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    • 9. 发明授权
    • Land grid array module with contact locating features
    • 具有接触定位特征的Land Grid阵列模块
    • US07692281B2
    • 2010-04-06
    • US11707294
    • 2007-02-16
    • Matthew Richard McAlonisJustin Shane McClellanJames Lee Fedder
    • Matthew Richard McAlonisJustin Shane McClellanJames Lee Fedder
    • H01L23/48H01R13/24
    • H01R13/2442
    • A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.
    • 提供了一种包括陆地网格阵列接口的地面阵列阵列模块。 界面包括具有配合面的基板。 接触垫设置在基板的配合面上。 接触垫具有带有凹陷的暴露表面,该凹陷被构造成当匹配接触尖端被装载到接触垫上时,限制配合接触尖端的横向移动。 衬底层可以包括具有直径的通孔,使得当接触垫电镀在通孔上时,凹陷形成在接触焊盘中。 凹陷也可以冲压在接触垫的暴露表面中。 或者,凹陷可以被构造成保持配合接触尖端的凸起的导电周边包围。
    • 10. 发明申请
    • Land grid array module with contact locating features
    • 具有接触定位特征的Land Grid阵列模块
    • US20080200042A1
    • 2008-08-21
    • US11707294
    • 2007-02-16
    • Matthew Richard McAlonisJustin Shane McClellanJames Lee Fedder
    • Matthew Richard McAlonisJustin Shane McClellanJames Lee Fedder
    • H01R13/24
    • H01R13/2442
    • A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.
    • 提供了一种包括陆地网格阵列接口的地面阵列阵列模块。 界面包括具有配合面的基板。 接触垫设置在基板的配合面上。 接触垫具有带有凹陷的暴露表面,该凹陷被构造成当匹配接触尖端被装载到接触垫上时,限制配合接触尖端的横向移动。 衬底层可以包括具有直径的通孔,使得当接触垫电镀在通孔上时,凹陷形成在接触焊盘中。 凹陷也可以冲压在接触垫的暴露表面中。 或者,凹陷可以被构造成保持配合接触尖端的凸起的导电周边包围。