专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070141805A1 Method for bonding plastic micro chip 有权
标题翻译：粘合塑料微芯片的方法
公开(公告)号：US20070141805A1
公开(公告)日：2007-06-21
申请号：US10583149
申请日：2004-12-17
申请人： Jun Chang , Dae Hur , Chanil Chung , Jun Park , Han Jo
发明人： Jun Chang , Dae Hur , Chanil Chung , Jun Park , Han Jo
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： B29C65/4895 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0816 , B01L2300/0825 , B01L2300/0887 , B29C59/14 , B29C65/02 , B29C65/08 , B29C65/14 , B29C65/16 , B29C65/48 , B29C65/54 , B29C65/548 , B29C66/02 , B29C66/028 , B29C66/1122 , B29C66/3022 , B29C66/53461 , B29C66/54 , B29C66/542 , B29C66/71 , B29C66/73161 , B29C66/8322 , B29K2023/06 , B29K2023/12 , B29K2025/00 , B29K2033/12 , B29K2069/00 , B29K2101/12 , B29K2995/0026 , B29L2031/756 , H01L25/046 , H01L2924/0002 , Y10T156/1064 , B29C59/16 , B29C65/00 , H01L2924/00 , B29K2067/003 , B29K2025/06
摘要： Disclosed is a method of bonding upper and lower substrates for manufacturing a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates. According to the method, the upper and lower substrates are bonded by introducing an organic solvent between the upper and lower substrates. In addition, the invention provides a method of manufacturing a micro chip using the method and a micro chip manufactured according to the method. According to the invention, it is possible to easily and precisely bond the upper and lower substrates of the plastic micro chip.
摘要翻译：公开了一种用于制造塑料微芯片的上基板和下基板的方法，其包括上基板，下基板和具有预定高度的样品填充空间，用于在上基板和下基板之间填充样品。根据该方法，通过在上基板和下基板之间引入有机溶剂来粘合上基板和下基板。另外，本发明提供使用该方法制造微芯片的方法和根据该方法制造的微芯片。根据本发明，可以容易且精确地粘合塑料微芯片的上下基板。

2. 发明申请

US20060183444A1 Capacitance compensation type directional coupler and IPD for multi-band having the same 审中-公开
标题翻译：电容补偿型定向耦合器和IPD用于多频段具有相同的功能
公开(公告)号：US20060183444A1
公开(公告)日：2006-08-17
申请号：US11326333
申请日：2006-01-06
申请人： Dae Hur , Ki Kim , Young Kim
发明人： Dae Hur , Ki Kim , Young Kim
IPC分类号： H01Q11/12 , H04B1/04
CPC分类号： H04B1/005 , H01P5/185 , H04B2001/0416
摘要： The present invention relates to a directional coupler, in particular, to a capacitance compensation type directional coupler comprising a signal line for transmitting signals. A coupling line is formed apart from and parallel to the signal line, with its first end transmitting the extracted power and its second end terminated. At least one conductive line, electrically connected to the coupling line, is extended from the coupling line across the signal line, apart from and perpendicularly overlapping with the signal line. The present invention compensates capacitance between the signal line and the coupling line by forming capacitance in areas where the conductive line and the signal line overlapping each other perpendicularly.
摘要翻译：本发明涉及一种定向耦合器，特别涉及包括用于传输信号的信号线的电容补偿型定向耦合器。耦合线与信号线分开并平行，其第一端传输提取的功率，其第二端终止。电连接到耦合线的至少一条导线从耦合线延伸穿过信号线，与信号线分开并垂直重叠。本发明通过在导线和信号线垂直重叠的区域中形成电容来补偿信号线与耦合线之间的电容。

3. 发明申请

US20050239421A1 Directional coupler and dual-band transmitter using the same 有权
标题翻译：定向耦合器和双频发射器使用相同
公开(公告)号：US20050239421A1
公开(公告)日：2005-10-27
申请号：US10859147
申请日：2004-06-03
申请人： Ki Kim , Dae Hur , Woo Byun
发明人： Ki Kim , Dae Hur , Woo Byun
IPC分类号： H01P5/00 , H01P5/18 , H01Q11/12 , H04B1/02 , H04B1/04
CPC分类号： H01P5/185
摘要： Disclosed herein are a directional coupler which is implemented with strip lines for signal coupling and inter-digital capacitors for phase compensation, and a dual-band transmitter using the same. The directional coupler includes a first transmission device, a first directional coupling device for coupling a part of a signal from the first transmission device, a first inter-digital capacitor connected between the first transmission device and the first directional coupling device, a second transmission device, a second directional coupling device for coupling a part of a signal from the second transmission device, and a second inter-digital capacitor connected between the second transmission device and the second directional coupling device.
摘要翻译：这里公开了一种定向耦合器，其用于用于信号耦合的带状线和用于相位补偿的数字间电容器，以及使用其的双频发射器。定向耦合器包括第一传输设备，用于耦合来自第一传输设备的信号的一部分的第一定向耦合设备，连接在第一传输设备和第一定向耦合设备之间的第一数字间电容器，第二传输设备，用于耦合来自第二传输装置的信号的一部分的第二定向耦合装置和连接在第二传输装置和第二定向耦合装置之间的第二数字间电容器。

4. 发明申请

US20050197153A1 Dual band transmitter having filtering coupler 有权
标题翻译：具有滤波耦合器的双频带发射机
公开(公告)号：US20050197153A1
公开(公告)日：2005-09-08
申请号：US10849230
申请日：2004-05-20
申请人： Young Kim , Ki Kim , Dae Hur , Woo Byun
发明人： Young Kim , Ki Kim , Dae Hur , Woo Byun
IPC分类号： H04B1/04 , H04B1/034 , H04B1/46
CPC分类号： H04B1/0458 , H04B1/006
摘要： The invention provides a dual band transmitter available for a mobile communication terminal such as mobile phone, in which a first RF amplifier 111 amplifies the power of a high band signal BS1 at a first amplification factor that is determined according to a first bias voltage. A second RF amplifier 121 amplifies the power of a low band signal BS2 at a second amplification factor determined according to a second bias voltage. A first coupling capacitor C11 couples an output signal from the first RF amplifier 111. A second coupling capacitor C21 couples an output signal from the second RF amplifier 121. A filtering coupler 140 has a high pass filter FT1 for a first coupled signal from the first coupling capacitor C11 and a low pass filter FT2 for a second coupled signal from the second coupling capacitor C21. A power amplifier controller 150 compares the magnitudes of filtered signals from the filtering coupler 140 with preset reference values to obtain difference values, and adjusts the bias voltages of the first and second RF amplifiers 111 and 121 based upon the difference values to control the first and second amplification factors.
摘要翻译：本发明提供一种可用于诸如移动电话的移动通信终端的双频带发射机，其中第一RF放大器111以根据第一偏置电压确定的第一放大因子放大高频带信号BS 1的功率。第二RF放大器121以根据第二偏置电压确定的第二放大因数放大低频信号BS 2的功率。第一耦合电容器C 11耦合来自第一RF放大器111的输出信号。第二耦合电容器C 21耦合来自第二RF放大器121的输出信号。滤波耦合器140具有用于来自第一耦合电容器C 11的第一耦合信号的高通滤波器FT 1和来自第二耦合电容器C 21的第二耦合信号的低通滤波器FT 2。功率放大器控制器150将来自滤波耦合器140的滤波信号的幅度与预设参考值进行比较以获得差值，并且基于差值来调整第一和第二RF放大器111和121的偏置电压，以控制第一和第第二放大因子。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式