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1. 发明专利

SG11201700784QA REPEATER DETECTION 未知
公开(公告)号：SG11201700784QA
公开(公告)日：2017-03-30
申请号：SG11201700784Q
申请日：2015-08-27
申请人： KLA TENCOR CORP
发明人： CHEN HONG , WU KENONG , SHIFRIN EUGENE , YAMAOKA MASATOSHI , SIVARAMAN GANGADHARAN , BABULNATH RAGHAV , KURADA SATYA , SUN ALFONSO
IPC分类号： H01L21/66
摘要： Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

2. 发明申请

WO2010148343A2 METHODS AND APPARATUS FOR SIMULTANEOUSLY INSPECTING MULTIPLE ARRAY REGIONS HAVING DIFFERENT PITCHES 审中-公开
标题翻译：同时检查具有不同切片的多个阵列区域的方法和装置
公开(公告)号：WO2010148343A2
公开(公告)日：2010-12-23
申请号：PCT/US2010039238
申请日：2010-06-18
申请人： KLA TENCOR CORP , CHEN HONG , LIN JASON Z
发明人： CHEN HONG , LIN JASON Z
IPC分类号： H01L21/027 , G01N21/956 , G03F1/08
CPC分类号： G01N21/956 , G01N2021/95676 , G03F1/84 , H01L22/12
摘要： One embodiment relates to a method of automatically inspecting multiple array regions (102) simultaneously using an imaging apparatus (302). The method includes selecting (211 or 212) an optimal pixel size such that each array region in the multiple array regions has a grouped cell which is an integer number of pixels in size, and adjusting a pixel size of the imaging apparatus to be the selected optimal pixel size. Optimal pixel sizes within an available range of pixel sizes may be determined by finding (202) a largest common divider of cell sizes of the multiple array regions when the cell sizes are expressed in integers. Pre-set criteria may be applied to determine (208) which, if any, of the optimal pixel sizes are acceptable based on pre-set criteria. If none of the optimal pixel sizes are acceptable, then one of the array regions may be marked for digital interpolation (see 216). Other embodiments, aspects, and features are also disclosed.
摘要翻译：一个实施例涉及一种使用成像设备（302）同时自动检查多个阵列区域（102）的方法。该方法包括选择（211或212）最佳像素大小，使得多个阵列区域中的每个阵列区域具有分组的小区，其大小为整数像素，并且将成像设备的像素大小调整为所选择的最佳像素大小。可以通过在单元格大小以整数表示时，找到（202）多个阵列区域的单元大小的最大公共分频器来确定像素大小的可用范围内的最佳像素大小。可以应用预设标准以基于预设标准来确定（208）哪些最佳像素大小是可接受的。如果没有最佳像素尺寸是可以接受的，则可以将阵列区域之一标记为数字插值（参见216）。还公开了其它实施例，方面和特征。

3. 发明专利

SG10201903148WA REPEATER DETECTION 未知
公开(公告)号：SG10201903148WA
公开(公告)日：2019-05-30
申请号：SG10201903148W
申请日：2015-08-27
申请人： KLA TENCOR CORP
发明人： CHEN HONG , WU KENONG , SHIFRIN EUGENE , YAMAOKA MASATOSHI , SIVARAMAN GANGADHARAN , BABULNATH RAGHAV , KURADA SATYA , SUN ALFONSO
摘要： REPEATER DETECTION Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the an - ay region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s). (Figure ) 38

4. 发明专利

SG11201703560VA WAFER DEFECT DISCOVERY 未知
公开(公告)号：SG11201703560VA
公开(公告)日：2017-05-30
申请号：SG11201703560V
申请日：2015-11-04
申请人： KLA TENCOR CORP
发明人： CHEN HONG , WU KENONG , PLIHAL MARTIN , PANDITA VIDUR , SANAPALA RAVIKUMAR , BHAGAT VIVEK , LAKHAWAT RAHUL , BARIS OKSEN , RAMACHANDRAN RAJESH , HAQUE NOASHIN
IPC分类号： H01L21/66
摘要： Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

5. 发明公开

EP2289096A4 METHODS AND SYSTEMS FOR GENERATING INFORMATION TO BE USED FOR SELECTING VALUES FOR ONE OR MORE PARAMETERS OF A DETECTION ALGORITHM 无效
标题翻译： VERFAHREN UND SYSTEME ZUR ERZEUGUNG VON INFORMATIONENFÜRDIE AUSWAHL VON WERTENFÜREINEN ODER MEHRERE PARAMETER EINES DETEKTIONSALGORITHMUS
公开(公告)号：EP2289096A4
公开(公告)日：2017-08-02
申请号：EP09759037
申请日：2009-05-26
申请人： KLA-TENCOR CORP
发明人： CHEN HONG , VAN RIET MICHAEL J , CHEN CHIEN - HUEI (ADAM) , LIN JASON Z , MAHER CHRIS , KOWALSKI MICHAEL , BECKER BARRY , CHEN STEPHANIE , BALAKRISHNAN SUBRAMANIAN , TUMMALA SURYANARAYANA
IPC分类号： H01L21/66
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8822 , G01N2021/8854

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