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1. 发明授权

US06404640B1 Liquid-cooled electronic apparatus 失效
公开(公告)号：US06404640B1
公开(公告)日：2002-06-11
申请号：US09235498
申请日：1999-01-22
申请人： Junichi Ishimine , Masahiro Suzuki , Masahiro Miyo , Akihiko Fujisaki , Keizo Takemura , Jie Wie , Hisashi Kawashima , Yoshiaki Udagawa , Haruhiko Yamamoto , Masahiro Mochizuki
发明人： Junichi Ishimine , Masahiro Suzuki , Masahiro Miyo , Akihiko Fujisaki , Keizo Takemura , Jie Wie , Hisashi Kawashima , Yoshiaki Udagawa , Haruhiko Yamamoto , Masahiro Mochizuki
IPC分类号： H05K720
CPC分类号： H05K7/20781 , G06F1/181 , G06F1/20 , G06F1/206 , H01L23/473 , H01L2224/48091 , H01L2924/00014
摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

2. 发明授权

US06621707B2 Liquid-cooled electronic apparatus 失效
公开(公告)号：US06621707B2
公开(公告)日：2003-09-16
申请号：US09968041
申请日：2001-10-02
申请人： Junichi Ishimine , Masahiro Suzuki , Masahiro Miyo , Akihiko Fujisaki , Keizo Takemura , Jie Wei , Hisashi Kawashima , Yoshiaki Udagawa , Haruhiko Yamamoto , Masahiro Mochizuki
发明人： Junichi Ishimine , Masahiro Suzuki , Masahiro Miyo , Akihiko Fujisaki , Keizo Takemura , Jie Wei , Hisashi Kawashima , Yoshiaki Udagawa , Haruhiko Yamamoto , Masahiro Mochizuki
IPC分类号： H05K720
CPC分类号： H05K7/20781 , G06F1/181 , G06F1/20 , G06F1/206 , H01L23/473 , H01L2224/48091 , H01L2924/00014
摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

3. 发明授权

US07007506B2 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator 失效
标题翻译：利用蒸发器中制冷剂不完全蒸发的制冷系统
公开(公告)号：US07007506B2
公开(公告)日：2006-03-07
申请号：US10837651
申请日：2004-05-04
申请人： Hideo Kubo , Hisashi Kawashima , Jie Wei , Junichi Ishimine , Masahiro Suzuki , Yoshiaki Udagawa , Masahiro Mochizuki
发明人： Hideo Kubo , Hisashi Kawashima , Jie Wei , Junichi Ishimine , Masahiro Suzuki , Yoshiaki Udagawa , Masahiro Mochizuki
IPC分类号： F25B39/02
CPC分类号： F28D15/0266 , F25B39/02 , F25B2600/21 , F25D19/006 , F28F3/12 , F28F13/06 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20309 , H01L2924/00
摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.
摘要翻译：制冷系统允许制冷剂循环通过封闭的循环通道。干燥蒸发器结合在循环通道中。干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。每单位面积的传热量，即传热系数取决于质量。当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。在干燥蒸发器中的冷凝器蒸发期间，制冷剂的质量保持在预定阈值水平以下，可以可靠地建立更高的冷却性能。另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

4. 发明授权

US06748755B2 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator 失效
标题翻译：利用蒸发器中制冷剂不完全蒸发的制冷系统
公开(公告)号：US06748755B2
公开(公告)日：2004-06-15
申请号：US09749622
申请日：2000-12-28
申请人： Hideo Kubo , Hisashi Kawashima , Jie Wei , Junichi Ishimine , Masahiro Suzuki , Yoshiaki Udagawa , Masahiro Mochizuki
发明人： Hideo Kubo , Hisashi Kawashima , Jie Wei , Junichi Ishimine , Masahiro Suzuki , Yoshiaki Udagawa , Masahiro Mochizuki
IPC分类号： F25B4104
CPC分类号： F28D15/0266 , F25B39/02 , F25B2600/21 , F25D19/006 , F28F3/12 , F28F13/06 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20309 , H01L2924/00
摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.
摘要翻译：制冷系统允许制冷剂循环通过封闭的循环通道。干燥蒸发器结合在循环通道中。干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。每单位面积的传热量，即传热系数取决于质量。当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。在干燥蒸发器中的制冷剂蒸发期间，制冷剂的质量保持在预定阈值以下，可以可靠地建立更高的冷却性能。另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

5. 发明授权

US4920574A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4920574A
公开(公告)日：1990-04-24
申请号：US79876
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , H01L23/4332 , H01L2924/0002
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
摘要翻译：一种冷却系统，包括冷却模块，该冷却模块具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏压，以将由部件散发的热量传递给冷却剂。在传热板上提供一系列突起，用于在冷却剂流中产生湍流。或者，圆柱形管板安装在传热板上，用于增加与冷却剂流接触的表面积。

6. 发明授权

US4879632A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4879632A
公开(公告)日：1989-11-07
申请号：US914942
申请日：1986-10-03
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属用于在转印板和电路部件之间建立热接触。

7. 发明授权

US4783721A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4783721A
公开(公告)日：1988-11-08
申请号：US79877
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：一种冷却系统，包括：冷却模块，其具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏置，用于将由所述部件散发的热传递到所述冷却剂;以及用于引导和防止转印板的不正确对准，因为它们朝向电路部件弹性偏压。冷却剂模块可以包括用于在转印板和电路部件之间建立热接触的焊料或低熔点金属。

8. 发明授权

US5195020A Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer 失效
标题翻译：与其中包括导热化合物层的冷却回路部件的电子电路装置一起使用的冷却系统及其形成方法
公开(公告)号：US5195020A
公开(公告)日：1993-03-16
申请号：US785198
申请日：1991-11-01
申请人： Masahiro Suzuki , Haruhiko Yamamoto , Yoshiaki Udagawa
发明人： Masahiro Suzuki , Haruhiko Yamamoto , Yoshiaki Udagawa
IPC分类号： H01L23/433
CPC分类号： H01L23/4332 , H01L2924/0002
摘要： A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically. As the result, the thermal contact resistance between the heat transfer plate and the circuit component is favorably reduced and stabilized.
摘要翻译：与印刷电路板一起使用的冷却系统在其上至少具有固体电路部件。冷却系统包括连接到冷却集管的冷却集管和冷却模块。每个冷却模块接合到每个部件。冷却模块具有连接到另一端连接到冷却集管的波纹管的一端的传热板。在传热板和相应的电路部件之间插入一层导热性化合物，例如导热油脂层。首先以高于临界压力的压力压制导热层，然后将压力降低到通过波纹管的弹力和冷却剂的液压力施加在电路部件上的工作压力。临界压力是实验性地或实际地预定的。结果，传热板和电路部件之间的热接触电阻有利地降低并稳定。

9. 发明授权

US5126919A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US5126919A
公开(公告)日：1992-06-30
申请号：US261904
申请日：1988-10-25
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G11B11/10586 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属用于在转印板和电路部件之间建立热接触。

10. 发明授权

US06454362B1 Method of controlling cooling device in portable electronic and cooling device therefor 失效
标题翻译：控制便携式电子冷却装置中的冷却装置的方法
公开(公告)号：US06454362B1
公开(公告)日：2002-09-24
申请号：US09475773
申请日：1999-12-30
申请人： Tadashi Katsui , Keizo Takemura , Minoru Hirano , Masumi Suzuki , Yoshiaki Udagawa , Masuo Ohnishi , Kenichi Fujii
发明人： Tadashi Katsui , Keizo Takemura , Minoru Hirano , Masumi Suzuki , Yoshiaki Udagawa , Masuo Ohnishi , Kenichi Fujii
IPC分类号： H01H3514
CPC分类号： G06F1/203 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.
摘要翻译：用于便携式电子的冷却装置包括辐射板和用于从CPU辐射热量的翅片。当外插电源时。电源连接到便携式电子的主体，CPU可以以高时钟频率工作。例如，冷却装置通过操作指向翅片的通风扇来实现高冷却性能。当插头从便携式电子的主体移除时，CPU可以以低时钟频率工作。可以降低功耗，从而可以节省存储在内置电池中的电力。可以延长操作的持续时间。也可以减少在CPU产生的热量，从而冷却装置适于在不使用通风扇的情况下抑制CPU的温度上升。

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