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    • 1. 发明申请
    • Camera module package
    • 相机模块包
    • US20070146534A1
    • 2007-06-28
    • US11638396
    • 2006-12-14
    • Jung Jin KimJung Hoon LeeKazuhiko Suenobu
    • Jung Jin KimJung Hoon LeeKazuhiko Suenobu
    • H04N5/225
    • H04N5/2253H01L27/14618H01L27/14625H01L2924/0002H04N5/2254H04N5/2257H01L2924/00
    • The invention relates to a camera module package including a lens barrel having at least one lens therein and an IR filter installed at a lower end thereof. The package also includes a housing having the lens barrel disposed movable in an optical axis direction in an inner hole thereof. The package additionally includes a ceramic substrate attached to a lower end of the housing, the ceramic substrate having an opening formed on an upper surface thereof corresponding to the position of the lens. The package further includes an image sensor electrically connected to a lower part of the ceramic substrate, the image sensor having an image sensing region thereof exposed through the opening of the ceramic substrate. This prevents damaging the components by the adhesive leaking during the assembly, defective products due to infiltration of extraneous material, improves product reliability and reduces manufacturing costs.
    • 本发明涉及一种相机模块封装,其包括其中具有至少一个透镜的透镜镜筒和安装在其下端的IR滤光器。 该封装还包括具有可在其内孔中沿光轴方向移动的镜筒的壳体。 该封装还包括附接到壳体的下端的陶瓷衬底,陶瓷衬底具有形成在其对应于透镜位置的上表面上的开口。 该封装还包括电连接到陶瓷基板的下部的图像传感器,该图像传感器具有通过陶瓷基板的开口暴露的图像感测区域。 这样可以防止在组装过程中由于粘合剂泄漏而损坏组件,由于外来材料的渗透导致的不合格产品,提高了产品的可靠性并降低了制造成本。