人： VAZHAEPARAMBIL JIJEN , ZHAO GUOHENG , KAVALDJIEV DANIEL IVANOV , ROMANOVSKY ANATOLY , WOLTERS CHRISTIAN , KREN GEORGE , BIELLAK STEPHEN , WHITESIDE BRET , PETTIBONE DONALD , MALEEV IVAN
IPC分类号： H01L21/66
摘要： Ein Wafer-Abtastsystem umfasst eine abbildende Sammeloptik, um die effektive Spotgröße zu reduzieren. Eine kleinere Spotgröße verringert die Anzahl der Photonen, die durch die Oberfläche proportional zur Fläche des Spots gestreut sind. Die Luftstreuung wird ebenfalls reduziert. TDI wird verwendet, um ein Waferbild zu erzeugen, das auf einer Vielzahl von Bildsignalen basiert, die über die Richtung der Linearbewegung des Wafers integriert sind. Ein Beleuchtungssystem überflutet den Wafer mit Licht, und die Aufgabe, den Spot zu erzeugen, wird der bildgebenden Sammeloptik zugeordnet.

6. 发明专利

SG11201702721RA TDI SENSOR IN A DARKFIELD SYSTEM 未知
公开(公告)号：SG11201702721RA
公开(公告)日：2017-04-27
申请号：SG11201702721R
申请日：2015-10-02
申请人： KLA TENCOR CORP
发明人： VAZHAEPARAMBIL JIJEN , ZHAO GUOHENG , KAVALDJIEV DANIEL IVANOV , ROMANOVSKY ANATOLY , MALEEV IVAN , WOLTERS CHRISTIAN , KREN GEORGE , BIELLAK STEPHEN , WHITESIDE BRET , PETTIBONE DONALD
IPC分类号： H01L21/66
摘要： A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.

7. 发明申请

WO2006094115A3 ENHANCED SIMULTANEOUS MULTI-SPOT INSPECTION AND IMAGING 审中-公开
标题翻译：增强同时多点检测和成像
公开(公告)号：WO2006094115A3
公开(公告)日：2007-03-22
申请号：PCT/US2006007405
申请日：2006-03-01
申请人： KLA TENCOR TECH CORP , BIELLAK STEPHEN , SHORT DAVID
发明人： BIELLAK STEPHEN , SHORT DAVID
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/474 , G01N21/8806
摘要： A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.
摘要翻译：公开了一种用于检查的系统和方法。该设计包括将光轴上的照射光束照射到表面上的照射细长光斑阵列的倾斜角度，沿着线性轴进行线性扫描，其中线性轴线偏离通过非实质角度量的光轴，并且将来自斑点的散射辐射成像到接收器阵列上，使得阵列中的每个接收器接收来自点阵列中的对应点的散射辐射。

8. 发明申请

WO2007044320A2 METHODS AND SYSTEMS FOR INSPECTION OF A WAFER 审中-公开
标题翻译：用于检查晶片的方法和系统
公开(公告)号：WO2007044320A2
公开(公告)日：2007-04-19
申请号：PCT/US2006038568
申请日：2006-09-29
申请人： KLA TENCOR TECH CORP , SHORTT DAVID , BIELLAK STEPHEN , BELYAEV ALEXANDER
发明人： SHORTT DAVID , BIELLAK STEPHEN , BELYAEV ALEXANDER
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/47 , G01N2021/4711 , G01N2021/8854
摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.
摘要翻译：提供了用于检查晶片的方法和系统。一种方法包括用透射入晶片的第一波长的光照射晶片，以及用基本上不穿透晶片的第二晶片照射光。该方法还包括响应来自照明步骤的来自晶片的光而产生输出信号。此外，该方法包括使用输出信号检测晶片上的缺陷。该方法进一步包括使用输出信号确定缺陷是否是表面缺陷或表面缺陷。

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