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    • 6. 发明申请
    • APPARATUS AND METHOD FOR CONTROLLED COMBUSTION OF GASEOUS POLLUTANTS
    • 控制燃烧气体污染物的装置和方法
    • WO2005062772A3
    • 2007-01-18
    • PCT/US2004042334
    • 2004-12-16
    • ADVANCED TECH MATERIALSFERRON SHAWNKELLY JOHNVERMEULEN ROBBERT
    • FERRON SHAWNKELLY JOHNVERMEULEN ROBBERT
    • B01D50/00B01D53/34F23D3/40F23G7/06F23L7/00F23M5/00
    • B01D53/34F23G7/061F23L7/00F23L2900/07005F23L2900/07008F23M5/00F23M2900/05004Y02E20/344
    • The present invention relates to systems and methods for controlled combustion of gaseous pollutants while reducing and removing deposition of unwanted reaction products from within the treatment systems. The systems employ a two-stage thermal reactor (10) having an upper thermal reactor (12) including at least one inlet (16) for mixing a gaseous waste stream with oxidants and combustible fuels for thermal combustion within the upper thermal reactor (12). The upper thermal reactor (12) further includes a double wall structure having an outer exterior wall (20) and an interior porous wall (22) that defines an interior space (26) for holding a fluid and ejecting same, in a pulsating mode, through the interior porous wall (22) into the upper thermal reactor (12) to reduce deposition of the reaction products on the interior of the upper reactor chamber (12). The two-stage thermal reactor (10) further includes a lower reactor chamber (14) through a water vortex (33) that provides a water overflow along the interior of the lower reactor chamber thereby reducing deposition of unwanted products on the interior surface of the lower reactor (14).
    • 本发明涉及用于气态污染物的受控燃烧的系统和方法,同时减少和去除处理系统内不需要的反应产物的沉积。 该系统采用具有上部热反应器(12)的两级热反应器(10),其包括用于将气态废物流与氧化剂混合的至少一个入口(16)和用于在上部热反应器(12)内热燃烧的可燃性燃料, 。 上部热反应器(12)还包括双壁结构,其具有外部外壁(20)和内部多孔壁(22),其限定用于保持流体并以脉动模式喷射流体的内部空间(26) 通过内部多孔壁(22)进入上部热反应器(12)以减少反应产物在上部反应器室(12)内部的沉积。 两级热反应器(10)还包括通过水涡流(33)的下反应器室(14),其沿着下反应器室的内部提供水溢流,从而减少不需要的产物在内反应器 下反应器(14)。
    • 7. 发明申请
    • ENCAPSULATED CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME
    • 封装的导电聚合物装置及其制造方法
    • WO2004053898A2
    • 2004-06-24
    • PCT/US0302339
    • 2003-01-24
    • BOURNS INCBURKE RAYO'BRIEN MAURICEAHEARNE BRIANKELLY JOHNBOURNS GORDON L
    • BURKE RAYO'BRIEN MAURICEAHEARNE BRIANKELLY JOHNBOURNS GORDON L
    • H01C1/028H01C1/14H01C1/142H01C17/00H01C17/02H01C
    • H01C1/14H01C1/028H01C1/1406H01C1/142H01C17/006H01C17/02H01C17/281
    • The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.
    • 本发明涉及封装或绝缘装置。 在某些环境和应用中,有必要保护设备免受外部代理的影响。 本发明通过提供一种包括具有限定在其中的孔的绝缘材料的部分来实现这一点。 活动的元件,例如正温度系数(PTC)的材料被接收在限定的孔内。 元件基本上被一侧上的第一金属层和相对侧上的第二金属层覆盖。 第一绝缘材料层基本上覆盖第一金属层,第二绝缘材料层基本上覆盖第二金属层。 第一端子提供到第一金属层的外部电连接,而第二端子提供到第二金属层的外部电连接。 第一端子通过导电布线连接到第一金属层,导电布线穿过第一绝缘层,第二端子通过导电布线连接到第二金属层,穿过第二绝缘层。 此外,本发明提供了一种使用常规PCB技术制造矩阵形式的器件的方法,以便于大量生产封装器件。 另外,所得到的组件可以用作单一设备中的含铅或SMT组件或SIP和DIP封装中的多个器件配置。