专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100165566A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20100165566A1
公开(公告)日：2010-07-01
申请号：US12423817
申请日：2009-04-15
申请人： Jun-Hai Li , Xue-Wen Peng
发明人： Jun-Hai Li , Xue-Wen Peng
IPC分类号： G06F1/20 , F28F7/00 , F28D15/00
CPC分类号： G06F1/20 , F28D15/0233 , F28D15/0266
摘要： A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.
摘要翻译：用于消散附加卡产生的热量的散热装置。散热装置包括两个散热器和两个连接两个散热片的热管。每个散热器包括安装在基座顶表面上的底座和翅片组。每个热管包括连接部分和从连接部分的相对端延伸的两个导热部分。每个热管的两个导热部分之一被夹在基座和一个散热器的翅片组之间，另外两个导热部分夹在基座和另一个散热片的翅片组之间。

2. 发明授权

US07365989B2 Heat dissipating device for computer add-on cards 失效
标题翻译：计算机附加卡散热装置
公开(公告)号：US07365989B2
公开(公告)日：2008-04-29
申请号：US11308134
申请日：2006-03-08
申请人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.
摘要翻译：安装在VGA卡（10）上的散热装置包括与安装在VGA卡上的GPU（12）接触的基座（22），安装在基座上的盖（21）和多个翅片（24）在盖和基座之间进行热连接。基座定义GPU上方的槽（222）。风扇（28）位于基座上用于驱动气流，其中气流的一部分流过翅片，另一部分气流流过狭槽并吹过靠近GPU的其它电子部件。因此，气流的反弹降低，散热装置具有更好的散热效率。

3. 发明申请

US20070211432A1 HEAT DISSIPATING DEVICE FOR COMPUTER ADD-ON CARDS 失效
标题翻译：用于计算机附加卡的散热装置
公开(公告)号：US20070211432A1
公开(公告)日：2007-09-13
申请号：US11308134
申请日：2006-03-08
申请人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.
摘要翻译：安装在VGA卡（10）上的散热装置包括与安装在VGA卡上的GPU（12）接触的基座（22），安装在基座上的盖（21）和多个翅片（24）在盖和基座之间进行热连接。基座定义GPU上方的槽（222）。风扇（28）位于基座上用于驱动气流，其中气流的一部分流过翅片，另一部分气流流过狭槽并吹过靠近GPU的其它电子部件。因此，气流的反弹降低，散热装置具有更好的散热效率。

4. 发明授权

US07885073B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07885073B2
公开(公告)日：2011-02-08
申请号：US12482405
申请日：2009-06-10
申请人： Xue-Wen Peng , Jun-Hai Li
发明人： Xue-Wen Peng , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.
摘要翻译：散热装置适用于从其上具有多个处理器的附加卡产生的热量。散热装置包括蒸气室和安装构件。蒸气室与处理器热接触。安装构件安装在蒸气室的底表面上。多个螺钉延伸穿过附加卡并与安装构件接合以将附加卡上的蒸气室组装。

5. 发明申请

US20070251670A1 VAPOR CHAMBER HEAT SINK 失效
标题翻译：蒸气室散热器
公开(公告)号：US20070251670A1
公开(公告)日：2007-11-01
申请号：US11308764
申请日：2006-04-28
申请人： Xue-Wen Peng , Bing Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Bing Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.
摘要翻译：附接到发热电子部件的蒸气室散热器包括在其中限定开口的基部（10）。多个翅片（20）安装在基座上。热管（30）热连接电子部件和翅片。所述热管包括与所述基座的底表面和所述翅片的底表面（22）接触并覆盖所述电子部件的顶表面的板式下部（32），平板型上部（34）平行连接到与翅片的顶表面（24）接触的下部，以及连接部分（36），其连接下部和上部的相对的两端。热管以这样的方式配置，以便增强热管和电子部件之间以及热管和翅片之间的接触面积和热导率。

6. 发明授权

US07782617B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07782617B2
公开(公告)日：2010-08-24
申请号：US12423817
申请日：2009-04-15
申请人： Jun-Hai Li , Xue-Wen Peng
发明人： Jun-Hai Li , Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0233 , F28D15/0266
摘要： A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.
摘要翻译：用于消散附加卡产生的热量的散热装置。散热装置包括两个散热器和两个连接两个散热片的热管。每个散热器包括安装在基座顶表面上的底座和翅片组。每个热管包括连接部分和从连接部分的相对端延伸的两个导热部分。每个热管的两个导热部分之一被夹在基座和一个散热器的翅片组之间，另外两个导热部分夹在基座和另一个散热片的翅片组之间。

7. 发明授权

US07699094B2 Vapor chamber heat sink 失效
标题翻译：蒸气室散热器
公开(公告)号：US07699094B2
公开(公告)日：2010-04-20
申请号：US11308764
申请日：2006-04-28
申请人： Xue-Wen Peng , Bing Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Bing Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.
摘要翻译：附接到发热电子部件的蒸气室散热器包括在其中限定开口的基部（10）。多个翅片（20）安装在基座上。热管（30）热连接电子部件和翅片。所述热管包括与所述基座的底表面和所述翅片的底表面（22）接触并覆盖所述电子部件的顶表面的板式下部（32），平板型上部（34）平行连接到与翅片的顶表面（24）接触的下部，以及连接部分（36），其连接下部和上部的相对的两端。热管以这样的方式配置，以便增强热管和电子部件之间以及热管和翅片之间的接触面积和热导率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式