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1. 发明授权

US07551435B2 Heat-absorbing member, cooling device, and electronic apparatus 有权
标题翻译：吸热件，冷却装置和电子设备
公开(公告)号：US07551435B2
公开(公告)日：2009-06-23
申请号：US11898254
申请日：2007-09-11
申请人： Jun Taniguchi , Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date , Masatomo Asano , Nobuhiro Nanri
发明人： Jun Taniguchi , Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date , Masatomo Asano , Nobuhiro Nanri
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.
摘要翻译：高度不同的电子元件（CPU2a，电容器2b和线圈元件2c）安装在印刷电路板1上。在印刷电路板1的上方设有吸热元件3，使得元件3 不仅接触CPU 2a的最短但电容器2b和线圈元件2c的侧面的顶表面。为了循环冷却介质，在吸热部件3中形成有流路4.在CPU2a产生的热量经由吸热部件3从流路4的顶面向冷却介质传递。在电容器2b和线圈元件2c处产生的热量经由吸热构件3从侧面传递到流路4中的冷却介质。

2. 发明申请

US20080055860A1 Heat-absorbing member, cooling device, and electronic apparatus 有权
标题翻译：吸热件，冷却装置和电子设备
公开(公告)号：US20080055860A1
公开(公告)日：2008-03-06
申请号：US11898254
申请日：2007-09-11
申请人： Jun Taniguchi , Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date , Masatomo Asano , Nobuhiro Nanri
发明人： Jun Taniguchi , Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date , Masatomo Asano , Nobuhiro Nanri
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.
摘要翻译：高度不同的电子部件（CPU2a，电容器2b和线圈元件2c）安装在印刷电路板1上。在印刷电路板1的上方设有吸热部件3，构件3不仅接触CPU2a的最短但电容器2b的侧面和线圈元件2c的顶表面。为了循环冷却介质，在吸热部件3中形成有流路4.在CPU2a产生的热量经由吸热部件3从流路4的顶面向冷媒介质传递。在电容器2b和线圈元件2c产生的热量经由吸热部件3从侧面传递到流路4中的冷却介质。

3. 发明授权

US07978470B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US07978470B2
公开(公告)日：2011-07-12
申请号：US12251172
申请日：2008-10-14
申请人： Hiroki Uchida , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
发明人： Hiroki Uchida , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.
摘要翻译：具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在这些流路。在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁，并且内部散热板和外部散热板可移动到第二壳体。根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

4. 发明授权

US07502227B2 Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US07502227B2
公开(公告)日：2009-03-10
申请号：US11085483
申请日：2005-03-22
申请人： Hiroki Uchida , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
发明人： Hiroki Uchida , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.
摘要翻译：具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在这些流路。在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁，并且内部散热板和外部散热板可移动到第二壳体。根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

5. 发明申请

US20090052135A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20090052135A1
公开(公告)日：2009-02-26
申请号：US12251172
申请日：2008-10-14
申请人： Hiroki UCHIDA , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
发明人： Hiroki UCHIDA , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.
摘要翻译：具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在这些流路。在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁，并且内部散热板和外部散热板可移动到第二壳体。根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

6. 发明申请

US20060133032A1 Electronic apparatus 失效
公开(公告)号：US20060133032A1
公开(公告)日：2006-06-22
申请号：US11085483
申请日：2005-03-22
申请人： Hiroki Uchida , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
发明人： Hiroki Uchida , Jun Taniguchi , Hideshi Tokuhira , Minoru Ishinabe , Masanobu Ishiduka , Hiroaki Date
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

7. 发明申请

US20060065970A1 Radiating fin and method for manufacturing the same 审中-公开
标题翻译：辐射翅片及其制造方法
公开(公告)号：US20060065970A1
公开(公告)日：2006-03-30
申请号：US11020245
申请日：2004-12-27
申请人： Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Hiroaki Date , Jun Taniguchi
发明人： Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Hiroaki Date , Jun Taniguchi
IPC分类号： H01L23/053
CPC分类号： H01L23/373 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.
摘要翻译：将具有金属镀层（Cu镀层）的表面的多个碳纤维通过静电植绒垂直放置在平板状临时基板上，并且将碳纤维的一端临时粘附到临时基板上，粘合剂。未临时粘附的碳纤维的另一端与表面被焊膏涂布的基板（Cu板）接触，在该状态下，钎焊材料（焊料）熔融冷却，碳纤维和衬底钎焊（焊接）。在基板和碳纤维之间的机械和热连接完成之后，将其浸入有机溶剂中，并将临时粘附的临时基板从碳纤维上剥离以制造散热片。

8. 发明申请

US20070000655A1 Heat exchanger for liquid cooling 审中-公开
标题翻译：液体冷却换热器
公开(公告)号：US20070000655A1
公开(公告)日：2007-01-04
申请号：US11255952
申请日：2005-10-24
申请人： Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Hiroaki Date , Jun Taniguchi
发明人： Hiroki Uchida , Hideshi Tokuhira , Minoru Ishinabe , Hiroaki Date , Jun Taniguchi
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , G06F2200/203
摘要： To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.
摘要翻译：为了实现具有优异的流路稳定性的扁平式热交换器，冷却液体在热交换器内部流动的液体冷却用热交换器包括：由具有流入口和流出口的防水片制成的袋，冷却液与所述袋重叠的热交换板; 压板压住热交换板; 其特征在于，在所述热交换板和所述压板的至少一个的内侧形成有限定连通所述流入口和所述流出口的流路的突起和凹部。

9. 发明申请

US20060005549A1 Cooling structure for electronic equipment 有权
标题翻译：电子设备冷却结构
公开(公告)号：US20060005549A1
公开(公告)日：2006-01-12
申请号：US11222793
申请日：2005-09-12
申请人： Minoru Ishinabe , Hiroki Uchida , Hideshi Tokuhira , Hiroaki Date , Wataru Tanaka
发明人： Minoru Ishinabe , Hiroki Uchida , Hideshi Tokuhira , Hiroaki Date , Wataru Tanaka
IPC分类号： F28D15/00 , F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F28D15/00 , F28D15/0266 , F28F3/12 , F28F2210/02 , G06F1/1607 , G06F1/20 , G06F1/203 , G06F2200/1612 , G06F2200/1631 , G06F2200/201 , G06F2200/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).
摘要翻译：电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a）（20）。冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与设置在隔热空间（6）内部的散热部（7）与发热体（2a）和受热部（4）热绝缘，用于将在受热部分（4）中回收的热量传递到散热部分（7）的传热部件（5）和用于在绝热空间（6）中强制产生空气流的风扇（22））。由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇（ 22）在隔热空间（6）内。

10. 发明授权

US07155914B2 Cooling structure for electronic equipment 有权
标题翻译：电子设备冷却结构
公开(公告)号：US07155914B2
公开(公告)日：2007-01-02
申请号：US11222793
申请日：2005-09-12
申请人： Minoru Ishinabe , Hiroki Uchida , Hideshi Tokuhira , Hiroaki Date , Wataru Tanaka
发明人： Minoru Ishinabe , Hiroki Uchida , Hideshi Tokuhira , Hiroaki Date , Wataru Tanaka
IPC分类号： F25D23/12
CPC分类号： F25B21/02 , F25B2321/0212 , F28D15/00 , F28D15/0266 , F28F3/12 , F28F2210/02 , G06F1/1607 , G06F1/20 , G06F1/203 , G06F2200/1612 , G06F2200/1631 , G06F2200/201 , G06F2200/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).
摘要翻译：电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a）（20）。冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与发热体（2a）和热接收部分（4）热绝缘，设置在隔热空间（6）内部的散热部分（7），用于将在所述受热部（4）中回收的热量传递到所述散热部（7）的传热部件（5），以及用于在所述绝热空间（12）中强制产生空气流的风扇（22） 6）。由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇（22）在隔热空间（6）内。

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