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1. 发明授权

US06813154B2 Reversible heat sink packaging assembly for an integrated circuit 有权
标题翻译：用于集成电路的可逆散热器封装组件
公开(公告)号：US06813154B2
公开(公告)日：2004-11-02
申请号：US10315702
申请日：2002-12-10
申请人： Jose Diaz , Harold M. Cook , Edmund B. Boucher
发明人： Jose Diaz , Harold M. Cook , Edmund B. Boucher
IPC分类号： H05K720
CPC分类号： H01L23/492 , H01L23/3121 , H01L23/36 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.
摘要翻译：提供了一种用于集成电路的可逆散热器封装组件（400）。包装组件（400）包括其中形成有开口（104）的芯片载体（102）和散热器（302）。散热器（302）附接到模具（304）的一侧。模具（304）装配在载体（102）的开口（104）中，其中散热器（302）邻接载体的一侧（208）并且模具被引线键合（402）连接到另一侧（108）的承运人。包装组件（400）可以朝向设备侧朝上或向下。

2. 发明授权

US07259446B2 Heat sink packaging assembly for electronic components 失效
标题翻译：电子元件散热器包装组件
公开(公告)号：US07259446B2
公开(公告)日：2007-08-21
申请号：US11213200
申请日：2005-08-25
申请人： Jose Diaz , George C. Anderson
发明人： Jose Diaz , George C. Anderson
IPC分类号： H01L23/495
CPC分类号： H01L23/24 , H01L23/13 , H01L23/36 , H01L23/50 , H01L2924/0002 , H01L2924/00
摘要： A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) with which to independently bias each die (102, 104, 106) while the heat sink (108) provides thermal dissipation for the die. Assembly (100) provides a surface mountable package well suited to multiband applications.
摘要翻译：包装组件（100）包括结合到基板（110）并通过开口（132）联接到散热器（108）的多个不同的模具（102,104,106）。匹配板（112）联接到基板（110）以提供分开的可表面安装的触点（148-158,166），以便在散热器（108）提供的每个模具（102,104,106）中独立地偏置每个模具模具的散热。 Assembly（100）提供了一个非常适合多频段应用的可表面安装的封装。

3. 发明申请

US20160114254A1 SNOWMAN MOLD DEVICE 审中-公开
标题翻译：雪人模具
公开(公告)号：US20160114254A1
公开(公告)日：2016-04-28
申请号：US14523340
申请日：2014-10-24
申请人： Jose Diaz
发明人： Jose Diaz
IPC分类号： A63H33/00
CPC分类号： A63H33/001
摘要： A snowman mold device includes a plurality of molds. Each of the molds comprises a first shell and a second shell. The second shell is removably coupled to the first shell such that each of the molds forms a substantially hollow predetermined shape. Each of the molds shapes a material into the predetermined shape. A plurality of sets of pins is provided. Each of the sets of pins engages the first shell and the second shell of an associated one of the molds so the first shell is coupled to the second shell. Each of the molds has a unique, respective size to facilitate stacking of the molds to resemble a snow man.
摘要翻译：雪人模具装置包括多个模具。每个模具包括第一壳和第二壳。第二壳体可拆卸地联接到第一壳体，使得每个模具形成基本上中空的预定形状。每个模具将材料形成为预定形状。提供多组销。这些销组中的每一个都与相关一个模具中的第一壳体和第二壳体接合，使得第一壳体联接到第二壳体。每个模具都具有独特的尺寸，便于模具堆叠以类似于雪人。

4. 发明申请

US20070045822A1 Heat sink packaging assembly for electronic components 失效
公开(公告)号：US20070045822A1
公开(公告)日：2007-03-01
申请号：US11213200
申请日：2005-08-25
申请人： Jose Diaz , George Anderson
发明人： Jose Diaz , George Anderson
IPC分类号： H01L23/34
CPC分类号： H01L23/24 , H01L23/13 , H01L23/36 , H01L23/50 , H01L2924/0002 , H01L2924/00
摘要： A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) with which to independently bias each die (102, 104, 106) while the heat sink (108) provides thermal dissipation for the die. Assembly (100) provides a surface mountable package well suited to multiband applications.

5. 发明授权

US06261664B1 Optical structures for diffusing light 失效
标题翻译：用于漫射光的光学结构
公开(公告)号：US06261664B1
公开(公告)日：2001-07-17
申请号：US09411115
申请日：1999-10-04
申请人： Karl Beeson , Scott Zimmerman , Jose Diaz , Mac Maxfield
发明人： Karl Beeson , Scott Zimmerman , Jose Diaz , Mac Maxfield
IPC分类号： B32B300
CPC分类号： G02F1/133524 , G02B5/0215 , G02B5/0231 , G02B5/0242 , G02B5/0268 , G02B5/0278 , G02B5/0289 , G02B6/1221 , G02B6/241 , G02B2006/12195 , G02F2001/133607 , G03B21/625 , Y10S428/913 , Y10S430/147 , Y10T428/24355 , Y10T428/24612 , Y10T428/24669
摘要： Optical diffusing structures can be fabricated from photopolymerizable material by directing light through a transparent or translucent substrate and then through the photopolymerizable material for a period of time sufficient to photopolymerize only a portion of the material. The resultant structure can be utilized as a diffuser, a viewing screen, and in other applications, and can be combined with other light-directing structures such as arrays of tapered optical waveguides.
摘要翻译：光学漫射结构可以由可光聚合的材料制成，通过将光引导通过透明或半透明的基底，然后通过可光聚合的材料一段时间，足以光聚合材料的一部分。所得到的结构可以用作扩散器，观察屏幕以及其它应用，并且可以与诸如锥形光波导阵列的其它导光结构组合使用。

6. 发明申请

US20050003027A1 Chemical composition and method to bind fat, enhance metabolization, and aid digestion 审中-公开
标题翻译：结合脂肪的化学成分和方法，增强代谢，帮助消化
公开(公告)号：US20050003027A1
公开(公告)日：2005-01-06
申请号：US10841259
申请日：2004-05-07
申请人： Jose Diaz , Eduardo Naranjo
发明人： Jose Diaz , Eduardo Naranjo
IPC分类号： A61K36/27 , A61K36/38 , A61K36/48 , A61K36/534 , A61K36/68 , A61K36/9068 , A61K35/78
CPC分类号： A61K36/27 , A61K36/38 , A61K36/48 , A61K36/534 , A61K36/68 , A61K36/9068 , A61K2300/00
摘要： A chemical composition and a method to inhibit fat absorption, enhance metabolization of carbohydrates, and maintain normal functioning of the digestive processes in a person's body. Specifically, the chemical composition and method are utilized to bind fat thereby limiting absorption by the body, enhance the metabolization of carbohydrates, such as sugars, to limit storage in the body, and maintain the digestive processes to facilitate elimination of unwanted fats and carbohydrates from the body. One formulation of the chemical composition includes a mixture of a fat binding fraction, which comprises between approximately 22% and 27% by weight, a metabolic enhancer fraction comprising between approximately 43% and 53% by weight, and a digestive aid fraction comprising between approximately 25% and 31% by weight of the total chemical composition. A mixture of vitamins, minerals, and other beneficial compounds are included in the chemical composition and utilized by the method.
摘要翻译：抑制脂肪吸收的化学成分和方法，增强碳水化合物的代谢，并维持人体内消化过程的正常功能。具体地，化学组成和方法用于结合脂肪，从而限制身体的吸收，增强碳水化合物（例如糖）的代谢，以限制身体的储存，并维持消化过程以便于消除不需要的脂肪和碳水化合物身体。化学组成的一种制剂包括脂肪结合级分的混合物，其包含按重量计约22％至27％的代谢增强剂级分，其包含约43％至53％重量的代谢增强剂级分，以及包含大约 25％和31％的总化学成分。维生素，矿物质和其他有益化合物的混合物包括在化学组合物中并通过该方法利用。

7. 发明授权

US06633943B1 Method and system for the simplification of leaf-limited bridges 失效
标题翻译：用于简化叶片限制桥梁的方法和系统
公开(公告)号：US06633943B1
公开(公告)日：2003-10-14
申请号：US09665388
申请日：2000-09-20
申请人： David Vernon James , Jose Diaz , Hisato Shima , Glen David Stone
发明人： David Vernon James , Jose Diaz , Hisato Shima , Glen David Stone
IPC分类号： G06F1342
CPC分类号： H04L61/2053 , H04L12/2832 , H04L12/40058 , H04L12/40065 , H04L12/40071 , H04L12/40078 , H04L12/40091 , H04L12/40117 , H04L12/462 , H04L12/4625 , H04L12/64 , H04L12/6418 , H04L29/12009 , H04L29/12018 , H04L29/12254 , H04L29/12264 , H04L29/12273 , H04L29/12283 , H04L29/12301 , H04L29/1232 , H04L29/12594 , H04L29/12801 , H04L29/12839 , H04L41/0896 , H04L41/12 , H04L45/02 , H04L45/48 , H04L61/00 , H04L61/10 , H04L61/2038 , H04L61/2046 , H04L61/2061 , H04L61/2076 , H04L61/2092 , H04L61/30 , H04L61/6004 , H04L61/6022 , H04L69/22 , H04L2012/2849
摘要： A method of address management in a net having a plurality of buses linked by a plurality of bus bridges where the net has only one branch bus with multiple bus bridges. A local identification address is assigned to each node on a branch bus and a bus number is assigned to each bus other than the branch bus. The bus number includes a common base and the local identification address for the node having a portal that connects to that bus.
摘要翻译：一种网络中的地址管理方法，其具有由多个总线桥连接的多个总线，其中网络仅具有一个具有多个总线桥的分支总线。分配总线上的每个节点分配一个本地标识地址，并将总线号分配给除了总线以外的每个总线。总线号包括一个公共基站和具有连接到该总线的门户的节点的本地标识地址。

8. 发明授权

US06286067B1 Method and system for the simplification of leaf-limited bridges 有权
标题翻译：用于简化叶片限制桥梁的方法和系统
公开(公告)号：US06286067B1
公开(公告)日：2001-09-04
申请号：US09531062
申请日：2000-03-18
申请人： David V. James , Jose Diaz , Hisato Shima , Glen Stone
发明人： David V. James , Jose Diaz , Hisato Shima , Glen Stone
IPC分类号： G06F1300
CPC分类号： H04L61/2053 , H04L12/2803 , H04L12/2832 , H04L12/40058 , H04L12/40065 , H04L12/40071 , H04L12/40078 , H04L12/40091 , H04L12/40117 , H04L12/462 , H04L12/4625 , H04L12/64 , H04L12/6418 , H04L29/12009 , H04L29/12018 , H04L29/12254 , H04L29/12264 , H04L29/12273 , H04L29/12283 , H04L29/12301 , H04L29/1232 , H04L29/12801 , H04L29/12839 , H04L41/0896 , H04L41/12 , H04L45/02 , H04L45/48 , H04L61/00 , H04L61/10 , H04L61/2038 , H04L61/2046 , H04L61/2061 , H04L61/2076 , H04L61/2092 , H04L61/6004 , H04L61/6022 , H04L69/40 , H04L2012/2849
摘要： A method of address management in a net having a plurality of buses linked by a plurality of bus bridges where the net has only one branch bus with multiple bus bridges. A local identification address is assigned to each node on a branch bus and a bus number is assigned to each bus other than the branch bus. The bus number includes a common base and the local identification address for the node having a portal that connects to that bus.
摘要翻译：一种网络中的地址管理方法，其具有由多个总线桥连接的多个总线，其中网络仅具有一个具有多个总线桥的分支总线。分配总线上的每个节点分配一个本地标识地址，并将总线号分配给除了总线以外的每个总线。总线号包括公共基站和具有连接到该总线的门户的节点的本地标识地址。

9. 发明授权

US08618683B2 Electrical generator system for capturing wind energy on a moving vehicle 有权
标题翻译：用于在移动车辆上捕获风能的发电机系统
公开(公告)号：US08618683B2
公开(公告)日：2013-12-31
申请号：US13206701
申请日：2011-08-10
申请人： Jose Diaz
发明人： Jose Diaz
IPC分类号： B60K1/00
CPC分类号： B60K16/00 , B60K6/48 , B60K2016/006 , B60W2300/125 , F03D1/04 , F03D9/00 , F03D9/11 , F03D9/25 , F03D9/32 , F05B2240/941 , Y02E10/72 , Y02T10/6221 , Y02T10/90
摘要： A system is disclosed for an electrical generator system for a vehicle. The system includes a wind turbine, an electrical generator mechanically connected to the wind turbine and configured to connect to an electrical energy storage device that is configured to store electrical energy on-board the vehicle, and a rigid, conical housing, forming an interior chamber, the housing having an inlet end and an outlet end, the inlet end having a larger diameter than the outlet end, and the conical housing configured to direct wind flow into the wind turbine.
摘要翻译：公开了一种用于车辆的发电机系统的系统。该系统包括风力涡轮机，机械地连接到风力涡轮机并且被配置为连接到被配置为在车辆上存储电能的电能存储装置的发电机，以及形成内部腔室的刚性的圆锥形壳体所述壳体具有入口端和出口端，所述入口端具有比所述出口端更大的直径，并且所述锥形壳体构造成将风流引导到所述风力涡轮机中。

10. 发明申请

US20070047210A1 Assembly for an electronic component 审中-公开
标题翻译：组装电子元件
公开(公告)号：US20070047210A1
公开(公告)日：2007-03-01
申请号：US11213196
申请日：2005-08-25
申请人： Jose Diaz
发明人： Jose Diaz
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L2924/0002 , H05K1/0243 , H05K3/3431 , H05K2201/10166 , H05K2201/10666 , H01L2924/00
摘要： An assembly (100) is provided which allows high power packaged power components (122) to operate at optimum power levels without degradation in performance. The assembly includes a heat sink (102), a printed circuit board (pcb) isolator (104) and a contact ring (106). The pcb isolator (104) provides electrical contacts (108, 128) upon which to mount the component and includes an opening (110) through which the component is soldered to the heat sink (102). The contact ring (106) is mounted to the pcb isolator (104) to form a cavity (124) within which the component (122) is contained. The assembly (100) can be coupled into a product having a chassis (320) and a product circuit board (324) such that the contact ring (106) is soldered to the product circuit board for electrical connection, and the heat sink is thermally coupled to the product chassis for heat dissipation.
摘要翻译：提供了一种组件（100），其允许高功率封装功率部件（122）在最佳功率水平下工作而不降低性能。组件包括散热器（102），印刷电路板（pcb）隔离器（104）和接触环（106）。 pcb隔离器（104）提供电触头（108,128），在其上安装部件并包括开口（110），部件通过该开口焊接到散热器（102）。接触环（106）安装到pcb隔离器（104）以形成容纳部件（122）的空腔（124）。组件（100）可以耦合到具有底架（320）和产品电路板（324）的产品中，使得接触环（106）被焊接到产品电路板用于电连接，并且散热器是热的耦合到产品底盘散热。

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