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1. 发明授权

US07986521B2 Heat dissipation device and computer using same 有权
标题翻译：散热装置和电脑使用相同
公开(公告)号：US07986521B2
公开(公告)日：2011-07-26
申请号：US12465628
申请日：2009-05-13
申请人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
发明人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , G06F1/20 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.
摘要翻译：散热装置包括翅片单元，风扇和风扇导管。翅片单元包括堆叠在一起的多个翅片。在每个两个相邻的翅片之间限定气流通道。风扇包括空气入口和相对的空气出口。风扇管道连通翅片单元和风扇的气流通道。风扇管道包括连接到风扇的空气入口的第一烟道和连接到散热片单元的第二烟道。第二烟道包括分别覆盖在翅片单元的两个相邻侧上的第一侧板和第二侧板。

2. 发明授权

US08079406B2 Thermal module 有权
标题翻译：散热模块
公开(公告)号：US08079406B2
公开(公告)日：2011-12-20
申请号：US11873786
申请日：2007-10-17
申请人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
发明人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
IPC分类号： H05K7/20
CPC分类号： F16B2/241
摘要： A thermal module includes a centrifugal blower (10), a heat sink (20) mounted to an air outlet (11) of the centrifugal blower, a heat pipe (40) connecting the heat sink with a heat generating electronic component, and a resilient clip (80) for mounting the heat pipe onto the heat generating electronic component. The resilient clip includes an M-shaped pressing portion (82) disposed above an evaporation section (44) of the heat pipe, a plate portion (83) disposed at one end of the pressing portion for being fixed to a sidewall (53d), and an abutting portion (85) disposed at the other end of the pressing portion and including an abutting plate (85b) for abutting against a bottom surface of another sidewall (53b).
摘要翻译：热模块包括离心式鼓风机（10），安装在离心式鼓风机的出风口（11）上的散热器（20），连接散热器和发热电子部件的热管（40）夹具（80），用于将热管安装到发热电子部件上。弹性夹包括设置在热管的蒸发部分（44）上方的M形按压部分（82），设置在按压部分的一端处以固定到侧壁（53d）的板部分（83）以及设置在所述按压部的另一端的抵接部（85），并且具有抵靠另一侧壁（53b）的底面的抵接板（85b）。

3. 发明授权

US08459343B2 Thermal module assembly and heat sink assembly having at least two engageable heat sinks 有权
标题翻译：热模块组件和散热器组件具有至少两个可接合的散热器
公开(公告)号：US08459343B2
公开(公告)日：2013-06-11
申请号：US12099171
申请日：2008-04-08
申请人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
发明人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
IPC分类号： F28F7/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F2275/14 , G06F1/20 , H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A thermal module assembly includes a first thermal module (10) and a second thermal module (20). The first thermal module (10) has a fan (300) with an air outlet, a first heat sink (120) positioned at the air outlet and a first clamp portion (122) formed on the first heat sink (120). The second thermal module (20) has a second heat sink (220) and a second clamp portion (222) formed on the second heat sink (220). The second heat sink (220) is juxtaposed with the first heat sink (120). The first heat sink (120) and the second heat sink (220) are combined together via engagement of the first clamp portion (122) and the second clamp portion (222) so that airflow produced by the fan (300) flows past the first heat sink (120) and the second heat sink (220) in order.
摘要翻译：热模块组件包括第一热模块（10）和第二热模块（20）。第一热模块（10）具有带空气出口的风扇（300），位于空气出口处的第一散热器（120）和形成在第一散热器（120）上的第一夹紧部分（122）。第二热模块（20）具有形成在第二散热器（220）上的第二散热器（220）和第二夹紧部分（222）。第二散热器（220）与第一散热器（120）并置。第一散热器（120）和第二散热器（220）通过第一夹紧部分（122）和第二夹紧部分（222）的接合而组合在一起，使得由风扇（300）产生的气流经过第一散热器（120）和第二散热器（220）。

4. 发明授权

US07561417B2 Thermal module and fin assembly thereof 有权
标题翻译：热模块和翅片组装
公开(公告)号：US07561417B2
公开(公告)日：2009-07-14
申请号：US11940956
申请日：2007-11-15
申请人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
发明人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
IPC分类号： H05K7/20
CPC分类号： F28D15/0233 , G06F1/203 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a centrifugal fan (10), a fin assembly (20) disposed at an air outlet of the centrifugal fan and two heat pipes (30, 40). The fin assembly includes a plurality of fins (21) connected together. Each fin has a front surface (212) and a rear surface (213) opposite the front surface. An elongated protruding member (218) is formed on the fin and protrudes from the rear surface towards the front surface. A recessed concave (219) corresponding to the protruding member is defined in the rear surface of the fin. At least one slit is defined along the protruding member and communicates with the concave. The protruding member divides the fin into first and second fin portions (20a, 20b). The two heat pipes thermally interconnect the first and second fin portions with two heat generating electronic components, respectively.
摘要翻译：热模块包括离心风扇（10），设置在离心式风扇的出风口处的翅片组件（20）和两个热管（30,40）。翅片组件包括连接在一起的多个翅片（21）。每个翅片具有与前表面相对的前表面（212）和后表面（213）。细长的突出构件（218）形成在翅片上并从后表面朝向前表面突出。对应于突出构件的凹入凹部（219）限定在翅片的后表面中。沿着突出构件限定至少一个狭缝并与凹部连通。突出部件将翅片分成第一和第二翅片部分（20a，20b）。两个热管分别用两个发热电子部件将第一和第二翅片部分互相热连接。

5. 发明授权

US07613000B2 Heat dissipation device and electronic device with the same 有权
公开(公告)号：US07613000B2
公开(公告)日：2009-11-03
申请号：US11953714
申请日：2007-12-10
申请人： Jui-Wen Hung , Ching-Bai Hwang
发明人： Jui-Wen Hung , Ching-Bai Hwang
IPC分类号： H05K7/20 , F28F7/00 , F28F13/00 , F03D11/04 , F04D29/40
CPC分类号： F04D25/0613 , F04D25/0693
摘要： A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).

6. 发明授权

US08885346B2 Electronic deviec having heat dissipation device 有权
标题翻译：具有散热装置的电子偏差
公开(公告)号：US08885346B2
公开(公告)日：2014-11-11
申请号：US13418366
申请日：2012-03-13
申请人： Shih-Yao Li , Jui-Wen Hung , Ching-Bai Hwang
发明人： Shih-Yao Li , Jui-Wen Hung , Ching-Bai Hwang
IPC分类号： H05K7/20
CPC分类号： F28F3/022 , F28D2021/0029 , F28F7/00 , F28F2255/02
摘要： An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.
摘要翻译：示例性电子设备包括印刷电路板，安装在印刷电路板的顶表面上的电子部件和散热装置。散热装置接触电子部件以吸收由电子部件产生的热量，并通过自然对流和热辐射消散热量。散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。热毛发在电子设备的内部具有加热的气流波浪，以散发从基板传递的热量。

7. 发明授权

US08109718B2 Centrifugal blower 有权
标题翻译：离心式鼓风机
公开(公告)号：US08109718B2
公开(公告)日：2012-02-07
申请号：US11840181
申请日：2007-08-16
申请人： Ching-Bai Hwang , Jui-Wen Hung
发明人： Ching-Bai Hwang , Jui-Wen Hung
IPC分类号： F04D29/58
CPC分类号： F04D25/0613 , F04D29/582 , F04D29/601 , G06F1/203
摘要： A centrifugal blower (10) includes a casing (12) and a rotor (14) rotatable disposed in the casing. The casing includes a base plate (121), a sidewall (122) extending from the base plate and a cover (123) covering the sidewall. The sidewall is a multilayer structure and includes a first section (128a) and a second section (128c). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board (20) and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.
摘要翻译：离心式鼓风机（10）包括壳体（12）和可旋转地设置在壳体中的转子（14）。壳体包括基板（121），从基板延伸的侧壁（122）和覆盖侧壁的盖（123）。侧壁是多层结构，并且包括第一部分（128a）和第二部分（128c）。转子的中心轴线（A）和第二部分的内表面之间的距离大于转子的中心轴线与第一部分的内表面之间的距离。第一部分位于母板（20）的下方，当离心鼓风机安装在母板上时，第二部分位于母板的顶面上。

8. 发明授权

US07568517B2 Thermal module 有权
标题翻译：散热模块
公开(公告)号：US07568517B2
公开(公告)日：2009-08-04
申请号：US11307619
申请日：2006-02-15
申请人： Ching-Bai Hwang , Jui-Wen Hung
发明人： Ching-Bai Hwang , Jui-Wen Hung
IPC分类号： F28F7/00
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and a fin assembly (14) mounted to an air outlet of the heat-dissipating fan. The heat pipe includes a bending portion (124). The fin assembly includes a portion (142) corresponding to the bending portion of the heat pipe. The fins of the portion of the fin assembly are arranged along an extension direction of the bending portion of the heat pipe.
摘要翻译：用于从发热电子部件（20）散热的热模块（10）包括基板（11），安装在基板的一侧的散热风扇（16），至少一个热管 12），其安装到与所述基板的一侧相对的另一侧，以及安装到所述散热风扇的空气出口的翅片组件（14）。热管包括弯曲部分（124）。翅片组件包括对应于热管的弯曲部分的部分（142）。翅片组件的部分的翅片沿着热管的弯曲部分的延伸方向布置。

9. 发明申请

US20090103264A1 Heat dissipation device and electronic device with the same 有权
标题翻译：散热装置与电子装置相同
公开(公告)号：US20090103264A1
公开(公告)日：2009-04-23
申请号：US11953714
申请日：2007-12-10
申请人： Jui-Wen Hung , Ching-Bai Hwang
发明人： Jui-Wen Hung , Ching-Bai Hwang
IPC分类号： H05K7/20
CPC分类号： F04D25/0613 , F04D25/0693
摘要： A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).
摘要翻译：散热装置包括风扇（200），第一线收集结构（280）和第二线收集结构（290）。风扇（200）包括框架（210）和布置在框架（210）中的叶轮（240）。第一线收集结构（280）形成在框架（210）上以收集风扇（200）的线（270）。第二线收集结构（290）形成在框架（210）上并且被构造用于收集风扇（200）以外的另一部件的线（460）。

10. 发明授权

US08657471B2 LED lamp 失效
标题翻译：点灯
公开(公告)号：US08657471B2
公开(公告)日：2014-02-25
申请号：US13169039
申请日：2011-06-27
申请人： Wei-Jen Huang , Jui-Wen Hung , Ching-Bai Hwang
发明人： Wei-Jen Huang , Jui-Wen Hung , Ching-Bai Hwang
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21K9/232 , F21V3/00 , F21V29/006 , F21V29/773 , F21Y2115/10
摘要： An LED lamp includes a heat sink, a heat pipe and an LED. The heat sink includes a connecting core and fins mounted around the connecting core. Each of the fins includes a plate-shaped main body and a flange extending perpendicularly from a periphery side of the main body. The flanges of the fins cooperatively form an annular planar top surface of the heat sink. The heat pipe includes a condensing section, an evaporating section parallel to and higher than the condensing section and an adiabatic section connected between the condensing section and the evaporating section. The condensing section is fixed to and thermally connects with the top surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface thereof facing outwardly.
摘要翻译： LED灯包括散热器，热管和LED。散热器包括连接芯和围绕连接芯安装的散热片。每个翅片包括板状主体和从主体的周边垂直延伸的凸缘。翅片的凸缘协同地形成散热器的环形平面顶表面。热管包括冷凝部，与冷凝部平行且高于冷凝部的蒸发部，以及连接在冷凝部和蒸发部之间的绝热部。冷凝部分与散热片的顶面固定并热连接。 LED直接安装在蒸发部分上，其发光表面面向外。

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