专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050037278A1 Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof 审中-公开
标题翻译：用于形成透光电磁屏蔽的光敏厚膜糊材料，使用其形成的透光电磁屏蔽及其制造方法
公开(公告)号：US20050037278A1
公开(公告)日：2005-02-17
申请号：US10891925
申请日：2004-07-15
申请人： Jun Koishikawa , Tsutomu Mutoh , Motohiko Tsuchiya
发明人： Jun Koishikawa , Tsutomu Mutoh , Motohiko Tsuchiya
IPC分类号： H01B1/20 , B32B9/00 , B32B15/04 , C03C17/36 , C03C17/40 , C09D4/02 , G03F7/00 , G03F7/004 , G03F7/027 , G09F9/00 , H01J9/20 , H05K1/09 , H05K3/02 , H05K9/00 , G03F7/26
CPC分类号： H05K9/0096 , C03C17/36 , C03C17/3607 , C03C17/3634 , C03C17/3644 , C03C17/3655 , C03C17/3676 , C03C17/40 , C03C2217/44 , C03C2217/475 , C03C2217/479 , C03C2217/485 , C03C2218/119 , G03F7/0007 , G03F7/0047 , H01J9/205 , H01J2211/446 , H01J2329/869 , H05K1/092 , H05K3/02
摘要： The present invention relates to light-transmitting electromagnetic shields which, when installed at the front of displays such as plasma display panels (PDP), cathode-ray tubes (CRT) or electroluminescent (EL) displays, have electromagnetic shielding properties that cut down on the emission of electromagnetic waves, have a high visible light transmittance, lower the reflectance to outside light, and have a good durability.
摘要翻译：本发明涉及当安装在诸如等离子体显示面板（PDP），阴极射线管（CRT）或电致发光（EL））显示器之类的显示器前面时具有电磁屏蔽性能的光透射电磁屏蔽电磁波的发射具有高可见光透射率，降低对外界光的反射率，并具有良好的耐久性。

2. 发明授权

US07618766B2 Flame retardant photoimagable coverlay compositions and methods relating thereto 有权
标题翻译：阻燃可光成像覆盖物组合物及其相关方法
公开(公告)号：US07618766B2
公开(公告)日：2009-11-17
申请号：US11642184
申请日：2006-12-20
申请人： Tsutomu Mutoh
发明人： Tsutomu Mutoh
IPC分类号： G03C1/725 , G03C1/73 , G03F7/027 , G03F7/029
CPC分类号： G03F7/027 , G03F7/029 , H05K3/287 , H05K3/389 , H05K2201/012 , H05K2203/124
摘要： The present invention is directed to phosphorus containing (or “halogen free”) flame retardant photoimagable compositions useful as a coverlay material in a flexible electronic circuitry package. These compositions are generally photosensitive and comprise phosphorus containing acrylates and phosphorus-containing photo-initiators mixed with a polymer binder. The compositions of the present invention typically comprise elemental phosphorus in an amount between, and including, any two of the following numbers 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, 4.0, 4.2, 4.4, 4.6, 4.8, 5.0, 5.2, 5.4, 5.6, 5.8 and 6.0 weight percent.
摘要翻译：本发明涉及用作柔性电子电路封装中的覆盖材料的含磷（或“无卤素”）阻燃光可光成像组合物。这些组合物通常是光敏的，并且包含与聚合物粘合剂混合的含磷丙烯酸酯和含磷光引发剂。本发明的组合物通常包含以下数量中的任何两个之间的量的元素磷，包括以下数字中的任何两个：2.0,2.2,2.4,2.6,2.8,3.0,3.2,3.4,3.6,3.8,4.0,4.2,4.4， 4.6,4.8,5.0,5.2,5.4,5.6,5.8和6.0重量％。

3. 发明申请

US20070149635A1 Flame retardant photoimagable coverlay compositions and methods relating thereto 有权
标题翻译：阻燃可光成像覆盖物组合物及其相关方法
公开(公告)号：US20070149635A1
公开(公告)日：2007-06-28
申请号：US11642184
申请日：2006-12-20
申请人： Tsutomu Mutoh
发明人： Tsutomu Mutoh
IPC分类号： C08F2/50
CPC分类号： G03F7/027 , G03F7/029 , H05K3/287 , H05K3/389 , H05K2201/012 , H05K2203/124
摘要： The present invention is directed to phosphorus containing (or “halogen free”) flame retardant photoimagable compositions useful as a coverlay material in a flexible electronic circuitry package. These compositions are generally photosensitive and comprise phosphorus containing acrylates and phosphorus-containing photo-initiators mixed with a polymer binder. The compositions of the present invention typically comprise elemental phosphorus in an amount between, and including, any two of the following numbers 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, 4.0, 4.2, 4.4, 4.6, 4.8, 5.0, 5.2, 5.4, 5.6, 5.8 and 6.0 weight percent.
摘要翻译：本发明涉及用作柔性电子电路封装中的覆盖材料的含磷（或“无卤素”）阻燃光可光成像组合物。这些组合物通常是光敏的，并且包含与聚合物粘合剂混合的含磷丙烯酸酯和含磷光引发剂。本发明的组合物通常包含以下数量中的任何两个之间的量的元素磷，包括以下数字中的任何两个：2.0,2.2,2.4,2.6,2.8,3.0,3.2,3.4,3.6,3.8,4.0,4.2,4.4， 4.6,4.8,5.0,5.2,5.4,5.6,5.8和6.0重量％。

4. 发明申请

US20100323161A1 HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：高粘度聚酰亚胺层压板及其制备方法
公开(公告)号：US20100323161A1
公开(公告)日：2010-12-23
申请号：US12865746
申请日：2009-01-30
申请人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
发明人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
IPC分类号： B32B3/30 , B32B15/08 , B05D3/02 , C08L79/04
CPC分类号： C08G73/1007 , C08L79/08 , C09D179/08 , C09J179/08 , H05K1/0346 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , Y10T428/24355 , Y10T428/31681
摘要： The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
摘要翻译：本发明涉及一种聚酰亚胺覆铜层压板及其制造方法。层压体包括聚酰亚胺层和铜箔层，其中聚酰亚胺层由包含二胺单体，二酐单体，有机溶剂和具有一个或多个有机官能团的硅烷偶联剂的聚酰亚胺前体制成，以及铜箔是光滑的铜箔。本发明的聚酰亚胺层提供高透明度，良好的尺寸稳定性，良好的机械性能和对铜箔的良好粘合性。

5. 发明申请

US20090197104A1 HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：高粘度聚酰亚胺层压板及其制备方法
公开(公告)号：US20090197104A1
公开(公告)日：2009-08-06
申请号：US12117026
申请日：2008-05-08
申请人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
发明人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
IPC分类号： B32B15/088 , B05D3/02 , C08G69/26
CPC分类号： C08G73/1007 , C08L79/08 , C09D179/08 , C09J179/08 , H05K1/0346 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , Y10T428/24355 , Y10T428/31681
摘要： The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
摘要翻译：本发明涉及一种聚酰亚胺覆铜层压板及其制造方法。层压体包括聚酰亚胺层和铜箔层，其中聚酰亚胺层由包含二胺单体，二酐单体，有机溶剂和具有一个或多个有机官能团的硅烷偶联剂的聚酰亚胺前体制成，以及铜箔是光滑的铜箔。本发明的聚酰亚胺层提供高透明度，良好的尺寸稳定性，良好的机械性能和对铜箔的良好粘合性。

6. 发明授权

US08233261B2 Composite organic encapsulants 有权
标题翻译：复合有机密封剂
公开(公告)号：US08233261B2
公开(公告)日：2012-07-31
申请号：US12514822
申请日：2007-12-11
申请人： John D Summers , Tsutomu Mutoh
发明人： John D Summers , Tsutomu Mutoh
IPC分类号： H01G4/00 , H01G4/06
CPC分类号： H05K1/162 , H01G4/224 , H01L23/50 , H01L2924/0002 , H05K3/1291 , H05K2201/0154 , H05K2201/0158 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , H05K2203/1126 , H01L2924/00
摘要： This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
摘要翻译：本发明涉及组合物，以及这些组合物用于保护涂层，特别是电子器件的用途。本发明涉及一种涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。

7. 发明申请

US20080033090A1 Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto 有权
标题翻译：阻燃多层可光成像覆盖物组合物及其相关方法
公开(公告)号：US20080033090A1
公开(公告)日：2008-02-07
申请号：US11488996
申请日：2006-07-19
申请人： Tsutomu Mutoh
发明人： Tsutomu Mutoh
IPC分类号： C08K3/22
CPC分类号： H05K3/287 , C08K3/016 , C08K3/22 , C08K5/5397 , H05K2201/012 , H05K2201/0195 , H05K2201/0209 , H05K2203/124 , Y10S430/106 , Y10S430/114 , Y10S430/128
摘要： The present invention is directed to phosphorus containing (or “halogen free”) multi-layer flame retardant photoimagable compositions useful as a coverlay material in a flexible electronic circuitry package. These compositions generally contain a top layer and bottom layer adjacent to one another both being photosensitive and comprising phosphorus containing acrylates and phosphorus-containing photo-initiators mixed with a polymer binder. These compositions typically have phosphorus in the top layer in an amount between, and including, any two of the following numbers 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, 4.0, 4.2, 4.4, 4.6, 4.8, 5.0, 5.2, 5.4, 5.6, 5.8, 6.0, 6.2, 6.4, 6.6, 6.8, 7.0, 7.2, 7.4, 7.6, 7.8, 8.0, 8.2, 8.4, 8.6, 8.8, 9.0, 9.2, 9.4, 9.6, 9.8, and 10.0 weight percent, and have phosphorus in the bottom layer in an amount between, and including, any two of the following numbers, 0.0, 0.2, 0.4, 0.6, 0.8, 1.0, 1.2, 1.4, 1.6, 1.8, 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, and 4.0 weight percent.
摘要翻译：本发明涉及用作柔性电子电路封装中的覆盖材料的含磷（或“无卤素”）多层阻燃光可光成像组合物。这些组合物通常包含彼此相邻的顶层和底层，它们都是光敏的，并且包含与聚合物粘合剂混合的含磷丙烯酸酯和含磷光引发剂。这些组合物通常在顶层中的磷含量为2.0,2.2,2.4,2.6,2.8,3.0,3.2,3.4,3.6,3.8,4.0,4.2,4.4,4.6中的任何两个之间的量。，4.8,5.0,5.2,5.4,5.6,5.8,6.0,6.2,6.4,6.6,6.8,7.0,7.2,7.4,7.6,7.8,8.0,8.2,8.4,8.6,8.8,9.0,9.2,9.4,9.6 ，9.8和10.0重量％，并且在底层中的磷含量为0.0-0.2,0.4,0.6,0.8,1.0,1.2,1.4,1.6,1.8,1.0,1.2,1.4,1.8,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.0,1.2 2.0,2.2,2.4,2.6,2.8,3.0,3.2,3.4,3.6,3.8和4.0重量％。

8. 发明申请

US20060223690A1 Photosensitive thick-film dielectric paste composition and method for making an insulating layer using same 审中-公开
标题翻译：感光性厚膜电介质膏组合物及其制造方法
公开(公告)号：US20060223690A1
公开(公告)日：2006-10-05
申请号：US11096464
申请日：2005-04-01
申请人： Tsutomu Mutoh
发明人： Tsutomu Mutoh
IPC分类号： C03C3/072 , C03C8/16
CPC分类号： C03C3/064 , C03C3/062 , C03C3/07 , C03C3/072 , C03C8/04 , C03C8/10 , G03F7/0007 , G03F7/0047
摘要： Disclosed is a photosensitive thick-film dielectric paste composition that includes a glass frit having a glass softening point not lower than 0° to 40° C. below a firing temperature ranging above 450° C. and up to 600° C.; an organic polymer binder; a photoinitiator; a photocurable monomer; and an organic solvent, wherein the composition is aqueous-developable upon exposure to actinic radiation. A method for forming an insulating layer using the composition is also provided.
摘要翻译：公开了一种感光性厚膜电介质浆料组合物，其包含玻璃软化点在450℃以上且高达600℃的烧成温度以下的0〜40℃的玻璃料。有机聚合物粘合剂; 光引发剂; 光固化单体; 和有机溶剂，其中所述组合物在暴露于光化辐射下是水性可显影的。还提供了使用该组合物形成绝缘层的方法。

9. 发明申请

US20130244000A1 HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：高粘度聚酰亚胺层压板及其制备方法
公开(公告)号：US20130244000A1
公开(公告)日：2013-09-19
申请号：US13602966
申请日：2012-09-04
申请人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
发明人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
IPC分类号： B32B3/30
CPC分类号： B32B3/30 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09D179/08 , H05K1/0346 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , Y10T428/24355 , C08K5/5455
摘要： The present invention is related to a chip on film package, comprising a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
摘要翻译：本发明涉及一种胶片封装，包括聚酰亚胺覆铜层压板及其制造方法。层压体包括聚酰亚胺层和铜箔层，其中聚酰亚胺层由包含二胺单体，二酐单体，有机溶剂和具有一个或多个有机官能团的硅烷偶联剂的聚酰亚胺前体制成，以及铜箔是光滑的铜箔。本发明的聚酰亚胺层提供高透明度，良好的尺寸稳定性，良好的机械性能和对铜箔的良好粘合性。

10. 发明申请

US20100067168A1 COMPOSITE ORGANIC ENCAPSULANTS 有权
标题翻译：复合有机包装
公开(公告)号：US20100067168A1
公开(公告)日：2010-03-18
申请号：US12514822
申请日：2007-12-11
申请人： John D. Summers , Tsutomu Mutoh
发明人： John D. Summers , Tsutomu Mutoh
IPC分类号： H01G4/224
CPC分类号： H05K1/162 , H01G4/224 , H01L23/50 , H01L2924/0002 , H05K3/1291 , H05K2201/0154 , H05K2201/0158 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , H05K2203/1126 , H01L2924/00
摘要： This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
摘要翻译：本发明涉及组合物，以及这些组合物用于保护涂层，特别是电子器件的用途。本发明涉及一种涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式