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    • 3. 发明授权
    • Process for the manufacture of a contact mat
    • 制造接触垫的方法
    • US4442055A
    • 1984-04-10
    • US425520
    • 1982-09-28
    • Jurgen OelschRichard VolkKarl-Heinz Claassen
    • Jurgen OelschRichard VolkKarl-Heinz Claassen
    • B29B15/00B29C35/00B29C43/00B29C45/00B29C45/14B29C45/16B29C70/74B29C70/88H01H13/702H01H13/785B29H3/08
    • H01H13/785B29C45/1615B29C70/74B29C70/882H01H13/702B29C2045/7343B29C45/062B29K2283/00B29K2995/0005B29L2031/46B29L2031/466H01H2201/032H01H2209/002H01H2213/01H01H2215/008H01H2229/046H01H2229/058
    • A process for the manufacture of a contact mat suitable for a keyboard or ypad is described. This contact mat is produced by the injection-moulding process and consists of a sheet-like composite body made of an electrically non-conductive two-component silicone rubber, and at least one carrier part, which is elastically deformable when pressure is applied to a key and is moulded out in the shape of a calotte. On the inside of the carrier part and in the pole region, there is a contact component which is made of an electrically highly conductive material. When the carrier part is depressed, an electrical connection is made via the contact component between the contact surfaces of a printed circuit located below the contact mat. In order to be able to manufacture the contact component in a simple manner and without waste, the contact component is made in an injection mould, wherein the entire lower mould part is at a temperature above the vulcanization temperature of the contact component. The upper cavity plate of the corresponding upper mould part consists of two halves of which one half is at a temperature below the vulcanization temperature. The contact component is produced by means of this half. Subsequently, a lower cavity plate of the lower mould part is rotated from this first into a second position, and the composite body and the carrier body are then moulded. This half of the upper cavity plate is at a temperature above the vulcanization temperature. Accordingly, all the curable components are vulcanized separately, even though they are moulded in the same mould.
    • 描述了适用于键盘或小键盘的接触垫的制造工艺。 该接触垫通过注射成型工艺制造,并且由不导电的双组分硅橡胶制成的片状复合体和至少一个载体部分,当载体压力施加到 钥匙,并被模制成一个calotte的形状。 在载体部分的内侧和极区域中,存在由导电性高的材料制成的接触部件。 当载体部分被压下时,通过位于接触垫下方的印刷电路的接触表面之间的接触部件进行电连接。 为了能够以简单的方式制造接触部件并且没有浪费,接触部件在注射模具中制成,其中整个下模具部件处于高于接触部件的硫化温度的温度。 相应的上模具部分的上腔板由两半半部分组成,其中一半的温度低于硫化温度。 通过这一半产生接触部件。 随后,下模具部件的下腔板从该第一位置旋转到第二位置,然后模制复合体和载体主体。 上腔板的这一半处于高于硫化温度的温度。 因此,即使将它们模塑在同一模具中,所有可固化组分也分别硫化。