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1. 发明申请

US20080308307A1 TRACE STRUCTURE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：跟踪结构及其制作方法
公开(公告)号：US20080308307A1
公开(公告)日：2008-12-18
申请号：US11761381
申请日：2007-06-12
申请人： Jui-Hsien Chang , Chi-Chen Lee , Dyi-Chung Hu
发明人： Jui-Hsien Chang , Chi-Chen Lee , Dyi-Chung Hu
IPC分类号： H05K1/09 , H05K3/02
CPC分类号： H05K3/108 , H05K3/0041 , H05K3/062 , H05K3/244 , H05K2201/098 , H05K2201/2072 , H05K2203/1184 , Y10T29/49155
摘要： A trace structure with a particular profile to eliminate stress concentration and the fabricating method thereof are provided. The trace structure includes a conductive line, a seed layer, and a protection layer, wherein an upper part of the trace line is covered by the protection layer to prevent sharp edges caused by over etching in the fabrication of the conductive line. Hence, the stress concentration due to the sharp edges in the trace structure is diminished and the reliability of packaging structures or other devices applying the trace structure is assured.
摘要翻译：提供具有消除应力集中的特定特征的迹线结构及其制造方法。迹线结构包括导线，种子层和保护层，其中迹线的上部被保护层覆盖，以防止在导线的制造中由过蚀刻引起的尖锐边缘。因此，由于痕迹结构中的锋利边缘引起的应力集中减少，并且确保了包装结构或其他应用痕量结构的装置的可靠性。

2. 发明申请

US20090008729A1 IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：使用可拆卸保护膜的图像传感器包装及其制造方法
公开(公告)号：US20090008729A1
公开(公告)日：2009-01-08
申请号：US11772861
申请日：2007-07-03
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
IPC分类号： H01L31/0232 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14687 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： The present invention discloses a structure of image sensor package utilizing a removable protection film. The structure comprises a substrate with a die receiving cavity and inter-connecting through holes. Terminal pads are formed under the inter-connecting through holes and metal pads are formed on an upper surface of the substrate. A die is disposed within the die receiving cavity by an adhesion material. Bonding pads are formed on the upper edge of the die. Bonding wires are coupled to the metal pads and the bonding pads. A protection layer is formed on the micro lens area to protect the micro lens from particle contamination. A removable protection film is formed over the protection layer to protect the micro lens from water, oil, dust or temporary impact during the packaging and assembling process.
摘要翻译：本发明公开了利用可移除保护膜的图像传感器封装的结构。该结构包括具有模具接收腔和相互连接的通孔的基板。端子焊盘形成在相互连接的通孔之下，金属焊盘形成在基板的上表面上。模具通过粘合材料设置在模具容纳腔内。接合垫形成在模具的上边缘上。接合线耦合到金属焊盘和焊盘。在微透镜区域上形成保护层以保护微透镜免受颗粒污染。在保护层上形成可移除的保护膜，以在包装和组装过程中保护微透镜免受水，油，灰尘或临时冲击。

3. 发明申请

US20080116169A1 METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING 审中-公开
公开(公告)号：US20080116169A1
公开(公告)日：2008-05-22
申请号：US11837738
申请日：2007-08-13
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee
IPC分类号： C03C25/68
CPC分类号： H01L27/14618 , H01L24/03 , H01L27/14683 , H01L2224/04042 , H01L2224/85013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01094 , H01L2924/30107 , H01L2924/3025 , Y10T428/24355
摘要： The present invention provides a structure for etching process. The structure has a mask for protecting an area of a wafer from being etched and a seal ring attached under a lower surface of the mask. The mask has at least one air opening to expose an area to be etched. Furthermore, the mask is attached on the wafer through the seal ring. In addition, the present invention provides also a method to form a mask for dry etching process. First, the present invention includes a step of providing a base material and coating the masking material on both sides of the base material. The next step is to pattern the masking material to form openings. Subsequently, the base material is etched through the openings to create at least one mask opening and a mask cavity. Finally, removing the mask material is performed.

4. 发明申请

US20090166873A1 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME 审中-公开
标题翻译：半导体器件封装的连接结构及其相关方法
公开(公告)号：US20090166873A1
公开(公告)日：2009-07-02
申请号：US11965157
申请日：2007-12-27
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Mon-Chin Tsai
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Mon-Chin Tsai
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L27/14618 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/24 , H01L24/29 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/12105 , H01L2224/24137 , H01L2224/73267 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2225/1035 , H01L2225/1058 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/078 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/3512 , H01L2924/00
摘要： The interconnecting structure for a semiconductor die includes a die having bonding pads on an active surface; a core attached the side wall (edge) of the die by adhesion material; an isolating base adhered on the active surface of the die by adhesion glue; a through silicon via (TSV) open from the back side of the die to expose the bonding pads; a build up layer coupled between the bonding pads to terminal metal pads by the through silicon via; solder balls melted on terminal pads, wherein the terminal pads located on the core and/or the die.
摘要翻译：半导体管芯的互连结构包括：在有源表面上具有接合焊盘的管芯; 通过粘合材料将芯片的侧壁（边缘）附着在芯上; 通过粘合胶粘在模具的活性表面上的隔离基体; 从芯片的背面开口的通硅通孔（TSV）露出接合焊盘; 通过硅通孔将接合焊盘耦合到端子金属焊盘的堆积层; 焊球在端子焊盘上熔化，其中位于芯和/或模具上的端子焊盘。

5. 发明申请

US20080118707A1 METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING 审中-公开
标题翻译：用于干蚀刻的图案掩模的方法和结构
公开(公告)号：US20080118707A1
公开(公告)日：2008-05-22
申请号：US11562442
申请日：2006-11-22
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee
IPC分类号： B32B3/00
CPC分类号： H01L27/14618 , H01L24/03 , H01L27/14683 , H01L2224/04042 , H01L2224/85013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01094 , H01L2924/30107 , H01L2924/3025 , Y10T428/24355
摘要： The present invention provides a structure for etching process. The structure has a mask for protecting an area of a wafer from being etched and a seal ring attached under a lower surface of the mask. The mask has at least one air opening to expose an area to be etched. Furthermore, the mask is attached on the wafer through the seal ring. In addition, the present invention provides also a method to form a mask for dry etching process. First, the present invention includes a step of providing a base material and coating the masking material on both sides of the base material. The next step is to pattern the masking material to form openings. Subsequently, the base material is etched through the openings to create at least one mask opening and a mask cavity. Finally, removing the mask material is performed.
摘要翻译：本发明提供蚀刻工艺的结构。该结构具有用于保护晶片的区域不被蚀刻的掩模和附着在掩模的下表面下方的密封环。掩模具有至少一个空气开口以暴露待蚀刻的区域。此外，掩模通过密封环附着在晶片上。此外，本发明还提供一种形成干法蚀刻工艺的掩模的方法。首先，本发明包括提供基材并在基材的两侧上涂覆掩模材料的步骤。下一步是将掩模材料图案化以形成开口。随后，通过开口蚀刻基材以产生至少一个掩模开口和掩模腔。最后，执行去除掩模材料。

6. 发明申请

US20080157398A1 Semiconductor device package having pseudo chips 审中-公开
标题翻译：具有伪芯片的半导体器件封装
公开(公告)号：US20080157398A1
公开(公告)日：2008-07-03
申请号：US11819193
申请日：2007-06-26
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/06 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2221/68345 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/24 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48157 , H01L2224/48227 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/01026 , H01L2924/00012
摘要： The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first bonding pads and a second die having second bonding pads disposed within the die receiving through holes, respectively; an adhesion material formed in the gap between the first and second die and sidewalls of the die receiving though holes of the first substrate; redistribution lines formed to couple the first contact pads formed on the first substrate to the first bonding pads and the second bonding pads, respectively; and a protection layer formed on the redistribution lines, the first die, the second die and the first substrate.
摘要翻译：本发明提供了一种具有伪芯片结构的半导体器件封装，包括：第一衬底，其具有形成在其上的通孔; 具有第一接合焊盘的第一管芯和分别设置在所述管芯内的第二接合焊盘的第二管芯，形成在所述第一和第二管芯之间的间隙中的粘合材料和所述第一基板的贯穿孔的所述管芯的侧壁; 再分配线被形成为分别将形成在第一基板上的第一接触焊盘耦合到第一接合焊盘和第二接合焊盘; 以及形成在再分配线上的保护层，第一管芯，第二管芯和第一基板。

7. 发明申请

US20110312288A1 System and method for coordinating multiple radio transceivers within the same device platform 有权
标题翻译：用于协调同一设备平台内的多个无线电收发器的系统和方法
公开(公告)号：US20110312288A1
公开(公告)日：2011-12-22
申请号：US13134876
申请日：2011-06-20
申请人： I-Kang Fu , Li-Chun Ko , Chi-Chen Lee , Huanchun Ye , Hong-Kai Hsu , Willaim Plumb
发明人： I-Kang Fu , Li-Chun Ko , Chi-Chen Lee , Huanchun Ye , Hong-Kai Hsu , Willaim Plumb
IPC分类号： H04B1/40
CPC分类号： H04W36/0005 , H04B1/406 , H04B2215/068
摘要： A wireless device having a central control entity that coordinates multiple radio transceivers co-located within the same device platform to mitigate coexistence interference. The wireless device comprises an LTE transceiver, a WiFi transceiver, a BT transceiver, or a GNSS receiver. In one embodiment, the central control entity receives radio signal information from the transceivers and determines control information. The control information is used to trigger FDM solution such that the transceivers operate in designated frequency channels to mitigate co-existence interference. In another embodiment, the central control entity receives traffic and scheduling information from the transceivers and determines control information. The control information is used to trigger TDM solution such that the transceivers are scheduled for transmitting or receiving radio signals over specific time duration to mitigate co-existence interference. In yet another embodiment, power control solution is used to mitigate coexistence interference.
摘要翻译：一种具有中央控制实体的无线设备，其协调位于同一设备平台内的多个无线电收发器，以减轻共存干扰。无线设备包括LTE收发器，WiFi收发器，BT收发器或GNSS接收器。在一个实施例中，中央控制实体从收发器接收无线电信号信息并确定控制信息。控制信息用于触发FDM解决方案，使得收发器在指定的频道中工作，以减轻共存干扰。在另一个实施例中，中央控制实体从收发器接收业务和调度信息并确定控制信息。控制信息用于触发TDM解决方案，使得收发器被调度用于在特定持续时间内发射或接收无线电信号以减轻共存干扰。在另一个实施例中，功率控制解决方案用于减轻共存干扰。

8. 发明申请

US20110097998A1 System and methods for enhancing coexistence efficiency for multi-radio terminals 有权
标题翻译：提高多无线电终端共存效率的系统和方法
公开(公告)号：US20110097998A1
公开(公告)日：2011-04-28
申请号：US12925475
申请日：2010-10-22
申请人： Li-Chun Ko , Hong-Kai Hsu , I-Kang Fu , Chi-Chen Lee
发明人： Li-Chun Ko , Hong-Kai Hsu , I-Kang Fu , Chi-Chen Lee
IPC分类号： H04W72/12 , H04W88/02
CPC分类号： H04W72/04 , H04M1/7253 , H04W72/1215 , H04W88/06 , Y02D70/1262 , Y02D70/142 , Y02D70/144 , Y02D70/146
摘要： A method of scheduling transmitting and receiving communication slots for co-located radio devices is provided. A Bluetooth (BT) device first synchronizes its communication time slots with a co-located radio module, and then obtains the traffic pattern of the co-located radio module. Based on the traffic pattern, the BT device selectively skips one or more TX or RX time slots to avoid data transmission or reception in certain time slots and thereby reducing interference with the co-located radio module. In addition, the BT device generates a co-located coexistence (CLC) bitmap and transmits the CLC bitmap to its peer BT device such that the peer BT device can also skip data transmission or reception in certain time slots affected by the co-located radio module. The skipped time slots are disabled for TX or RX operation to prevent interference and to achieve more energy saving.
摘要翻译：提供了一种调度发送和接收用于同位置无线电设备的通信时隙的方法。蓝牙（BT）设备首先将其通信时隙与同位置的无线电模块同步，然后获得同位置无线电模块的业务模式。基于业务模式，BT设备有选择地跳过一个或多个TX或RX时隙，以避免某些时隙中的数据传输或接收，从而减少对共址无线电模块的干扰。此外，BT设备产生共址共存（CLC）位图，并将CLC位图发送到其对等BT设备，使得对等BT设备也可以在受共同定位的无线电影响的某些时隙中跳过数据传输或接收模块。跳过的时隙禁用TX或RX操作，以防止干扰并实现更多的节能。

9. 发明授权

US08750926B2 System and method for coordinating multiple radio transceivers within the same device platform 有权
标题翻译：用于协调同一设备平台内的多个无线电收发器的系统和方法
公开(公告)号：US08750926B2
公开(公告)日：2014-06-10
申请号：US13134876
申请日：2011-06-20
申请人： I-Kang Fu , Li-Chun Ko , Chi-Chen Lee , Huanchun Ye , Hong-Kai Hsu , Willaim Plumb
发明人： I-Kang Fu , Li-Chun Ko , Chi-Chen Lee , Huanchun Ye , Hong-Kai Hsu , Willaim Plumb
IPC分类号： H04M1/00
CPC分类号： H04W36/0005 , H04B1/406 , H04B2215/068
摘要： A wireless device having a central control entity that coordinates multiple radio transceivers co-located within the same device platform to mitigate coexistence interference. The wireless device comprises an LTE transceiver, a WiFi transceiver, a BT transceiver, or a GNSS receiver. In one embodiment, the central control entity receives radio signal information from the transceivers and determines control information. The control information is used to trigger FDM solution such that the transceivers operate in designated frequency channels to mitigate co-existence interference. In another embodiment, the central control entity receives traffic and scheduling information from the transceivers and determines control information. The control information is used to trigger TDM solution such that the transceivers are scheduled for transmitting or receiving radio signals over specific time duration to mitigate co-existence interference. In yet another embodiment, power control solution is used to mitigate coexistence interference.
摘要翻译：一种具有中央控制实体的无线设备，其协调位于同一设备平台内的多个无线电收发器，以减轻共存干扰。无线设备包括LTE收发器，WiFi收发器，BT收发器或GNSS接收器。在一个实施例中，中央控制实体从收发器接收无线电信号信息并确定控制信息。控制信息用于触发FDM解决方案，使得收发器在指定的频道中工作，以减轻共存干扰。在另一个实施例中，中央控制实体从收发器接收业务和调度信息并确定控制信息。控制信息用于触发TDM解决方案，使得收发器被调度用于在特定持续时间内发射或接收无线电信号以减轻共存干扰。在另一个实施例中，功率控制解决方案用于减轻共存干扰。

10. 发明授权

US08626067B2 System and methods for enhancing coexistence efficiency for multi-radio terminals 有权
标题翻译：提高多无线电终端共存效率的系统和方法
公开(公告)号：US08626067B2
公开(公告)日：2014-01-07
申请号：US12925475
申请日：2010-10-22
申请人： Li-Chun Ko , Hong-Kai Hsu , I-Kang Fu , Chi-Chen Lee
发明人： Li-Chun Ko , Hong-Kai Hsu , I-Kang Fu , Chi-Chen Lee
IPC分类号： H04B7/00
CPC分类号： H04W72/04 , H04M1/7253 , H04W72/1215 , H04W88/06 , Y02D70/1262 , Y02D70/142 , Y02D70/144 , Y02D70/146
摘要： A method of scheduling transmitting and receiving communication slots for co-located radio devices is provided. A Bluetooth (BT) device first synchronizes its communication time slots with a co-located radio module, and then obtains the traffic pattern of the co-located radio module. Based on the traffic pattern, the BT device selectively skips one or more TX or RX time slots to avoid data transmission or reception in certain time slots and thereby reducing interference with the co-located radio module. In addition, the BT device generates a co-located coexistence (CLC) bitmap and transmits the CLC bitmap to its peer BT device such that the peer BT device can also skip data transmission or reception in certain time slots affected by the co-located radio module. The skipped time slots are disabled for TX or RX operation to prevent interference and to achieve more energy saving.
摘要翻译：提供了一种调度发送和接收用于同位置无线电设备的通信时隙的方法。蓝牙（BT）设备首先将其通信时隙与同位置的无线电模块同步，然后获得同位置无线电模块的业务模式。基于业务模式，BT设备有选择地跳过一个或多个TX或RX时隙，以避免某些时隙中的数据传输或接收，从而减少对共址无线电模块的干扰。此外，BT设备产生共址共存（CLC）位图，并将CLC位图发送到其对等BT设备，使得对等BT设备也可以在受共同定位的无线电影响的某些时隙中跳过数据传输或接收模块。跳过的时隙禁用TX或RX操作，以防止干扰并实现更多的节能。

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