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1. 发明公开

EP0764520A4 MODIFIED POLYIMIDE-FLUORORESIN LAMINATE FILM 失效
标题翻译：改性聚酰亚胺 - FLUOROHART复合膜
公开(公告)号：EP0764520A4
公开(公告)日：1999-09-01
申请号：EP96908365
申请日：1996-04-04
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KATAOKA KOSUKE , KURIBAYASHI EIICHIRO , OHNARI YOSHIHIDE
IPC分类号： B32B27/08 , B32B27/16 , C08J7/04 , B32B27/30 , C08J7/06
CPC分类号： B32B27/08 , B32B27/16 , B32B27/281 , B32B27/322 , B32B2310/14 , C08J7/047 , C08J2379/08 , C08J2427/00
摘要： The present invention provides a reformed polyimide fluorocarbon resin laminated film having superior adhesive property with metals. The reformed polyimide fluorocarbon resin laminated film according to the present invention is constructed by that a surface of fluorocarbon resin of polyimide fluorocarbon resin laminated film having fluorocarbon resin being laminated on a single surface or both surfaces of a polyimide film is coated with a coupling agent, or executed with corona treatment.

2. 发明专利

DE69636572D1 未知
公开(公告)号：DE69636572D1
公开(公告)日：2006-11-09
申请号：DE69636572
申请日：1996-04-04
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KATAOKA KOSUKE , KURIBAYASHI EIICHIRO , OHNARI YOSHIHIDE
IPC分类号： B32B27/30 , B32B15/08 , B32B27/08 , B32B27/16 , C08J7/04 , C08J7/06 , H01B3/30 , H01B3/44
摘要： The present invention provides a reformed polyimide fluorocarbon resin laminated film having superior adhesive property with metals. The reformed polyimide fluorocarbon resin laminated film according to the present invention is constructed by that a surface of fluorocarbon resin of polyimide fluorocarbon resin laminated film having fluorocarbon resin being laminated on a single surface or both surfaces of a polyimide film is coated with a coupling agent, or executed with corona treatment.

3. 发明专利

DE69635723D1 未知
公开(公告)号：DE69635723D1
公开(公告)日：2006-04-06
申请号：DE69635723
申请日：1996-01-23
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KATAOKA KOSUKE , KURIBAYASHI EIICHIRO , OHNARI YOSHIHIDE
IPC分类号： H05K3/02 , H05K1/03

4. 发明专利

DE69635723T2 未知
公开(公告)号：DE69635723T2
公开(公告)日：2006-09-07
申请号：DE69635723
申请日：1996-01-23
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KATAOKA KOSUKE , KURIBAYASHI EIICHIRO , OHNARI YOSHIHIDE
IPC分类号： H05K3/02 , H05K1/03

5. 发明专利

JP2002096392A METHOD FOR MANUFACTURING LAMINATE 失效
公开(公告)号：JP2002096392A
公开(公告)日：2002-04-02
申请号：JP2000287552
申请日：2000-09-21
申请人： KANEGAFUCHI CHEMICAL IND
发明人： HASE NAOKI , KATAOKA KOSUKE , FURUYA HIROYUKI , FUSHIKI YASUO
IPC分类号： B29C65/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a laminate having a small size change rate suitable for a flexible board material. SOLUTION: A method for manufacturing the laminate comprises the step of laminating a plurality of materials to be laminated each containing a heat fusion bondable material to be laminated and a metal material by a heating and pressurizing molding machine. The method further comprises the steps of disposing a protective material between a pressurizing surface of the machine and the material to be laminated, heating and pressurizing molding the material at 200 deg.C or higher, and releasing the material from the laminate after cooling. In this method, a tension operating at the material to be laminated until the time before the materials are laminated by the machine is set to a necessary minimum limit for stably linearly moving the material, and the tension of the metal material is set to three times as large as that of the material to be laminated.

6. 发明专利

JP2001315256A FLEXIBLE METAL FOIL-CLAD LAMINATE 失效
公开(公告)号：JP2001315256A
公开(公告)日：2001-11-13
申请号：JP2000133945
申请日：2000-05-02
申请人： KANEGAFUCHI CHEMICAL IND
发明人： FURUYA HIROYUKI , KIKUCHI TAKESHI , KATAOKA KOSUKE , TSUJI HIROYUKI
IPC分类号： C08J5/18 , B32B15/08 , B32B15/088 , C08G73/10 , G11B21/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a flexible metal foil-clad laminate suitably used as a hard disc suspension board having excellent flexibility and solder heat resistance or a future novel high density mounting application material such as an FPC, a rigid flexible board material, a COF and LOC package, an MCM or the like. SOLUTION: The flexible metal foil-clad laminate comprises at least one type of metal foil, a thermoplastic polyimide layer and a heat resistant base film. In this case, the polyimide layer is made of a thermoplastic polyimide having a glass transition temperature of 150 to 300 deg.C and a water absorption ratio of 1% or less and/or the base film is made of a non-thermoplastic polyimide film having a water absorption ratio of 2% or less or a thermoplastic polyimide film having a glass transition temperature of 350 deg.C or higher and a water absorption ratio of 2% or less. Thus, the laminate has good flexibility and heat resistance. Particularly, the flexible metal foil-clad laminate for a hard disc suspension is provided.

7. 发明专利

JP2001310344A METHOD FOR MANUFACTURING LAMINATED SHEET 失效
公开(公告)号：JP2001310344A
公开(公告)日：2001-11-06
申请号：JP2000126942
申请日：2000-04-27
申请人： KANEGAFUCHI CHEMICAL IND
发明人： HASE NAOKI , KATAOKA KOSUKE , FUSHIKI YASUO
IPC分类号： B32B15/04 , B29C43/30 , B29C43/46 , B29C43/48 , B32B15/08 , B32B15/088 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a laminated sheet suitable as a flexible substrate material not having bad appearance such as wrinkles or the like generated at the time of thermal lamination. SOLUTION: In a method for manufacturing the laminated sheet by laminating a plurality of materials to be laminated containing a heat-fusible material to be laminated by a pressure and heating molding apparatus, a protective material, of which the tensile elastic modulus at a laminating temperature is 50 kgf/mm2 or more and the coefficient of linear expansion at 200-300 deg.C is 100 ppm/ deg.C or less, is arranged between the pressure surface of the molding apparatus and the materials to be laminated to perform pressure and heating molding at 200 deg.C or higher and, after cooling, the protective material is peeled from the laminated sheet.

8. 发明专利

JP2001191468A HEAT-RESISTANT BONDING SHEET AND COPPER CLAD LAMINATED SHEET USING THE SAME 失效
公开(公告)号：JP2001191468A
公开(公告)日：2001-07-17
申请号：JP2000007527
申请日：2000-01-17
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KIKUCHI TAKESHI , TSUJI HIROYUKI , KATAOKA KOSUKE , FURUYA HIROYUKI
IPC分类号： B32B27/34 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a heat-resistant bonding sheet having sufficient mechanical strength and excellent in solder heat resistance, adhesiveness, dimensional stability and low dielectric characteristics and a copper clad laminated sheet using this bonding sheet. SOLUTION: Polyamic acid being a precursor of thermoplastic polyimide is polymerized while an imidation ratio is adjusted to 10-90% to obtain polyimide which is, in turn, dissolved in an organic solvent and this solvent solution is applied to at least the single surface of a base film comprising a heat-resistant resin to obtain a heat-resistant bonding sheet. In this bonding sheet, the high adhesiveness of the base film and the thermoplastic polyimide interface can be especially realized. This bonding sheet is also excellent in heat resistance and solder heat resistance and can be especially used for a flexible copper clad laminated sheet.

9. 发明专利

JP2001139807A METHOD OF MANUFACTURING HEAT-RESISTANT BONDING SHEET 失效
公开(公告)号：JP2001139807A
公开(公告)日：2001-05-22
申请号：JP32240799
申请日：1999-11-12
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KATAOKA KOSUKE , HASE NAOKI
IPC分类号： C08J7/04 , B32B27/34 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat-resistant bonding sheet which excels in heat resistance to soldering, adhesion, dimensional stability, and low dielectric characteristics while possessing sufficient mechanical strength. SOLUTION: The method of manufacturing a heat-resistant bonding sheet which comprises a step of producing a partially imidated gel film of an amic acid of the precursor of (a) a polyaimide, a step of coating an organic solvent solution of an amic acid of the precursor of (b) a thermoplastic polyimide on the surface of the gel film, a step of subsequently converting the gel film and the coated thermoplastic film to the polyimide (a) and the thermoplastic polyimide (b), respectively, and a step of drying the resulting films in the process of producing a laminate constituted by laminating the thermoplastic polyimde (b) layer on one side or both sides of the polyimide (a) film can realize particularly high adhesion of the interface between the base film and the thermoplastic polyimide. The heat-resistant bonding sheet also excels in heat resistance, heat resistance to soldering and dimension stability. This heat-resistant bonding sheet can be used particularly for flexible copper-clad laminates.

10. 发明专利

JP2001046963A METHOD OF REPAIRING METALLIC SURFACE 失效
公开(公告)号：JP2001046963A
公开(公告)日：2001-02-20
申请号：JP22928399
申请日：1999-08-13
申请人： KANEGAFUCHI CHEMICAL IND
发明人： KATAOKA KOSUKE , MAKI HARUHIKO
IPC分类号： B05D7/14 , B05D3/12 , B05D7/00 , B05D7/24 , C09D5/34 , C09D179/08
摘要： PROBLEM TO BE SOLVED: To obtain the simple and precise repair by padding a defect part of the surface of a metallic layer with a heat resistance resin composition and grinding the padded part and the vicinity to recover flatness of the surface. SOLUTION: A recessed defect part of the metallic layer surface is padded with a non-thermoplastic heat resistant resin such as polyimide, polyamide-imide, polybenzimidazole, polybenzoxazole, poly(phenylene sulfide), polyether ketone, polyether sulfone, polyether imide. In such a case, 4 wt.% isoquinoline of a tertiary amine per varnish weight is added and after being stirred and deaerated, the resin composition is applied on the defect part in the small quantity, brushed to spread thin by means of a brush and heated. The coating film formed in this way is ground with a sand paper to recover the flatness of the surface.

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