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    • 1. 发明授权
    • Insulated-gate bipolar transistor
    • 绝缘栅双极晶体管
    • US09425271B2
    • 2016-08-23
    • US14002752
    • 2012-03-07
    • Jun SaitoSatoru Machida
    • Jun SaitoSatoru Machida
    • H01L29/423H01L29/739H01L29/10H01L29/06H01L29/08
    • H01L29/423H01L29/0619H01L29/0623H01L29/0696H01L29/0847H01L29/1095H01L29/4238H01L29/7395H01L29/7397
    • In an IGBT, a trench extending in a bent shape to have a corner is formed in an upper surface of a semiconductor substrate. The inside of the trench is covered with an insulating film. A gate is placed inside the trench. An emitter and a collector are formed on an upper surface and a lower surface of the semiconductor substrate, respectively. An emitter region, a body region, a drift region, and a collector region are formed in the semiconductor substrate. The emitter region is formed of an n-type semiconductor, is in contact with the insulating film, and is in ohmic contact with the emitter electrode. The body region is formed of a p-type semiconductor, is in contact with the insulating film below the emitter region, is in contact with the insulating film of an inner corner portion of the trench, and is in ohmic contact with the emitter electrode.
    • 在IGBT中,在半导体基板的上表面形成有以弯曲形状延伸成具有角部的沟槽。 沟槽的内部覆盖有绝缘膜。 一个门被放置在沟槽内。 分别在半导体衬底的上表面和下表面上形成发射极和集电极。 在半导体衬底中形成发射极区域,体区域,漂移区域和集电极区域。 发射极区由n型半导体形成,与绝缘膜接触,与发射电极欧姆接触。 体区域由p型半导体形成,与发射极区域下方的绝缘膜接触,与沟槽的内角部分的绝缘膜接触,并与发射极电极欧姆接触。
    • 7. 发明授权
    • Reverse conducting IGBT
    • 反向导通IGBT
    • US09099521B2
    • 2015-08-04
    • US14182923
    • 2014-02-18
    • Yusuke YamashitaSatoru MachidaJun Saito
    • Yusuke YamashitaSatoru MachidaJun Saito
    • H01L29/739H01L29/861H01L29/08H01L29/10
    • H01L29/7395H01L29/0834H01L29/1095H01L29/7397H01L29/8611
    • A reverse conducting IGBT that includes an insulated gate; a semiconductor layer having a first conductivity type drift region, a second conductivity type body region, a first conductivity type emitter region, and a second conductivity type intermediate region; and an emitter electrode provided on a surface of the semiconductor layer. The first conductivity type drift region of the semiconductor layer contacts the insulated gate. The second conductivity type body region of the semiconductor layer is provided on the drift region and contacts the insulated gate. The first conductivity type emitter region of the semiconductor layer is provided on the body region and contacts the insulated gate. The second conductivity type intermediate region of the semiconductor layer is provided on the emitter region and is interposed between the emitter region and the emitter electrode.
    • 包括绝缘栅极的反向导通IGBT; 具有第一导电类型漂移区域,第二导电类型体区域,第一导电类型发射极区域和第二导电类型中间区域的半导体层; 以及设置在半导体层的表面上的发射电极。 半导体层的第一导电型漂移区域与绝缘栅极接触。 半导体层的第二导电类型体区设置在漂移区上并与绝缘栅接触。 半导体层的第一导电型发射极区域设置在主体区域上并与绝缘栅极接触。 半导体层的第二导电类型中间区域设置在发射极区域上并且插入在发射极区域和发射极电极之间。
    • 8. 发明申请
    • INSULATED-GATE BIPOLAR TRANSISTOR
    • 绝缘栅双极晶体管
    • US20140054645A1
    • 2014-02-27
    • US14002752
    • 2012-03-07
    • Jun SaitoSatoru Machida
    • Jun SaitoSatoru Machida
    • H01L29/423H01L29/739
    • H01L29/423H01L29/0619H01L29/0623H01L29/0696H01L29/0847H01L29/1095H01L29/4238H01L29/7395H01L29/7397
    • In an IGBT, a trench extending in a bent shape to have a corner is formed in an upper surface of a semiconductor substrate. The inside of the trench is covered with an insulating film. A gate is placed inside the trench. An emitter and a collector are formed on an upper surface and a lower surface of the semiconductor substrate, respectively. An emitter region, a body region, a drift region, and a collector region are formed in the semiconductor substrate. The emitter region is formed of an n-type semiconductor, is in contact with the insulating film, and is in ohmic contact with the emitter electrode. The body region is formed of a p-type semiconductor, is in contact with the insulating film below the emitter region, is in contact with the insulating film of an inner corner portion of the trench, and is in ohmic contact with the emitter electrode.
    • 在IGBT中,在半导体基板的上表面形成有以弯曲形状延伸成具有角部的沟槽。 沟槽的内部覆盖有绝缘膜。 一个门被放置在沟槽内。 分别在半导体衬底的上表面和下表面上形成发射极和集电极。 在半导体衬底中形成发射极区域,体区域,漂移区域和集电极区域。 发射极区由n型半导体形成,与绝缘膜接触,与发射电极欧姆接触。 体区域由p型半导体形成,与发射极区域下方的绝缘膜接触,与沟槽的内角部分的绝缘膜接触,并与发射极电极欧姆接触。