专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100309635A1 STRUCTURE FOR MOUNTING SEMICONDUCTOR PACKAGE 有权
标题翻译：用于安装半导体封装的结构
公开(公告)号：US20100309635A1
公开(公告)日：2010-12-09
申请号：US12525957
申请日：2007-11-30
申请人： Junichi Sasaki , Tomoyuki Hino
发明人： Junichi Sasaki , Tomoyuki Hino
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/4093 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32188 , H01L2924/00014 , H01L2924/01004 , H05K2201/09054 , H05K2201/10393 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.
摘要翻译：其中将用于散发由半导体封装1产生的热量的半导体封装1和散热器8安装在安装板3上的安装结构。半导体封装1的后表面接合到安装板3的面向后表面的前表面。散热器8通过形成在安装板3上的通孔5与半导体封装1的后表面接触。半导体封装1和散热器8通过夹子6的弹力彼此挤压。

2. 发明申请

US20090052909A1 OPTICAL COMMUNICATION MODULE AND OPTICAL SIGNAL TRANSMISSION METHOD 审中-公开
标题翻译：光通信模块和光信号传输方法
公开(公告)号：US20090052909A1
公开(公告)日：2009-02-26
申请号：US11814462
申请日：2006-01-21
申请人： Tomoyuki Hino , Kazuhiko Kurata , Yutaka Urino , Ichirou Ogura , Junichi Sasaki , Youichi Hashimoto
发明人： Tomoyuki Hino , Kazuhiko Kurata , Yutaka Urino , Ichirou Ogura , Junichi Sasaki , Youichi Hashimoto
IPC分类号： G02B6/28 , H04B10/12
CPC分类号： G02B6/3897 , G02B6/43
摘要： One or more one-dimensional array-shaped photoelectric conversion modules 302 are mounted on a board 301. A one-dimensional array-shaped light receiving/emitting element 303 is mounted in each of the one-dimensional array-shaped photoelectric conversion modules 302. Further, the one-dimensional array-shaped photoelectric conversion modules 302 are mechanically and optically connected to a flexible fiber sheet 306 through an optical connector 305. As parallel transmission paths 306 from the one-dimensional array-shaped photoelectric conversion modules 302 approach an end of a board 301, they are laminated with each other and connected to a two-dimensional array-shaped optical connector 307 at an end of the board. Further, a wavelength multiplexer/demultiplexer is connected to the optical connector.
摘要翻译：一个或多个一维阵列状光电转换模块302安装在板301上。一维阵列状光接收/发射元件303安装在一维阵列状光电转换模块302的每一个中。此外，一维阵列状光电转换模块302通过光连接器305机械地和光学地连接到柔性纤维片材306上。由于一维阵列状光电转换模块302的平行传输路径306接近尾端板301彼此层叠并连接到板的一端的二维阵列状光连接器307。此外，波长多路复用器/解复用器连接到光学连接器。

3. 发明授权

US07983048B2 Structure for mounting semiconductor package 有权
标题翻译：用于安装半导体封装的结构
公开(公告)号：US07983048B2
公开(公告)日：2011-07-19
申请号：US12525957
申请日：2007-11-30
申请人： Junichi Sasaki , Tomoyuki Hino
发明人： Junichi Sasaki , Tomoyuki Hino
IPC分类号： H05K7/20
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/4093 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32188 , H01L2924/00014 , H01L2924/01004 , H05K2201/09054 , H05K2201/10393 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.
摘要翻译：其中将用于散发由半导体封装1产生的热量的半导体封装1和散热器8安装在安装板3上的安装结构。半导体封装1的后表面接合到安装板3的面向后表面的前表面。散热器8通过形成在安装板3上的通孔5与半导体封装1的后表面接触。半导体封装1和散热器8通过夹子6的弹力彼此挤压。

4. 发明授权

US07620272B2 Photoelectric composite module and optical input/output device 有权
标题翻译：光电复合模块和光输入/输出装置
公开(公告)号：US07620272B2
公开(公告)日：2009-11-17
申请号：US11785946
申请日：2007-04-23
申请人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
发明人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
IPC分类号： G02B6/12 , G02B6/00
CPC分类号： G02B6/3897
摘要： A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.
摘要翻译：光电复合模块具有沿着封装的两个壳体部分设置的光学器件，封装和柔性印刷电路，并且在其上形成用于光学器件的电线。包装具有第一壳体部分和第二壳体部分，其通过铰链与第一壳体部分连接并且被设置在安装的板上。光学装置与面对所述柔性印刷电路中的第一壳体部分的表面接合。柔性印刷电路具有光提取装置，用于传输应该在光学装置和光波导之间交换的光信号。该封装具有短路装置，用于在柔性印刷电路的电线与安装板的电线之间短路。

5. 发明申请

US20070280594A1 Photoelectric composite module and optical input/output device 有权
标题翻译：光电复合模块和光输入/输出装置
公开(公告)号：US20070280594A1
公开(公告)日：2007-12-06
申请号：US11785946
申请日：2007-04-23
申请人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
发明人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
IPC分类号： G02B6/42
CPC分类号： G02B6/3897
摘要： A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.
摘要翻译：光电复合模块具有沿着封装的两个壳体部分设置的光学器件，封装和柔性印刷电路，并且在其上形成用于光学器件的电线。包装具有第一壳体部分和第二壳体部分，其通过铰链与第一壳体部分连接并且被设置在安装的板上。光学装置与面对所述柔性印刷电路中的第一壳体部分的表面接合。柔性印刷电路具有光提取装置，用于传输应该在光学装置和光波导之间交换的光信号。该封装具有短路装置，用于在柔性印刷电路的电线与安装板的电线之间短路。

6. 发明授权

US08322933B2 Optical connection structure between optical backplane and circuit substrate 有权
标题翻译：光背板与电路基板之间的光连接结构
公开(公告)号：US08322933B2
公开(公告)日：2012-12-04
申请号：US12534622
申请日：2009-08-03
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/36 , G02B6/38
CPC分类号： G02B6/3885 , G02B6/3897 , G02B6/43
摘要： Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.
摘要翻译：信息处理设备包括设置在电路基板上的光电转换模块，通过多个第一光纤连接到光电转换模块并且设置在电路基板的边缘部分的第一光学连接器，以及设置在电路基板上的第二光学连接器光学背板并且光学连接到第一光学连接器。光电转换模块中的光纤的布置方向与电路基板的主表面不平行，第一光连接器中的光纤的布置方向和第二光连接器中的光纤的布置方向为与电路基板的主表面不平行。

7. 发明授权

US08267597B2 Mounting of optical device on mounting board to at least provide heat radiation 有权
标题翻译：将光学装置安装在安装板上至少提供热辐射
公开(公告)号：US08267597B2
公开(公告)日：2012-09-18
申请号：US12545204
申请日：2009-08-21
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/00 , G02B6/36
CPC分类号： G02B6/4214 , G02B6/325 , G02B6/4228 , H05K1/141 , H05K1/182
摘要： An optical module includes: an optical device mounting board including a first surface, a second surface on the reverse side, and a light transparent part allowing an emitted light traveling from the first surface to the second surface and a received light traveling in the opposite direction to pass through the transparent part; an optical device mounted on the first surface, which is a light emitting device or a light receiving device; a first terminal mounted on a surface except the first surface of the optical device mounting board; a wiring connecting a second terminal of a component mounted on the first surface including the optical device with the first terminal; and a transmission medium connector connecting a light transmission medium transmitting the emitted light traveling from the second surface to an outside of the optical module or the received light traveling in the opposite direction.
摘要翻译：光学模块包括：光学装置安装板，包括第一表面，反面上的第二表面和允许从第一表面到第二表面传播的发射光的透光部分和沿相反方向行进的接收光透过透明部分; 安装在第一表面上的光学器件，其是发光器件或光接收器件; 第一端子，其安装在除了所述光学装置安装板的第一表面之外的表面上; 连接安装在包括光学装置的第一表面的部件的第二端子与第一端子的布线; 以及传输介质连接器，其连接将从第二表面传播的发射光传输到光学模块的外部的光传输介质或沿相反方向传播的接收光。

8. 发明授权

US07732340B2 Method for adjusting a critical dimension in a high aspect ratio feature 失效
标题翻译：用于调整高宽高比特征中临界尺寸的方法
公开(公告)号：US07732340B2
公开(公告)日：2010-06-08
申请号：US11463133
申请日：2006-08-08
申请人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
发明人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
IPC分类号： H01I21/302
CPC分类号： H01L21/31116 , H01L21/31122 , H01L21/31144
摘要： A method for adjusting the lateral critical dimension (i.e., length and width) of a feature formed in a layer on a substrate using a dry etching process. One or more thin intermediate sub-layers are inserted in the layer within which the feature is to be formed. Once an intermediate sub-layer is reached during the etching process, an etch process is performed to correct and/or adjust the lateral critical dimensions before etching through the intermediate sub-layer and continuing the layer etch.
摘要翻译：一种用于使用干蚀刻工艺调节在衬底上形成的特征的横向临界尺寸（即，长度和宽度）的方法。将一个或多个薄的中间子层插入其中要形成特征的层中。一旦在蚀刻过程中达到中间子层，则在蚀刻通过中间子层并继续层蚀刻之前，执行蚀刻工艺以校正和/或调整横向临界尺寸。

9. 发明授权

US07561762B2 Semiconductor device having optical signal input-output mechanism 有权
标题翻译：具有光信号输入输出机构的半导体装置
公开(公告)号：US07561762B2
公开(公告)日：2009-07-14
申请号：US11575482
申请日：2005-09-20
申请人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
发明人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/42 , G02B6/4214 , G02B6/4232 , H05K1/141 , H05K1/147 , H05K1/189
摘要： A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).
摘要翻译：半导体装置具有印刷电路板（11），其中形成连接到LSI芯片（17）和平面光学元件（21）的电线（18），并且其中传输输入到平面光学元件的光的光波导（25） 21）和/或从平面光学元件（21）输出的光是固定的。平面光学元件（21）安装在小基板（13）的一端，小基板（13）的另一端通过焊料凸块（26）与印刷电路板（11）连接。安装平面光学元件（21）的小基板（13）的一端通过固定机构固定到印刷电路板（11）。小基板（13）具有柔性部分（15），其与印刷电路板（11）和小基板（13）的其它部分相比容易变形，在平面光学元件（21）的一端之间的至少一部分区域中，并且另一端电连接到印刷线路板（11）。

10. 发明授权

US07473038B2 Optical connector for coupling an optical fiber to a circuit board 有权
标题翻译：用于将光纤耦合到电路板的光学连接器
公开(公告)号：US07473038B2
公开(公告)日：2009-01-06
申请号：US11437646
申请日：2006-05-22
申请人： Kunihiko Fujiwara , Akito Nishimura , Kenji Sasaki , Yukio Hayashi , Ichiro Hatakeyama , Youichi Hashimoto , Junichi Sasaki , Ryosuke Kuribayashi , Kazunori Miyoshi , Kazuhiko Kurata
发明人： Kunihiko Fujiwara , Akito Nishimura , Kenji Sasaki , Yukio Hayashi , Ichiro Hatakeyama , Youichi Hashimoto , Junichi Sasaki , Ryosuke Kuribayashi , Kazunori Miyoshi , Kazuhiko Kurata
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/3897 , G02B6/4214 , G02B6/4249
摘要： An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.
摘要翻译：根据本发明的光连接器，包括安装在安装在电路板上的光学模块上的连接器主体和用于将连接器主体压靠在光学模块上的连接器固定构件。连接器固定构件可以与电路板接合/脱开，从而可以将连接器主体与光学模块连接/分离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式