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    • 3. 发明专利
    • System and method for inspecting semiconductor wafers
    • 用于检查半导体波形的系统和方法
    • JP2010249833A
    • 2010-11-04
    • JP2010131351
    • 2010-06-08
    • Kla-Tencor Corpケーエルエー−テンカー コーポレイション
    • ROSENGAUS ELIEZERLANGE STEVEN R
    • G01B11/30G01N21/956G01N21/95G06T1/00H01L21/66H01L21/677
    • G01N21/95623G01N21/9501G01N2021/8822H01L21/67155
    • PROBLEM TO BE SOLVED: To enable high-speed inspection of semiconductor wafers. SOLUTION: A plurality of independent, low cost, optical-inspection subsystems 30 are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer 20. The wafer location relative to the inspection is controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtering. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer 50 to aid in statistical process control, particularly for manufacturing equipment. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了能够高速检查半导体晶片。 解决方案:多个独立的,低成本的光学检查子系统30被封装和集成,以同时对晶片20的部分进行并行检查。控制相对于检查的晶片位置,使得整个晶片被成像 通过光学子系统的系统以光栅扫描模式。 单色相干光源照亮晶片表面。 暗场光学系统收集散射光,并使用傅立叶滤波对由有效的周期性晶片结构产生的滤波图案进行滤波。 滤波后的光由通用数字信号处理器处理。 图像减法方法用于检测晶片缺陷,其报告给主计算机50,以帮助统计过程控制,特别是用于制造设备。 版权所有(C)2011,JPO&INPIT
    • 8. 发明公开
    • A SYSTEM AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS
    • VORRICHTUNG UND VERFAHREN ZUMPRÜFENVON HALBLEITERSCHEIBEN
    • EP1075652A4
    • 2007-06-06
    • EP99921584
    • 1999-04-30
    • KLA TENCOR CORP
    • ROSENGAUS ELIEZERLANGE STEVEN R
    • G01B11/30G01N21/95G01N21/956G06T1/00H01L21/66H01L21/677G01N21/89
    • G01N21/95623G01N21/9501G01N2021/8822H01L21/67155
    • A method for inspecting semiconductor wafers is provided in which a plurality of independent, low cost, optical-inspection subsystems (30) are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer (20), the wafer location relative to the inspection being controlled so that the entire wafer (20) is imaged by the system of optical subsystems (30) in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtering. The filtered light is processed by general purpose digital-signal processors (19). Image subtraction methods are used to detect wafer defects, which are reported to a main computer (50) to aid in statistical process control, particularly for manufacturing equipment.
    • 提供了一种用于检查半导体晶片的方法,其中多个独立的低成本光学检查子系统(30)被封装和集成以同时执行晶片(20)的部分的平行检查,相对于检查的晶片位置 被控制为使得整个晶片(20)由光学子系统(30)的系统以光栅扫描模式成像。 单色相干光源照射晶圆表面。 暗场光学系统使用傅里叶滤波来收集散射光并过滤由有效的周期性晶片结构产生的图案。 滤波后的光由通用数字信号处理器(19)处理。 图像减法方法被用于检测晶片缺陷,其被报告给主计算机(50)以辅助统计过程控制,特别是用于制造设备。