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1. 发明申请

US20050161489A1 Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale 失效
标题翻译：微粒加载的焊料预制件允许在微米，亚微米和纳米结构尺度上进行器件间隔的结合位置控制
公开(公告)号：US20050161489A1
公开(公告)日：2005-07-28
申请号：US10762901
申请日：2004-01-22
申请人： Joseph Pikulski
发明人： Joseph Pikulski
IPC分类号： B23K35/02 , B23K35/12 , H01L21/60 , H05K3/34
CPC分类号： B23K35/0244 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/292 , H01L2224/29298 , H01L2224/81136 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3011 , H05K3/3436 , H05K3/3478 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2203/041 , Y02P70/613 , H01L2224/05599
摘要： In one embodiment, a solder preform includes a solder matrix having microparticles secured with the solder matrix. The microparticles are constructed so as to be capable of arranging during a solder bonding process so as to provide a uniform separation between opposing soldered surfaces. The microparticles may be shaped to inhibit stacking of the microparticles while self arranging during the solder bonding. The solder preform may have an amount of microparticles with respect to the solder matrix to inhibit stacking of the microparticles during the solder bonding process. Microparticles may be spheres, powders, polyhedrons, crystalline particles, nanostructures, or the like, which may be capable of conducting electric current, or may be dielectric material; for example glass, plastic, metal, or semiconductor material. In one implementation microparticle loaded solder preform may be fabricated by selecting microparticles capable of self arranging within a solder alloy so as to provide a uniform separation between opposing solder surfaces during a solder bonding process, combining the microparticles with the solder alloy, and forming a solder preform having a solder matrix with the microparticles embedded therein. This may include mixing the microparticles and solder alloy by shaking, folding, stirring, pressing, or rolling. Some implementations, may include tailoring a coefficient of expansion of the solder preform by selecting and combining appropriate microparticles with the solder alloy.
摘要翻译：在一个实施例中，焊料预制件包括具有用焊料基体固定的微粒的焊料基体。微粒被构造成能够在焊接工艺期间布置，以便在相对的焊接表面之间提供均匀的间隔。该微粒可以被成形为在焊料接合期间自行布置以抑制微粒堆积。焊料预成型体可以具有相对于焊料基质的一定量的微粒，以在焊接过程中抑制微粒堆积。微粒可以是能够传导电流的球体，粉末，多面体，结晶粒子，纳米结构等，或可以是电介质材料; 例如玻璃，塑料，金属或半导体材料。在一个实现中，可以通过选择能够在焊料合金内自行布置的微粒来制造微粒负载的焊料预制件，以便在焊接接合工艺期间在相对的焊接表面之间提供均匀的间隔，将微粒与焊料合金组合，并形成焊料具有嵌入其中的微粒的焊料基体的预成型体。这可以包括通过摇动，折叠，搅拌，压制或滚动来混合微粒和焊料合金。一些实施方案可以包括通过选择合并的合适的微粒与焊料合金来调整焊料预制件的膨胀系数。

2. 发明授权

US11849822B2 Retractable umbrella frame device 有权
公开(公告)号：US11849822B2
公开(公告)日：2023-12-26
申请号：US17576693
申请日：2022-01-14
申请人： Joseph Pikulski
发明人： Joseph Pikulski
IPC分类号： A45B19/00 , A45B23/00 , A45B25/02
CPC分类号： A45B19/00 , A45B23/00 , A45B25/02 , A45B2019/002 , A45B2019/007 , A45B2019/008 , A45B2023/0006 , A45B2023/0018
摘要： Disclosed herein are retractable umbrella frame devices comprising a base body structure at least partially surrounding a central axis structure. The central axis structure can be connected to a skeletal frame structure comprising a plurality of arms having a first end connected to the central axis structure and a second free end. The plurality of arms can be moveably connected to the central axis structure, such that the arms can be retracted into or extended from the base body structure. In some embodiments, the base body structure comprises open portions along its length. In some embodiments, the retractable umbrella frame devices further comprise one or more secondary support structures at least partially surrounding the base body structure. In some embodiments, the retractable umbrella frame devices can further comprise guide structures connected to the one or more secondary support structures and the arms of the skeletal frame structure.

3. 发明授权

US10814211B2 Mobilized platforms 有权
公开(公告)号：US10814211B2
公开(公告)日：2020-10-27
申请号：US16128413
申请日：2018-09-11
申请人： Joseph Pikulski
发明人： Joseph Pikulski
IPC分类号： A63C17/12 , A63C17/01 , A63C17/26
摘要： Mobilized platforms are disclosed herein. The mobilized platforms can include a first fork hanger attached to a platform at a first platform end with a first cog-hub assembly attached thereto and a second fork hanger attached to the platform at a second platform end with a second cog-hub assembly attached thereto. The fork hangers can be attached to the cog-hub assemblies such that each fork hanger is attached to a cob-hub assembly at both a first cog-hub assembly end and a second cog- hub assembly end opposite said first cog-hub assembly end. The mobilized platforms can include additional features such as baseplates or transom plates. The cog-hub assemblies can also comprise wheel assemblies or connected cog-hub subassemblies. The mobilized platforms can also include a treading connected to the cog-hub assemblies.

4. 发明申请

US20190078348A1 RETRACTABLE UMBRELLA FRAME 审中-公开
公开(公告)号：US20190078348A1
公开(公告)日：2019-03-14
申请号：US16131733
申请日：2018-09-14
申请人： Joseph Pikulski
发明人： Joseph Pikulski
IPC分类号： E04H15/02 , E04H15/28 , A45B23/00
摘要： Disclosed herein are retractable umbrella frame devices comprising a base body structure at least partially surrounding a central axis structure. The central axis structure can be connected to a skeletal frame structure comprising a plurality of arms having a first end connected to the central axis structure and a second free end. The plurality of arms can be moveably connected to the central axis structure, such that the arms can be retracted into or extended from the base body structure. In some embodiments, the base body structure comprises open portions along its length. In some embodiments, the retractable umbrella frame devices further comprise one or more secondary support structures at least partially surrounding the base body structure. In some embodiments, the retractable umbrella frame devices can further comprise guide structures connected to the one or more secondary support structures and the arms of the skeletal frame structure.

5. 发明授权

US10888144B2 Retractable umbrella frame 有权
公开(公告)号：US10888144B2
公开(公告)日：2021-01-12
申请号：US16131733
申请日：2018-09-14
申请人： Joseph Pikulski
发明人： Joseph Pikulski
IPC分类号： A45B19/00 , A45B23/00 , A45B25/02
摘要： Disclosed herein are retractable umbrella frame devices comprising a base body structure at least partially surrounding a central axis structure. The central axis structure can be connected to a skeletal frame structure comprising a plurality of arms having a first end connected to the central axis structure and a second free end. The plurality of arms can be moveably connected to the central axis structure, such that the arms can be retracted into or extended from the base body structure. In some embodiments, the base body structure comprises open portions along its length. In some embodiments, the retractable umbrella frame devices further comprise one or more secondary support structures at least partially surrounding the base body structure. In some embodiments, the retractable umbrella frame devices can further comprise guide structures connected to the one or more secondary support structures and the arms of the skeletal frame structure.

6. 发明申请

US20070211403A1 Molded high impedance surface 审中-公开
标题翻译：模压高阻抗表面
公开(公告)号：US20070211403A1
公开(公告)日：2007-09-13
申请号：US11708970
申请日：2007-02-20
申请人： Daniel Sievenpiper , Joseph Pikulski , James Schaffner , Tsung-Yuan Hsu
发明人： Daniel Sievenpiper , Joseph Pikulski , James Schaffner , Tsung-Yuan Hsu
IPC分类号： H01G7/00
CPC分类号： H05K1/162 , H01G4/005 , H01G4/38 , H05K1/144 , H05K3/045 , H05K3/107 , H05K3/3436 , H05K3/426 , H05K2201/041 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09981 , H05K2203/0455
摘要： A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.
摘要翻译：高阻抗表面及其制造方法。该表面包括具有其中的重复图案的模制结构和侧壁表面的重复图案，该孔贯穿其第一和第二主表面之间的结构以及连接第一主表面的侧壁表面。金属层放置在所述模制结构上，金属层在孔中，覆盖第二主表面的至少一部分，覆盖第一主表面的侧壁和部分，以通过金属层将侧壁与其它侧壁互连在第二个主表面和孔中。

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