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    • 4. 发明授权
    • Method of manufacturing ferroelectric memory
    • 铁电存储器的制造方法
    • US6080593A
    • 2000-06-27
    • US123424
    • 1998-07-28
    • Dae-sig KimIl-sub Chung
    • Dae-sig KimIl-sub Chung
    • H01L21/8247H01B3/12H01L21/28H01L21/8246H01L27/10H01L27/105H01L29/78H01L29/788H01L29/792H01L29/92H01L21/00
    • H01L21/28291H01L29/78391
    • A method of manufacturing a ferroelectric memory of MFS- or MFIS-type includes the steps of forming on a substrate an insulating layer for preventing reaction at an interface between a ferroelectric material and a silicon substrate, forming a ferroelectric layer on the insulating layer, reacting a material of the insulating layer with a material of the ferroelectric layer, to transform the insulating layer into part of the ferroelectric layer, and forming an electrode on the ferroelectric layer. Since the insulating layer is formed between a substrate and a ferroelectric material, undesirable reaction between the two substances is prevented. The insulating layer is completely absorbed into the ferroelectric layer due to diffusion during deposition of the ferroelectric layer, to form an MFS-type ferroelectric memory. When some of the insulating layer remains, the ferroelectric memory becomes an MFIS-type. However, since the remaining insulating layer, which corresponds to the insulating layer of the MFIS-type ferroelectric memory, is very thin. Accordingly, characteristics of the MFIS-type ferroelectric memory improve.
    • 制造MFS-或MFIS型铁电存储器的方法包括以下步骤:在基板上形成用于防止在铁电材料和硅基板之间的界面处的反应的绝缘层,在绝缘层上形成铁电层,使绝缘层反应 使用具有铁电层的材料的绝缘层的材料,将绝缘层变换为铁电层的一部分,并在铁电层上形成电极。 由于绝缘层形成在基板和铁电体材料之间,因此防止了两种物质之间的不期望的反应。 由于铁电层的沉积期间的扩散,绝缘层被完全吸收到铁电体层中,形成MFS型铁电体存储器。 当一部分绝缘层残留时,铁电存储器成为MFIS型。 然而,由于与MFIS型铁电体存储器的绝缘层相对应的剩余绝缘层非常薄。 因此,MFIS型铁电体存储器的特性提高。
    • 5. 发明授权
    • Bubbler
    • 起泡器
    • US06424800B1
    • 2002-07-23
    • US09665114
    • 2000-09-20
    • Dae-sig Kim
    • Dae-sig Kim
    • C23C1400
    • C23C16/4481
    • A bubbler for use in vaporizing a precursor (source) for thin film deposition includes a vaporizer chamber, the vaporizer chamber having defined therein a source inlet hole, an exhaust hole and a carrier gas inlet hole; a source supply unit connected to the source inlet hole; a plate installed in the vaporizer chamber, the plate being adapted to receive a source entering into the vaporizer chamber; and a heater source installed in the vaporizer chamber, the heater source being adapted to evenly heat the plate.
    • 用于汽化用于薄膜沉积的前体(源)的起泡器包括蒸发器室,其中限定有源入口孔,排气孔和载气入口孔的蒸发器室; 连接到源入口孔的源供应单元; 安装在所述蒸发器室中的板,所述板适于接收进入所述蒸发器室的源; 以及安装在所述蒸发器室中的加热器源,所述加热器源适于均匀地加热所述板。
    • 7. 发明授权
    • Bubbler for solid metal-organic percursors
    • 膨胀器用于固体金属有机物
    • US5603169A
    • 1997-02-18
    • US536819
    • 1995-09-29
    • Dae-sig Kim
    • Dae-sig Kim
    • C23C16/18C23C16/448H01L21/205H01L21/285F26B17/00
    • C23C16/4481
    • A bubbler for solid metal-organic precursors is described. The bubbler includes a bubbler body, a carrier gas feed tube, an exhaust tube, a compressing plate and a pair of porous thin plates. A carrier gas is fed into a mass of metal-organic precursors through a feed tube which is connected with the bottom of the bubbler body. The exhaust tube is set away from the mass of metal-organic precursors and drains the carrier gas passing through the precursors. The compressing plate has many holes and is movable up and down along the wall of the bubbler body so that it may be positioned according to the amount of the precursors. The upper porous thin plate is located between the exhaust tube and the compressing plate, and the lower porous thin plate is located above the leading end of the feed tube, giving support to the mass of the metal-organic precursors. That is, the precursors are placed on the lower porous thin plate and there is a room between the lower porous thin plate and the bottom of the bubbler body.
    • 描述了用于固体金属 - 有机前体的起泡器。 起泡器包括起泡器体,载气供给管,排气管,压缩板和一对多孔薄板。 通过与起泡器主体的底部连接的进料管将载气输送到大量金属 - 有机前体中。 排气管远离金属 - 有机前体的物质,并排出通过前体的载气。 压缩板具有许多孔,并且可以沿着起泡器主体的壁上下移动,使得其可以根据前体的量来定位。 上多孔薄板位于排气管和压缩板之间,下多孔薄板位于进料管的前端上方,为金属有机前体的质量提供支撑。 也就是说,前体被放置在下多孔薄板上,并且在下多孔薄板和起泡器主体的底部之间存在一个房间。