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    • 4. 发明公开
    • HEAT DISSIPATION MATERIAL
    • 散热材料
    • EP3318593A1
    • 2018-05-09
    • EP16817598.2
    • 2016-05-25
    • Shin-Etsu Chemical Co., Ltd.
    • UTA, AkiraIKENO, MasayukiMATSUMOTO, NobuakiMASUDA, KoheiSAKAMOTO, Takafumi
    • C08G77/52C08L83/14C08K3/00C09K5/00H01L23/36H01L23/373
    • C09K5/14C08G77/52C08K3/00C08K3/22C08K7/18C08K2003/2227C08K2201/001C08L83/14H01L23/36H01L23/373H01L23/3733H01L23/3737
    • Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1).

      (Ar is a mesogen group selected from the structure represented by the following formulae.

      a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the proportion of each number of repeating units in molecules, and a + b = 1). R 1 is independently a monovalent hydrocarbon group which does not independently include a C 1-8 aliphatic unsaturated bond. R 2 is independently a hydrogen atom, -Si(CH 3 ) 3 , -Si(CH 3 ) 2 (OH), -Si(CH 3 ) 2 (CH=CH) or -Si(CH 3 ) 2 (CH 2 -CH=CH 2 )).
      This heat dissipation material has excellent thermal conductivity and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
    • 本发明提供一种由通式(1)表示的数均分子量为1,000〜500,000的介晶/硅化合物(共)聚合物的散热材料。 (Ar是选自下式所示结构的介晶基团,a表示0.5-1的正数,b表示0-0.5的数(a和b各自代表每个数的比例) a + b = 1),R 1独立地为不独立地包含C 1-8脂肪族不饱和键的一价烃基,R 2独立地为氢原子,-Si(CH 3)3,-Si CH3)2(OH), - Si(CH3)2(CH = CH)或-Si(CH3)2(CH2-CH = CH2))。 该散热材料具有优异的导热性,并且还显示出良好的热塑性,并且具有优异的成型性,因此可以适当地用作散热材料和半导体器件以及电子部件的树脂材料。
    • 7. 发明公开
    • BLOCKING AGENT FOR ISOCYANATE GROUP, AND ISOCYANATE PROTECTED BY SAID BLOCKING AGENT
    • EP4067403A1
    • 2022-10-05
    • EP20894237.5
    • 2020-11-19
    • Shin-Etsu Chemical Co., Ltd.
    • ASO, FumihiroMASUDA, Kohei
    • C08G18/80
    • One of the purposes of the present invention is to provide a blocking agent for blocking an isocyanate group to, thereby, prepare an isocyanate compound which has excellent water resistance and is reacted with another polymerizable compound to be cured at a relatively low temperature; another purpose is to provide a blocked isocyanate having an isocyanate group blocked with the blocking agent. The present invention provides a blocking agent for blocking an isocyanate group, wherein the blocking agent is an organic silicon alcohol having an organic group bonded to a silicon atom, and said organic group is capable of forming a β-silyl cation together with the silicon atom. In a preferred embodiment, the present invention provides a blocking agent which is an organic silicon alcohol represented by the general formula (1). In the formula (1), R 1 is an alkylene group having 3 to 5 carbon atoms and may have a substituent, provided that the number of carbon atoms of the substituent is not included in the number of the carbon atoms of the alkylene group; R 2 is an alkyl group having 1 to 10 carbon atoms; Z is an organic group capable of forming a β-silyl cation together with the silicon atom to which Z bonds; and n is an integer of 1 to 3. The present invention further provides a blocked isocyanate having a structure in which the isocyanate group is blocked with the aforesaid blocking agent, and a thermosetting composition comprising the blocked isocyanate.