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1. 发明申请

WO2006041117A8 PLATING MATERIAL, POLYAMIC ACID SOLUTION USING SAID PLATING MATERIAL, POLYIMIDE RESIN SOLUTION, AND PRINTED WIRING BOARD USING THEM 审中-公开
标题翻译：使用固化材料，聚酰胺树脂溶液和印刷线路板使用它们的涂料，聚酰胺溶液
公开(公告)号：WO2006041117A8
公开(公告)日：2006-06-22
申请号：PCT/JP2005018848
申请日：2005-10-13
申请人： KANEKA CORP , SHIMOOSAKO KANJI , ITO TAKASHI , TANAKA SHIGERU , NISHINAKA MASARU , MURAKAMI MUTSUAKI
发明人： SHIMOOSAKO KANJI , ITO TAKASHI , TANAKA SHIGERU , NISHINAKA MASARU , MURAKAMI MUTSUAKI
IPC分类号： C23C18/20 , B32B15/088 , C08G73/10 , H05K3/18
CPC分类号： C23C18/31 , C08G73/10 , C23C18/20 , C23C18/2033 , C23C18/2066 , C23C18/38 , H05K1/0346 , H05K3/181 , H05K3/4661 , H05K2201/0154 , H05K2203/066 , H05K2203/0759 , Y10S428/901 , Y10T428/24355 , Y10T428/24917 , Y10T428/254 , Y10T428/31663 , Y10T428/31681 , Y10T428/31721
摘要： This invention provides a plating material characterized in that the plating material comprises a layer (A) to be electrolessly plated, the surface roughness of the layer (A) is less than 0.5 µm in terms of arithmetical mean roughness Ra as measured at a cutoff value of 0.002 mm, the 90-degree peel adhesion of the layer (A) is not more than 1.0 N/25 mm, and the layer (A) contains a polyimide resin. There is also provided a plating material characterized in that the plating material comprises a layer (A) to be electrolessly plated, the layer (A) contains a resin, and the tensile modulus of elasticity of a sheet formed of the layer (A) is not more than 1.8 GPa. According to the plating material, even when the surface roughness of the material surface is small, the adhesion between the material surface and an electrolessly plated film formed on the material surface is excellent, and, further, a good electroless plating can be formed over the whole area of the surface. Accordingly, the plating material is suitable for use, for example, in the production of printed wiring boards. A polyamic acid solution used in the plating material, a polyimide resin solution, and a printed wiring board using them are also provided.
摘要翻译：本发明提供一种电镀材料，其特征在于，电镀材料包括无电镀层（A），层（A）的表面粗糙度以以截止值测定的算术平均粗糙度Ra为0.5μm以下为0.002mm，层（A）的90度剥离粘合力不大于1.0N / 25mm，层（A）含有聚酰亚胺树脂。还提供一种电镀材料，其特征在于，电镀材料包括无电镀层（A），层（A）含有树脂，由层（A）形成的片材的拉伸弹性模量为不超过1.8 GPa。根据电镀材料，即使在材料表面的表面粗糙度小的情况下，材料表面和形成在材料表面上的无电解镀膜之间的粘附性也优异，并且可以形成良好的化学镀表面的整个面积。因此，电镀材料适用于例如印刷电路板的制造。还提供了用于电镀材料的聚酰胺酸溶液，聚酰亚胺树脂溶液和使用它们的印刷线路板。

2. 发明申请

WO2006112474A2 FIBER-RESIN COMPOSITE MATERIAL, MULTILAYER BODY, PRINTED WIRING BOARD, AMD METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开
标题翻译：纤维树脂复合材料，多层体，印刷线路板，AMD制造印刷线路板的方法
公开(公告)号：WO2006112474A2
公开(公告)日：2006-10-26
申请号：PCT/JP2006308210
申请日：2006-04-19
申请人： KANEKA CORP , SHIMOOSAKO KANJI , ITO TAKASHI , TANAKA SHIGERU , NISHINAKA MASARU , MURAKAMI MUTSUAKI
发明人： SHIMOOSAKO KANJI , ITO TAKASHI , TANAKA SHIGERU , NISHINAKA MASARU , MURAKAMI MUTSUAKI
IPC分类号： B32B15/08 , B32B15/088 , H05K1/03 , H05K3/18 , H05K3/38
CPC分类号： H05K3/387 , B32B15/08 , B32B15/20 , B32B27/12 , B32B27/281 , B32B2255/02 , B32B2255/26 , B32B2457/08 , H05K1/036 , H05K1/0366 , H05K3/181 , H05K2201/0154 , Y10T428/31504 , Y10T428/31507 , Y10T428/31663 , Y10T428/31678 , Y10T428/31721 , Y10T428/31786
摘要： Disclosed are a copper-clad laminate usable for formation of highly reliable fine wiring wherein a copper foil is securely fixed to a flat and smooth surface, a multilayer body, a material for electroless plating, and a fiber-resin composite material. Also disclosed is a printed wiring board obtained by using them. Further disclosed are a method for manufacturing a multilayer printed wiring board which enables to accurately form fine wiring, and a multilayer printed wiring board obtained by such a manufacturing method. The copper-clad laminate comprises a plated copper layer (1), a resin layer (2) and a fiber-resin composite material layer (3). At least the plated copper layer (1) and the resin layer (2) are arranged in contact with each other. In this copper-clad laminate (10), the plated copper layer is formed on the resin layer which exhibits good adhesion to a copper foil. Consequently, the copper foil can be securely adhered to the resin layer even when the surface of the resin layer is flat and smooth. Therefore, this copper-clad laminate enables to form more reliable fine wiring than the conventional copper-clad laminates.
摘要翻译：公开了一种可用于形成高可靠性细线的铜箔层压板，其中铜箔牢固地固定在平坦光滑的表面上，多层体，用于化学镀的材料和纤维 - 树脂复合材料。还公开了通过使用它们获得的印刷线路板。进一步公开了一种能够精确地形成精细布线的多层印刷布线板的制造方法以及通过这种制造方法获得的多层印刷布线板。覆铜层压板包括镀铜层（1），树脂层（2）和纤维树脂复合材料层（3）。至少镀铜层（1）和树脂层（2）彼此接触。在该覆铜层叠体（10）中，在铜箔上具有良好的粘附性的树脂层上形成镀覆铜层。因此，即使当树脂层的表面平坦且光滑时，铜箔也可以牢固地粘附到树脂层。因此，这种覆铜层压板能够形成比常规的覆铜层压板更可靠的精细布线。

3. 发明专利

FR2786193A1 Laminates with improved retention of resistance to tearing, for use in making insulating ribbons, obtained by application of layer of fluorinated resin to one or both sides of a polyimide film 未知
公开(公告)号：FR2786193A1
公开(公告)日：2000-05-26
申请号：FR9914597
申请日：1999-11-19
申请人： KANEKA CORP
发明人： NISHINAKA MASARU , ONO KAZUHIRO , AKAHORI KIYOKAZU
IPC分类号： C08G73/10 , C08J7/04 , C08L79/08 , H01B3/30
摘要： Polyimide/fluorinated resin laminate is obtained by application of layer of fluorinated resin to one or both sides of a polyimide film. The force of resistance to propagation of a tear in the polyimide film after heating at 150 deg C in 100% relative humidity for 12 hours is not less than 80% of the force before exposure. Independent claims are also included for: (a) insulating ribbon made from the laminate; and (b) method for making the laminate.

4. 发明专利

FR2786193B1 未知
公开(公告)号：FR2786193B1
公开(公告)日：2002-03-22
申请号：FR9914597
申请日：1999-11-19
申请人： KANEKA CORP
发明人： NISHINAKA MASARU , ONO KAZUHIRO , AKAHORI KIYOKAZU
IPC分类号： C08G73/10 , C08J7/04 , C08L79/08 , H01B3/30
摘要： A polyimide/fluororesin laminate comprises a polyimide film and a fluororesin layer. The tear propagation resistance strength of the polyimide film after being exposed to 150° C. 100% RH environment for 12 hours is not less than 80% of the tear propagation resistance strength of the polyimide film before exposure. Particularly, the polyimide film contains at least one of Al, Si, Ti, Mn, Fe, Co, Cu, Zn, Sn, Sb, Pb, and Bi. The laminate is useful for an insulating tape for wire-winding.

5. 发明专利

JP2007106951A Solution, material for direct plating and printed wiring board 审中-公开
标题翻译：解决方案，用于直接镀层和印刷线路板的材料
公开(公告)号：JP2007106951A
公开(公告)日：2007-04-26
申请号：JP2005301354
申请日：2005-10-17
申请人： Kaneka Corp , 株式会社カネカ
发明人： SHIMOOOSAKO KANJI , ITO TAKU , TANAKA SHIGERU , NISHINAKA MASARU
IPC分类号： C08J5/18 , B32B15/08 , B32B27/34 , C08J7/04 , C08L79/08 , H05K1/03 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To obtain a material for direct plating, which is suitably useful for producing a printed wiring board, and, even in small surface roughness of the surface of the material, has excellent adhesiveness to a metal layer formed by direct plating on the surface and a solution and to provide a printed wiring board using the material. SOLUTION: The material for direct plating has at least a surface (a) for forming a metal layer by direct plating. The surface roughness of the surface (a) is ≤0.5 μm arithmetic mean roughness measured at 0.002 mm cut-off value. The surface (a) comprises a polyimide resin having one or more structures among structures represented by general formulas (1)-(6). COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得适用于生产印刷线路板的直接电镀材料，即使在材料表面的小表面粗糙度中，与由金属层形成的金属层也具有优异的粘附性在表面上直接镀覆和溶液，并提供使用该材料的印刷线路板。解决方案：用于直接电镀的材料至少具有用于通过直接电镀形成金属层的表面（a）。表面（a）的表面粗糙度在0.002 mm截止值下测量的≤0.5μm算术平均粗糙度。表面（a）包括在通式（1） - （6）表示的结构中具有一个或多个结构的聚酰亚胺树脂。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006339164A Insulating tape for covering electric wire 审中-公开
标题翻译：用于覆盖电线的绝缘胶带
公开(公告)号：JP2006339164A
公开(公告)日：2006-12-14
申请号：JP2006168270
申请日：2006-06-19
申请人： Kaneka Corp , 株式会社カネカ
发明人： NISHINAKA MASARU , ONO KAZUHIRO , AKAHORI RENICHI
IPC分类号： H01B7/17 , B32B27/30
摘要： PROBLEM TO BE SOLVED: To provide an insulating tape for insulating and covering a coil for a motor, a cable, an electric wire for an aircraft or the like by using a laminate of a polyimide film and a fluororesin improved in resistance when exposed to a high-temperature and high-humidity environment.
SOLUTION: The insulating tape for covering an electric wire is obtained by processing a laminate into a tape form, the laminate being formed by laminating a fluororesin layer on one or both surfaces of a polyimide film containing Ti element. The concentration of the atoms of the Ti element on the surface of the polyimide film is within a range of 0.2 to 1 atomic%. The laminate has a property of passing a withstand voltage test performed after being immersed in a 70°C aqueous solution of 5 wt% sodium chloride for 2000 hours, according to the SAE AS4373 method 602.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于绝缘和覆盖用于电动机的线圈，电缆，飞行器用电线等的绝缘带，其通过使用聚酰亚胺膜和氟树脂的层压体来改善电阻，暴露于高温高湿环境下。解决方案：用于覆盖电线的绝缘带通过将层压体加工成带状而获得，层压体通过在含有Ti元素的聚酰亚胺膜的一个或两个表面上层压氟树脂层而形成。聚酰亚胺膜表面上的Ti元素的原子浓度在0.2〜1原子％的范围内。根据SAE AS4373方法602，层压体具有将浸渍在5重量％氯化钠的70℃水溶液中进行的耐压试验2000小时后的性能。（C）2007年， JPO＆INPIT

7. 发明专利

JP2006183132A Solution, material for plating, and printed wiring board 审中-公开
标题翻译：解决方案，涂料和印刷电路板材料
公开(公告)号：JP2006183132A
公开(公告)日：2006-07-13
申请号：JP2005276306
申请日：2005-09-22
申请人： Kaneka Corp , 株式会社カネカ
发明人： SHIMOOOSAKO KANJI , ITO TAKU , TANAKA SHIGERU , NISHINAKA MASARU , MURAKAMI MUTSUAKI
IPC分类号： C23C18/20 , B32B15/08 , B32B15/088
摘要： PROBLEM TO BE SOLVED: To provide a material for plating which can be suitably used in printed wiring board manufacture and the like, the material for plating and a solution having excellent adhesion to an electroless plating film formed on the material surface even when the surface roughness of the material surface is small, and a printed wiring board manufactured by using such material for plating and solution. SOLUTION: The material for electroless plating has at least a surface (a) whereupon electroless plating is to be performed, and the surface roughness of the surface (a) is 0.5 μm or less in an arithmetic average roughness measured with a cut off value of 0.002 mm and the surface (a) contains a polyimide resin having siloxane structure. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供可适用于印刷线路板制造等的电镀材料，即使在电镀的材料上形成的化学镀膜也具有优异的粘附性的溶液，即使在材料表面的表面粗糙度小，并且通过使用这种材料制成的印刷线路板进行电镀和溶液。解决方案：用于化学镀的材料至少具有表面（a），然后进行化学镀，并且在用切割测量的算术平均粗糙度中表面（a）的表面粗糙度为0.5μm以下剥离值为0.002mm，表面（a）含有具有硅氧烷结构的聚酰亚胺树脂。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005001384A Laminate and manufacturing method for printed wiring board 审中-公开
标题翻译：印刷线路板的层压和制造方法
公开(公告)号：JP2005001384A
公开(公告)日：2005-01-06
申请号：JP2004150494
申请日：2004-05-20
申请人： Kaneka Corp , 株式会社カネカ
发明人： MURAKAMI MUTSUAKI , SHIMOOOSAKO KANJI , NISHINAKA MASARU , ITO TAKU , TANAKA SHIGERU
IPC分类号： B32B15/088 , B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board on which a high-density circuit can be formed and which shows excellent adhesion and good adhesion reliability under high-temperature and high-humidity environment. SOLUTION: A plating film showing excellent adhesion force is formed on a smooth surface by using a layered product comprising a thermoplastic polyimide resin containing an organic thiol-derivative compound and a metal thin film formed by a physical method. The high-density circuit is formed by using it. The manufacture of the printed wiring board by using the layered product enables formation of the high-density printed wiring board and achieves good adhesion and excellent adhesion reliability under high-temperature and high-humidity environment. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够形成高密度电路的印刷电路板，并且在高温和高湿度环境下显示出优异的粘合性和良好的粘合可靠性。解决方案：通过使用包含含有有机硫醇衍生物化合物的热塑性聚酰亚胺树脂和通过物理方法形成的金属薄膜的层叠体，在光滑表面上形成显示出优异粘合力的电镀膜。通过使用高密度电路形成。通过使用层叠体制造印刷线路板，能够形成高密度印刷线路板，并且在高温高湿环境下实现良好的附着力和优异的粘附可靠性。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2008270283A Flexible printed wiring board 审中-公开
标题翻译：柔性印刷接线板
公开(公告)号：JP2008270283A
公开(公告)日：2008-11-06
申请号：JP2007107409
申请日：2007-04-16
申请人： Kaneka Corp , 株式会社カネカ
发明人： SHIMOOOSAKO KANJI , ITO TAKU , NISHINAKA MASARU , TANAKA SHIGERU
IPC分类号： H05K1/02 , H05K3/18 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board excellent in through hole reliability and fine wiring formation property, and to provide a flexible printed wiring board allowing high-density mounting.
SOLUTION: A flexible printed wiring board excellent in through hole reliability and fine wiring formation property is provided by a flexible printed wiring board satisfying a relation (a)-(b)≤10 μm between the thickness (a) of wiring formed on the surface and the thickness (b) of a conductor layer at the opening of the through hole.
COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2008103413A Solution, material for electroless plating, and printed-wiring board 审中-公开
标题翻译：电解镀层材料和印刷电路板的解决方案
公开(公告)号：JP2008103413A
公开(公告)日：2008-05-01
申请号：JP2006282829
申请日：2006-10-17
申请人： Kaneka Corp , 株式会社カネカ
发明人： SHIMOOOSAKO KANJI , TANAKA SHIGERU , NISHINAKA MASARU
IPC分类号： H05K1/03 , B32B15/088 , B32B27/34 , C08L79/08 , C23C18/16 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a material for electroless plating that is a material for plating used for the manufacturing, or the like of a printed-wiring board ideally and has excellent adhesiveness with a nonelectrolytic plating film formed on a surface even if surface roughness on the surface of the material is small, and to provide a solution and the printed-wiring board using the solution.
SOLUTION: In the material for electroless plating having the surface (a) to be subjected to electroless plating, the surface roughness on the surface (a) is not more than 0.5 μm in arithmetic average roughness measured at a cutoff value 0.002 mm, and a polyimide resin having an alicyclic structure is contained.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于化学镀的材料，其是用于印刷电路板的制造等的电镀材料，理想的是与表面上形成的非电解电镀膜的粘附性甚至均匀如果材料表面的表面粗糙度小，并且使用溶液提供溶液和印刷电路板。解决方案：在具有待化学镀的表面（a）的化学镀的材料中，表面（a）上的表面粗糙度在以0.002mm的截止值测量的算术平均粗糙度不大于0.5μm ，含有脂环结构的聚酰亚胺树脂。版权所有（C）2008，JPO＆INPIT

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