会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • PACKAGE MODULE STRUCTURE FOR HIGH POWER DEVICE WITH METAL SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • 具有金属基底的高功率器件的封装模块结构及其制造方法
    • US20130020726A1
    • 2013-01-24
    • US13520284
    • 2010-02-16
    • Kyoung-Min KimJung-Hyun Kim
    • Kyoung-Min KimJung-Hyun Kim
    • H01L29/02H01L21/56
    • H01L23/367H01L23/4006H01L23/562H01L2224/32245
    • A method of manufacturing a package module structure of a high power device using a metal substrate that can improve reliability by minimizing stress due to a thermal expansion coefficient difference between a metal substrate and a semiconductor device includes: preparing a metal substrate; forming an oxide layer by selectively anodizing the metal substrate; forming a mounting groove for mounting a semiconductor device by etching a portion of the oxide layer; installing a shock-absorbing substrate that is made of a material having a thermal expansion coefficient in a range similar to a material of a semiconductor device to expose the entirety or a portion of a bottom portion of the mounting groove; mounting the semiconductor device in the shock-absorbing substrate exposed to the mounting groove; and electrically connecting an electrode terminal of the semiconductor device and an electrode line formed in an upper surface of the oxide layer.
    • 一种使用能够通过使由于金属基板与半导体器件之间的热膨胀系数差导致的应力最小化而提高可靠性的金属基板的高功率器件的封装模块结构的制造方法,其特征在于,包括:准备金属基板; 通过选择性地阳极氧化金属基底来形成氧化物层; 通过蚀刻所述氧化物层的一部分形成用于安装半导体器件的安装槽; 安装由具有与半导体器件的材料类似的范围内的热膨胀系数的材料制成的吸震衬底,以露出安装槽的整个或一部分底部; 将半导体器件安装在暴露于安装槽的减震基板中; 并且电连接半导体器件的电极端子和形成在氧化物层的上表面中的电极线。
    • 10. 发明授权
    • Voltage glitch detection circuits and methods thereof
    • 电压毛刺检测电路及其方法
    • US07483328B2
    • 2009-01-27
    • US11434933
    • 2006-05-17
    • Eui-Seung KimJung-Hyun Kim
    • Eui-Seung KimJung-Hyun Kim
    • G11C5/01
    • G11C7/1051G11C7/02G11C7/06G11C7/1063G11C29/026
    • Voltage glitch detection circuits and methods thereof. The voltage glitch detection circuit may include a monitoring memory array including at least one memory cell storing reference data, a monitoring sense amplifier receiving stored reference data from the monitoring memory array, amplifying the received stored reference data in response to an operation control signal and outputting data based on the reference data, a data storage circuit including at least one latch to store the reference data and a comparator circuit receiving and comparing the data output from the monitoring sense amplifier and the stored reference data from the data storage circuit, and outputting a detection signal based on the comparison. The voltage glitch detection circuit may include a first storage unit configured to latch a first voltage, a second storage unit configured to latch a second voltage, a first comparator circuit first comparing the latched first voltage with a first reference voltage and outputting a first comparison result, a second compariator circuit second comparing the second voltage with a second reference voltage and outputting a second comparison result and a third comparator circuit third comparing the first and second comparison results and outputting a reset detection signal based on the third comparison.
    • 电压毛刺检测电路及其方法。 电压毛刺检测电路可以包括监视存储器阵列,其包括存储参考数据的至少一个存储器单元,监视读出放大器,接收来自监视存储器阵列的存储的参考数据,响应于操作控制信号放大所接收的存储的参考数据并输出 基于参考数据的数据的数据存储电路,包括用于存储参考数据的至少一个锁存器的数据存储电路;以及比较器电路,接收和比较来自监视读出放大器的数据和来自数据存储电路的存储的参考数据, 检测信号基于比较。 电压毛刺检测电路可以包括被配置为锁存第一电压的第一存储单元,被配置为锁存第二电压的第二存储单元,第一比较器电路,首先将锁存的第一电压与第一参考电压进行比较,并输出第一比较结果 第二比较器电路,其将所述第二电压与第二参考电压进行比较,并输出第二比较结果;以及第三比较器电路,其对所述第一和第二比较结果进行比较,并输出基于所述第三比较的复位检测信号。