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    • 1. 发明授权
    • Bonding structures for optical members
    • 光学元件的结合结构
    • US06640032B2
    • 2003-10-28
    • US09961786
    • 2001-09-24
    • Jungo KondoTetsuya EjiriTakashi Yoshino
    • Jungo KondoTetsuya EjiriTakashi Yoshino
    • G02B626
    • G02B6/4239G02B6/30G02B6/423G02B6/4234H01L2224/26175H01L2224/45144H01L2924/00
    • An optical member-bonding structure includes a first optical component, a second optical component, and an integral substrate having a mounting face on which the first and second optical components are mounted, at least the first optical member being bonded to the integral substrate, wherein a bonding face of the first optical member is bonded to the mounting face of the integral substrate with a cured and shrunk optical adhesive in such a state that an optical axis of the first optical member is aligned with that of the second optical member at a precision of not more than 1 &mgr;m, a groove is formed in a such bonding region of that mounting face of the integral substrate as being bonded with the first optical member, and at least part of the optical adhesive is filled into the groove.
    • 光学构件接合结构包括第一光学部件,第二光学部件和具有安装有第一和第二光学部件的安装面的一体基板,至少第一光学部件被接合到一体基板,其中, 在第一光学构件的光轴以与第二光学构件的光轴精度对准的状态下,第一光学构件的接合面用固化和收缩的光学粘合剂粘合到整体衬底的安装面 在不超过1um的情况下,在与第一光学构件接合的一体基板的该安装面的接合区域中形成凹槽,并且至少一部分光学粘合剂被填充到凹槽中。
    • 3. 发明授权
    • Optical modulators
    • 光调制器
    • US07974501B2
    • 2011-07-05
    • US12407904
    • 2009-03-20
    • Akira HamajimaJungo KondoOsamu MitomiTetsuya EjiriKenji Aoki
    • Akira HamajimaJungo KondoOsamu MitomiTetsuya EjiriKenji Aoki
    • G02B26/00G02F1/035
    • G02F1/035G02B6/4202
    • An optical modulator 24 has a supporting substrate 5, a modulating substrate 11 made of an electro-optical material, an optical waveguide 12 provided on the side of a first main surface 30 of the modulating substrate 11, and an adhesion layer 6 adhering a second main surface 31 of the modulating substrate 11 onto the supporting substrate 5. The modulating substrate 11 has a high-frequency interaction portion 11c applying a voltage on the optical waveguide 12 to modulate propagating light, an incident portion 11a inputting light to the optical waveguide, and an outgoing portion 11b outputting light from the optical waveguide. The high-frequency interaction portion 11c is recessed on the first main surface 30 of the modulating substrate 11 with respect to the incident and outgoing portions 11a and 11b. The high-frequency interaction portion 11c has a thickness smaller than the those of the incident and outgoing portions 11a and 11b.
    • 光调制器24具有支撑基板5,由电光材料制成的调制基板11,设置在调制基板11的第一主面30一侧的光波导12,以及粘接层 调制基板11的主表面31到支撑基板5上。调制基板11具有在光波导12上施加电压以调制传播光的高频相互作用部分11c,向光波导输入光的入射部分11a, 以及从光波导输出光的出射部分11b。 高频相互作用部分11c相对于入射和出射部分11a和11b凹入调制基板11的第一主表面30上。 高频相互作用部分11c的厚度小于入射部分11a和出射部分11b的厚度。
    • 4. 发明授权
    • Optical modulators
    • 光调制器
    • US07778497B2
    • 2010-08-17
    • US12401753
    • 2009-03-11
    • Osamu MitomiKenji AokiTetsuya EjiriAkiyoshi IdeJungo KondoYuichi Iwata
    • Osamu MitomiKenji AokiTetsuya EjiriAkiyoshi IdeJungo KondoYuichi Iwata
    • G02F1/035G02B6/26
    • G02F1/0356G02B6/12007
    • An optical modulator having an optical modulation part and a connection part for an optical fiber propagating light. The optical modulation part has a modulation substrate of an electro-optic material, a modulation optical waveguide formed on the modulation substrate, a high frequency interaction part for applying a voltage to the modulation optical waveguide to modulate the propagation of light, a first supporting substrate and a first adhesion layer for adhering the modulation substrate to the first supporting substrate. The connection part has a connection substrate of an electro-optic material, a connection optical waveguide formed on the connection substrate, a second supporting substrate, and a second adhesion layer for adhering the connection substrate to the second supporting substrate. The modulation substrate is adhered to the connection substrate. The first supporting substrate is adhered to the second supporting substrate. The modulation optical waveguide is connected to the connection optical waveguide.
    • 一种具有光学调制部分和用于光纤传播光的连接部分的光调制器。 光调制部具有电光材料的调制基板,形成在调制基板上的调制光波导,向调制光波导施加电压以调制光的传播的高频相互作用部,第一支撑基板 以及用于将调制基板粘附到第一支撑基板的第一粘合层。 连接部具有电光材料的连接基板,形成在连接基板上的连接光波导,第二支撑基板和用于将连接基板粘接到第二支撑基板的第二粘合层。 调制基板粘附到连接基板。 第一支撑基板粘附到第二支撑基板。 调制光波导连接到连接光波导。
    • 10. 发明授权
    • Optical Modulator
    • 光调制器
    • US07689066B2
    • 2010-03-30
    • US11841188
    • 2007-08-20
    • Jungo KondoOsamu MitomiKenji AokiYuichi IwataTetsuya Ejiri
    • Jungo KondoOsamu MitomiKenji AokiYuichi IwataTetsuya Ejiri
    • G02F1/035G02B6/26
    • G02F1/2255G02F1/0123G02F2001/212G02F2201/58G02F2203/20
    • An optical modulator is provided for modulating light propagating in a three-dimensional optical waveguide 5 by applying a voltage thereto. The optical modulator has the three-dimensional optical waveguide 5 including at least one pair of branch optical waveguides 5c and 5d, a multiplexing part 5e of the branch optical waveguides and an emission part 5f provided in the downstream of the multiplexing part, modulation electrodes 3A, 3B and 4 for applying a signal voltage for modulating light propagating in the three-dimensional optical waveguide 5, and guiding waveguides 6A and 6B for guiding primary mode light from the multiplexing part. Thickness of the substrate is 20 μm or less at least under the modulation electrodes, and an operation point of the optical modulator is controlled by changing, based on light output from the guiding waveguides, DC bias applied onto the modulation electrodes.
    • 提供了一种光调制器,用于通过向其施加电压来调制在三维光波导5中传播的光。 光调制器具有包括至少一对分支光波导5c和5d的三维光波导5,分支光波导的复用部分5e和设置在复用部分下游的发射部分5f,调制电极3A ,3B和4,用于施加用于调制在三维光波导5中传播的光的信号电压,以及引导波导6A和6B以引导来自复用部分的初级模式光。 至少在调制电极下方,基板的厚度为20μm以下,通过基于来自引导波导的光的输出,施加到调制电极上的DC偏置来改变光调制器的操作点。